JP2024544194A - タングステン化学機械研磨スラリー - Google Patents

タングステン化学機械研磨スラリー Download PDF

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Publication number
JP2024544194A
JP2024544194A JP2024532741A JP2024532741A JP2024544194A JP 2024544194 A JP2024544194 A JP 2024544194A JP 2024532741 A JP2024532741 A JP 2024532741A JP 2024532741 A JP2024532741 A JP 2024532741A JP 2024544194 A JP2024544194 A JP 2024544194A
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JP
Japan
Prior art keywords
polishing composition
polishing
tungsten
acid
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024532741A
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English (en)
Japanese (ja)
Other versions
JP2024544194A5 (https=
Inventor
ステンダー マティアス
デレックスキー アグネス
ブレンナン ブラッドリー
Original Assignee
バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー filed Critical バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー
Publication of JP2024544194A publication Critical patent/JP2024544194A/ja
Publication of JP2024544194A5 publication Critical patent/JP2024544194A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2024532741A 2021-12-02 2022-11-29 タングステン化学機械研磨スラリー Pending JP2024544194A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163264801P 2021-12-02 2021-12-02
US63/264,801 2021-12-02
PCT/US2022/080603 WO2023102392A1 (en) 2021-12-02 2022-11-29 Tungsten chemical mechanical polishing slurries

Publications (2)

Publication Number Publication Date
JP2024544194A true JP2024544194A (ja) 2024-11-28
JP2024544194A5 JP2024544194A5 (https=) 2024-12-13

Family

ID=86613087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024532741A Pending JP2024544194A (ja) 2021-12-02 2022-11-29 タングステン化学機械研磨スラリー

Country Status (7)

Country Link
US (1) US20250019568A1 (https=)
EP (1) EP4441158A4 (https=)
JP (1) JP2024544194A (https=)
KR (1) KR20240113825A (https=)
CN (1) CN118510855A (https=)
TW (1) TW202338026A (https=)
WO (1) WO2023102392A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250107435A (ko) * 2024-01-05 2025-07-14 삼성에스디아이 주식회사 텅스텐 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐의 연마 방법
CN118422206B (zh) * 2024-04-02 2025-02-07 深圳前海榕达创途化工科技股份有限公司 一种用于铜面退锡的护铜剂以及实现尾水全循环回用的工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200714696A (en) * 2005-08-05 2007-04-16 Advanced Tech Materials High throughput chemical mechanical polishing composition for metal film planarization
CN102766407B (zh) * 2008-04-23 2016-04-27 日立化成株式会社 研磨剂及使用该研磨剂的基板研磨方法
US9303189B2 (en) * 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
US11339308B2 (en) * 2016-03-01 2022-05-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10815392B2 (en) * 2018-05-03 2020-10-27 Rohm and Haas Electronic CMP Holdings, Inc. Chemical mechanical polishing method for tungsten
US11111435B2 (en) * 2018-07-31 2021-09-07 Versum Materials Us, Llc Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
TWI785550B (zh) * 2020-03-31 2022-12-01 美商Ｃｍｃ材料股份有限公司 含新穎磨料之ｃｍｐ組合物及方法

Also Published As

Publication number Publication date
TW202338026A (zh) 2023-10-01
US20250019568A1 (en) 2025-01-16
CN118510855A (zh) 2024-08-16
EP4441158A4 (en) 2025-11-12
WO2023102392A1 (en) 2023-06-08
KR20240113825A (ko) 2024-07-23
EP4441158A1 (en) 2024-10-09

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