KR20240113825A - 텅스텐 화학적 기계적 연마 슬러리 - Google Patents

텅스텐 화학적 기계적 연마 슬러리 Download PDF

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Publication number
KR20240113825A
KR20240113825A KR1020247021487A KR20247021487A KR20240113825A KR 20240113825 A KR20240113825 A KR 20240113825A KR 1020247021487 A KR1020247021487 A KR 1020247021487A KR 20247021487 A KR20247021487 A KR 20247021487A KR 20240113825 A KR20240113825 A KR 20240113825A
Authority
KR
South Korea
Prior art keywords
polishing composition
weight
polishing
acid
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247021487A
Other languages
English (en)
Korean (ko)
Inventor
마티아스 스텐더
아그네스 데렉스케이
브래들리 브레넌
Original Assignee
버슘머트리얼즈 유에스, 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 버슘머트리얼즈 유에스, 엘엘씨 filed Critical 버슘머트리얼즈 유에스, 엘엘씨
Publication of KR20240113825A publication Critical patent/KR20240113825A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H01L21/3212—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020247021487A 2021-12-02 2022-11-29 텅스텐 화학적 기계적 연마 슬러리 Pending KR20240113825A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163264801P 2021-12-02 2021-12-02
US63/264,801 2021-12-02
PCT/US2022/080603 WO2023102392A1 (en) 2021-12-02 2022-11-29 Tungsten chemical mechanical polishing slurries

Publications (1)

Publication Number Publication Date
KR20240113825A true KR20240113825A (ko) 2024-07-23

Family

ID=86613087

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247021487A Pending KR20240113825A (ko) 2021-12-02 2022-11-29 텅스텐 화학적 기계적 연마 슬러리

Country Status (7)

Country Link
US (1) US20250019568A1 (https=)
EP (1) EP4441158A4 (https=)
JP (1) JP2024544194A (https=)
KR (1) KR20240113825A (https=)
CN (1) CN118510855A (https=)
TW (1) TW202338026A (https=)
WO (1) WO2023102392A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250107435A (ko) * 2024-01-05 2025-07-14 삼성에스디아이 주식회사 텅스텐 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐의 연마 방법
CN118422206B (zh) * 2024-04-02 2025-02-07 深圳前海榕达创途化工科技股份有限公司 一种用于铜面退锡的护铜剂以及实现尾水全循环回用的工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200714696A (en) * 2005-08-05 2007-04-16 Advanced Tech Materials High throughput chemical mechanical polishing composition for metal film planarization
CN102766407B (zh) * 2008-04-23 2016-04-27 日立化成株式会社 研磨剂及使用该研磨剂的基板研磨方法
US9303189B2 (en) * 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
US11339308B2 (en) * 2016-03-01 2022-05-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10815392B2 (en) * 2018-05-03 2020-10-27 Rohm and Haas Electronic CMP Holdings, Inc. Chemical mechanical polishing method for tungsten
US11111435B2 (en) * 2018-07-31 2021-09-07 Versum Materials Us, Llc Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
TWI785550B (zh) * 2020-03-31 2022-12-01 美商Ｃｍｃ材料股份有限公司 含新穎磨料之ｃｍｐ組合物及方法

Also Published As

Publication number Publication date
TW202338026A (zh) 2023-10-01
US20250019568A1 (en) 2025-01-16
JP2024544194A (ja) 2024-11-28
CN118510855A (zh) 2024-08-16
EP4441158A4 (en) 2025-11-12
WO2023102392A1 (en) 2023-06-08
EP4441158A1 (en) 2024-10-09

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