JP2024536512A5 - - Google Patents

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Publication number
JP2024536512A5
JP2024536512A5 JP2024522414A JP2024522414A JP2024536512A5 JP 2024536512 A5 JP2024536512 A5 JP 2024536512A5 JP 2024522414 A JP2024522414 A JP 2024522414A JP 2024522414 A JP2024522414 A JP 2024522414A JP 2024536512 A5 JP2024536512 A5 JP 2024536512A5
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JP
Japan
Prior art keywords
composition
acid
weight
amount
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024522414A
Other languages
English (en)
Japanese (ja)
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JP2024536512A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/045845 external-priority patent/WO2023064145A1/en
Publication of JP2024536512A publication Critical patent/JP2024536512A/ja
Publication of JP2024536512A5 publication Critical patent/JP2024536512A5/ja
Pending legal-status Critical Current

Links

JP2024522414A 2021-10-12 2022-10-06 エッチング組成物 Pending JP2024536512A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163254625P 2021-10-12 2021-10-12
US63/254,625 2021-10-12
PCT/US2022/045845 WO2023064145A1 (en) 2021-10-12 2022-10-06 Etching compositions

Publications (2)

Publication Number Publication Date
JP2024536512A JP2024536512A (ja) 2024-10-04
JP2024536512A5 true JP2024536512A5 (enExample) 2025-10-15

Family

ID=85797811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024522414A Pending JP2024536512A (ja) 2021-10-12 2022-10-06 エッチング組成物

Country Status (8)

Country Link
US (1) US12074020B2 (enExample)
EP (1) EP4416233A4 (enExample)
JP (1) JP2024536512A (enExample)
KR (1) KR20240089484A (enExample)
CN (1) CN118119686A (enExample)
IL (1) IL311940A (enExample)
TW (1) TW202315928A (enExample)
WO (1) WO2023064145A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118957589B (zh) * 2024-10-18 2025-02-11 润晶(合肥)光电材料有限公司 一种银铝蚀刻液组合物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030007969A (ko) * 2000-06-16 2003-01-23 카오카부시키가이샤 세정제 조성물
US6717019B2 (en) 2002-01-30 2004-04-06 Air Products And Chemicals, Inc. Glycidyl ether-capped acetylenic diol ethoxylate surfactants
JP6110814B2 (ja) * 2013-06-04 2017-04-05 富士フイルム株式会社 エッチング液およびそのキット、これらを用いたエッチング方法、半導体基板製品の製造方法および半導体素子の製造方法
US10889757B2 (en) * 2017-10-19 2021-01-12 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
US10920144B2 (en) 2018-12-03 2021-02-16 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
JP7450334B2 (ja) 2018-12-27 2024-03-15 東京応化工業株式会社 エッチング液、及び半導体素子の製造方法
KR102880474B1 (ko) 2019-07-08 2025-11-03 바스프 에스이 실리콘-게르마늄 재료를 선택적으로 에칭하기 위한 조성물, 그의 용도 및 방법
JP7668626B2 (ja) 2019-10-04 2025-04-25 東京応化工業株式会社 エッチング液、及び半導体素子の製造方法
WO2021176903A1 (ja) * 2020-03-04 2021-09-10 富士フイルム株式会社 処理液
WO2022055814A1 (en) * 2020-09-11 2022-03-17 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
JP2025507176A (ja) * 2022-03-10 2025-03-13 フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド エッチング組成物

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