JP2026506958A - 残留厚さ補償 - Google Patents

残留厚さ補償

Info

Publication number
JP2026506958A
JP2026506958A JP2025547805A JP2025547805A JP2026506958A JP 2026506958 A JP2026506958 A JP 2026506958A JP 2025547805 A JP2025547805 A JP 2025547805A JP 2025547805 A JP2025547805 A JP 2025547805A JP 2026506958 A JP2026506958 A JP 2026506958A
Authority
JP
Japan
Prior art keywords
data
thickness value
recipe
substrate processing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025547805A
Other languages
English (en)
Japanese (ja)
Other versions
JP2026506958A5 (https=
Inventor
アルバート リウ，
ミテシュ ハーシャッド サングヴィ，
ベンカタナラヤナ シャンカラムルティ，
ユリエン ヤオ，
シンハイ ハン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2026506958A publication Critical patent/JP2026506958A/ja
Publication of JP2026506958A5 publication Critical patent/JP2026506958A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
JP2025547805A 2023-02-23 2023-10-17 残留厚さ補償 Pending JP2026506958A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18/113,342 2023-02-23
US18/113,342 US12566412B2 (en) 2023-02-23 2023-02-23 Deposition thickness drift compensation in substrate processing systems
PCT/US2023/035332 WO2024177663A1 (en) 2023-02-23 2023-10-17 Residual thickness compensation

Publications (2)

Publication Number Publication Date
JP2026506958A true JP2026506958A (ja) 2026-02-27
JP2026506958A5 JP2026506958A5 (https=) 2026-03-12

Family

ID=92460533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025547805A Pending JP2026506958A (ja) 2023-02-23 2023-10-17 残留厚さ補償

Country Status (6)

Country Link
US (1) US12566412B2 (https=)
JP (1) JP2026506958A (https=)
KR (1) KR20250150083A (https=)
CN (1) CN120752660A (https=)
TW (1) TW202449532A (https=)
WO (1) WO2024177663A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12259719B2 (en) * 2022-05-25 2025-03-25 Applied Materials, Inc. Methods and mechanisms for preventing fluctuation in machine-learning model performance
US12327714B2 (en) * 2023-05-02 2025-06-10 Applied Materials, Inc. Plasma generation quality monitoring using multi-channel sensor data

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184733A (ja) 2000-12-18 2002-06-28 Hitachi Ltd 処理方法、測定方法及び半導体装置の製造方法
US9400172B2 (en) 2011-10-26 2016-07-26 Mitsubishi Electric Corporation Film thickness measurement method
US12446771B2 (en) 2019-06-28 2025-10-21 Topcon Corporation 2D multi-layer thickness measurement
US20230086738A1 (en) 2020-01-28 2023-03-23 Tokyo Electron Limited Bonding apparatus and bonding method
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
JP7667047B2 (ja) * 2021-09-22 2025-04-22 キオクシア株式会社 ドロップレシピの作成方法、パターン形成方法、半導体装置の製造方法
US12265379B2 (en) * 2022-05-05 2025-04-01 Applied Materials, Inc. Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing

Also Published As

Publication number Publication date
WO2024177663A1 (en) 2024-08-29
CN120752660A (zh) 2025-10-03
US20240288838A1 (en) 2024-08-29
US12566412B2 (en) 2026-03-03
TW202449532A (zh) 2024-12-16
KR20250150083A (ko) 2025-10-17

Similar Documents

Publication Publication Date Title
JP7695374B2 (ja) プロセスチャンバ健康状態モニタリングおよび仮想モデルを使用した診断のためのシステムおよび方法
US12468873B2 (en) Systems and methods for predicting film thickness using virtual metrology
KR102930177B1 (ko) 가상 계측을 사용하여 개별 층들의 막 두께를 예측하기 위한 시스템들 및 방법들
JP2026506958A (ja) 残留厚さ補償
JP7717294B2 (ja) 基板製造中に膜堆積パラメータを調節するための方法および機構
CN118435338A (zh) 用于在基板制造期间调整处理腔室参数的方法及机制
JP2025540116A (ja) 基板欠陥解析
CN117378036A (zh) 利用成像计量的空间模式负载测量
KR102899057B1 (ko) 무접촉 프로세스 챔버 특성화를 위한 방법 및 메커니즘
KR20230140535A (ko) 기판 제조 동안 패턴화된 기판 속성들을 측정하기 위한 방법들 및 메커니즘들
US20240229234A1 (en) Cleaning operations based on deposition thickness
US12462369B2 (en) Method for image-based sensor trace analysis
WO2025104456A1 (en) Iterative metrology of product features
KR20260053326A (ko) 이미지 기반 센서 트레이스 분석을 위한 방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251015

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260304

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20260304