TW202338026A - 鎢化學機械研磨漿 - Google Patents

鎢化學機械研磨漿 Download PDF

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Publication number
TW202338026A
TW202338026A TW111145989A TW111145989A TW202338026A TW 202338026 A TW202338026 A TW 202338026A TW 111145989 A TW111145989 A TW 111145989A TW 111145989 A TW111145989 A TW 111145989A TW 202338026 A TW202338026 A TW 202338026A
Authority
TW
Taiwan
Prior art keywords
group
tungsten
acid
weight
composition
Prior art date
Application number
TW111145989A
Other languages
English (en)
Chinese (zh)
Inventor
馬帝亞斯 史坦德
艾格尼斯 德瑞斯基
布萊德雷 布雷南
Original Assignee
美商慧盛材料美國責任有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商慧盛材料美國責任有限公司 filed Critical 美商慧盛材料美國責任有限公司
Publication of TW202338026A publication Critical patent/TW202338026A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW111145989A 2021-12-02 2022-11-30 鎢化學機械研磨漿 TW202338026A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163264801P 2021-12-02 2021-12-02
US63/264,801 2021-12-02

Publications (1)

Publication Number Publication Date
TW202338026A true TW202338026A (zh) 2023-10-01

Family

ID=86613087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111145989A TW202338026A (zh) 2021-12-02 2022-11-30 鎢化學機械研磨漿

Country Status (7)

Country Link
US (1) US20250019568A1 (https=)
EP (1) EP4441158A4 (https=)
JP (1) JP2024544194A (https=)
KR (1) KR20240113825A (https=)
CN (1) CN118510855A (https=)
TW (1) TW202338026A (https=)
WO (1) WO2023102392A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250107435A (ko) * 2024-01-05 2025-07-14 삼성에스디아이 주식회사 텅스텐 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐의 연마 방법
CN118422206B (zh) * 2024-04-02 2025-02-07 深圳前海榕达创途化工科技股份有限公司 一种用于铜面退锡的护铜剂以及实现尾水全循环回用的工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200714696A (en) * 2005-08-05 2007-04-16 Advanced Tech Materials High throughput chemical mechanical polishing composition for metal film planarization
CN102766407B (zh) * 2008-04-23 2016-04-27 日立化成株式会社 研磨剂及使用该研磨剂的基板研磨方法
US9303189B2 (en) * 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
US11339308B2 (en) * 2016-03-01 2022-05-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10815392B2 (en) * 2018-05-03 2020-10-27 Rohm and Haas Electronic CMP Holdings, Inc. Chemical mechanical polishing method for tungsten
US11111435B2 (en) * 2018-07-31 2021-09-07 Versum Materials Us, Llc Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
TWI785550B (zh) * 2020-03-31 2022-12-01 美商Ｃｍｃ材料股份有限公司 含新穎磨料之ｃｍｐ組合物及方法

Also Published As

Publication number Publication date
US20250019568A1 (en) 2025-01-16
JP2024544194A (ja) 2024-11-28
CN118510855A (zh) 2024-08-16
EP4441158A4 (en) 2025-11-12
WO2023102392A1 (en) 2023-06-08
KR20240113825A (ko) 2024-07-23
EP4441158A1 (en) 2024-10-09

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