JP2024543081A5 - - Google Patents
Info
- Publication number
- JP2024543081A5 JP2024543081A5 JP2024529232A JP2024529232A JP2024543081A5 JP 2024543081 A5 JP2024543081 A5 JP 2024543081A5 JP 2024529232 A JP2024529232 A JP 2024529232A JP 2024529232 A JP2024529232 A JP 2024529232A JP 2024543081 A5 JP2024543081 A5 JP 2024543081A5
- Authority
- JP
- Japan
- Prior art keywords
- recess
- stacked
- stack
- pad
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/455,576 | 2021-11-18 | ||
| US17/455,576 US12230552B2 (en) | 2021-11-18 | 2021-11-18 | Recess structure for padless stack via |
| PCT/US2022/078641 WO2023091846A1 (en) | 2021-11-18 | 2022-10-25 | Recess structure for padless stack via |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024543081A JP2024543081A (ja) | 2024-11-19 |
| JP2024543081A5 true JP2024543081A5 (https=) | 2025-10-27 |
Family
ID=84389276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024529232A Pending JP2024543081A (ja) | 2021-11-18 | 2022-10-25 | パッドレススタックビアのための凹部構造体 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12230552B2 (https=) |
| EP (1) | EP4434083A1 (https=) |
| JP (1) | JP2024543081A (https=) |
| KR (1) | KR20240101566A (https=) |
| CN (1) | CN118215994A (https=) |
| TW (1) | TW202339155A (https=) |
| WO (1) | WO2023091846A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12198977B2 (en) * | 2022-05-24 | 2025-01-14 | Nanya Technology Corporation | Manufacturing method of semiconductor structure having elastic member within via |
| US20250248034A1 (en) * | 2024-01-29 | 2025-07-31 | Sandisk Technologies Llc | Three-dimensional memory device with a staircase isolation ridge and methods of forming the same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6689985B2 (en) * | 2001-01-17 | 2004-02-10 | Orbotech, Ltd. | Laser drill for use in electrical circuit fabrication |
| JP2007042662A (ja) | 2003-10-20 | 2007-02-15 | Renesas Technology Corp | 半導体装置 |
| JP5014632B2 (ja) | 2006-01-13 | 2012-08-29 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
| KR101412225B1 (ko) * | 2012-08-10 | 2014-06-25 | 이비덴 가부시키가이샤 | 배선판 및 그 제조 방법 |
| US9281242B2 (en) * | 2012-10-25 | 2016-03-08 | Nanya Technology Corp. | Through silicon via stacked structure and a method of manufacturing the same |
| US9627318B2 (en) | 2014-06-16 | 2017-04-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Interconnect structure with footing region |
| US10325855B2 (en) | 2016-03-18 | 2019-06-18 | Qualcomm Incorporated | Backside drill embedded die substrate |
| KR102681797B1 (ko) | 2018-12-04 | 2024-07-03 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 그 제조 방법 |
| US11362035B2 (en) | 2020-03-10 | 2022-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Diffusion barrier layer for conductive via to decrease contact resistance |
-
2021
- 2021-11-18 US US17/455,576 patent/US12230552B2/en active Active
-
2022
- 2022-10-25 TW TW111140415A patent/TW202339155A/zh unknown
- 2022-10-25 EP EP22818155.8A patent/EP4434083A1/en active Pending
- 2022-10-25 WO PCT/US2022/078641 patent/WO2023091846A1/en not_active Ceased
- 2022-10-25 KR KR1020247014038A patent/KR20240101566A/ko active Pending
- 2022-10-25 CN CN202280074142.5A patent/CN118215994A/zh active Pending
- 2022-10-25 JP JP2024529232A patent/JP2024543081A/ja active Pending
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