JP2024544194A5 - - Google Patents
Info
- Publication number
- JP2024544194A5 JP2024544194A5 JP2024532741A JP2024532741A JP2024544194A5 JP 2024544194 A5 JP2024544194 A5 JP 2024544194A5 JP 2024532741 A JP2024532741 A JP 2024532741A JP 2024532741 A JP2024532741 A JP 2024532741A JP 2024544194 A5 JP2024544194 A5 JP 2024544194A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- group
- acid
- weight
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163264801P | 2021-12-02 | 2021-12-02 | |
| US63/264,801 | 2021-12-02 | ||
| PCT/US2022/080603 WO2023102392A1 (en) | 2021-12-02 | 2022-11-29 | Tungsten chemical mechanical polishing slurries |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024544194A JP2024544194A (ja) | 2024-11-28 |
| JP2024544194A5 true JP2024544194A5 (https=) | 2024-12-13 |
Family
ID=86613087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024532741A Pending JP2024544194A (ja) | 2021-12-02 | 2022-11-29 | タングステン化学機械研磨スラリー |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250019568A1 (https=) |
| EP (1) | EP4441158A4 (https=) |
| JP (1) | JP2024544194A (https=) |
| KR (1) | KR20240113825A (https=) |
| CN (1) | CN118510855A (https=) |
| TW (1) | TW202338026A (https=) |
| WO (1) | WO2023102392A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250107435A (ko) * | 2024-01-05 | 2025-07-14 | 삼성에스디아이 주식회사 | 텅스텐 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐의 연마 방법 |
| CN118422206B (zh) * | 2024-04-02 | 2025-02-07 | 深圳前海榕达创途化工科技股份有限公司 | 一种用于铜面退锡的护铜剂以及实现尾水全循环回用的工艺 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200714696A (en) * | 2005-08-05 | 2007-04-16 | Advanced Tech Materials | High throughput chemical mechanical polishing composition for metal film planarization |
| CN102766407B (zh) * | 2008-04-23 | 2016-04-27 | 日立化成株式会社 | 研磨剂及使用该研磨剂的基板研磨方法 |
| US9303189B2 (en) * | 2014-03-11 | 2016-04-05 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| US11339308B2 (en) * | 2016-03-01 | 2022-05-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US10815392B2 (en) * | 2018-05-03 | 2020-10-27 | Rohm and Haas Electronic CMP Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US11111435B2 (en) * | 2018-07-31 | 2021-09-07 | Versum Materials Us, Llc | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography |
| TWI785550B (zh) * | 2020-03-31 | 2022-12-01 | 美商Ｃｍｃ材料股份有限公司 | 含新穎磨料之ｃｍｐ組合物及方法 |
-
2022
- 2022-11-29 WO PCT/US2022/080603 patent/WO2023102392A1/en not_active Ceased
- 2022-11-29 EP EP22902344.5A patent/EP4441158A4/en active Pending
- 2022-11-29 JP JP2024532741A patent/JP2024544194A/ja active Pending
- 2022-11-29 CN CN202280088361.9A patent/CN118510855A/zh active Pending
- 2022-11-29 KR KR1020247021487A patent/KR20240113825A/ko active Pending
- 2022-11-29 US US18/713,260 patent/US20250019568A1/en active Pending
- 2022-11-30 TW TW111145989A patent/TW202338026A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102680119B1 (ko) | 양이온성 계면활성제 및 시클로덱스트린을 갖는 텅스텐-가공 슬러리 | |
| KR102774705B1 (ko) | 양이온성 계면활성제를 함유하는 텅스텐-가공 슬러리 | |
| KR102253294B1 (ko) | 산화규소, 질화규소 및 폴리실리콘 물질의 cmp를 위한 조성물 및 방법 | |
| JP6231592B2 (ja) | タングステンケミカルメカニカル研磨におけるディッシング低減 | |
| CN108473849B (zh) | 具有催化剂的加工钨的浆料 | |
| KR102589681B1 (ko) | 연마용 조성물 및 연마 방법 | |
| KR102390227B1 (ko) | 텅스텐 버핑용 조성물 | |
| JP6797811B2 (ja) | 研磨方法 | |
| JP2020534679A (ja) | タングステンｃｍｐ用組成物 | |
| JP2024544194A5 (https=) | ||
| KR20080070053A (ko) | 고체에 부착되고 ｃｍｐ 제제를 향상시키기 위해 사용된자유 라디칼 형성 활성제 | |
| JP2022511525A (ja) | 金属ｃｍｐのための組成物および方法 | |
| JP6050839B2 (ja) | 表面選択性研磨組成物 | |
| CN120153037A (zh) | 包含含硫阴离子表面活性剂的钨化学机械抛光(cmp)组合物 | |
| JP2024544194A (ja) | タングステン化学機械研磨スラリー | |
| CN113969106B (zh) | 化学机械抛光浆料组合物及使用其抛光钨图案晶片的方法 | |
| JP6892035B1 (ja) | 化学機械研磨用組成物及び化学機械研磨方法 | |
| US12497540B2 (en) | Polishing composition and polishing method using the same | |
| JP2025110966A (ja) | 化学機械研磨用組成物及び研磨方法 | |
| TW202334371A (zh) | 拋光組成物及使用彼之拋光方法 |