TW202315928A - 蝕刻組成物 - Google Patents

蝕刻組成物 Download PDF

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Publication number
TW202315928A
TW202315928A TW111138274A TW111138274A TW202315928A TW 202315928 A TW202315928 A TW 202315928A TW 111138274 A TW111138274 A TW 111138274A TW 111138274 A TW111138274 A TW 111138274A TW 202315928 A TW202315928 A TW 202315928A
Authority
TW
Taiwan
Prior art keywords
weight
composition
acid
amount
accounts
Prior art date
Application number
TW111138274A
Other languages
English (en)
Chinese (zh)
Inventor
米克 伯傑羅帕夫里克
卡爾 巴勒史特洛斯
Original Assignee
美商富士軟片電子材料美國股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商富士軟片電子材料美國股份有限公司 filed Critical 美商富士軟片電子材料美國股份有限公司
Publication of TW202315928A publication Critical patent/TW202315928A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/10—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a boron compound
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW111138274A 2021-10-12 2022-10-07 蝕刻組成物 TW202315928A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163254625P 2021-10-12 2021-10-12
US63/254,625 2021-10-12

Publications (1)

Publication Number Publication Date
TW202315928A true TW202315928A (zh) 2023-04-16

Family

ID=85797811

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111138274A TW202315928A (zh) 2021-10-12 2022-10-07 蝕刻組成物

Country Status (8)

Country Link
US (1) US12074020B2 (enExample)
EP (1) EP4416233A4 (enExample)
JP (1) JP2024536512A (enExample)
KR (1) KR20240089484A (enExample)
CN (1) CN118119686A (enExample)
IL (1) IL311940A (enExample)
TW (1) TW202315928A (enExample)
WO (1) WO2023064145A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118957589B (zh) * 2024-10-18 2025-02-11 润晶(合肥)光电材料有限公司 一种银铝蚀刻液组合物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030007969A (ko) * 2000-06-16 2003-01-23 카오카부시키가이샤 세정제 조성물
US6717019B2 (en) 2002-01-30 2004-04-06 Air Products And Chemicals, Inc. Glycidyl ether-capped acetylenic diol ethoxylate surfactants
JP6110814B2 (ja) * 2013-06-04 2017-04-05 富士フイルム株式会社 エッチング液およびそのキット、これらを用いたエッチング方法、半導体基板製品の製造方法および半導体素子の製造方法
US10889757B2 (en) * 2017-10-19 2021-01-12 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
US10920144B2 (en) 2018-12-03 2021-02-16 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
JP7450334B2 (ja) 2018-12-27 2024-03-15 東京応化工業株式会社 エッチング液、及び半導体素子の製造方法
KR102880474B1 (ko) 2019-07-08 2025-11-03 바스프 에스이 실리콘-게르마늄 재료를 선택적으로 에칭하기 위한 조성물, 그의 용도 및 방법
JP7668626B2 (ja) 2019-10-04 2025-04-25 東京応化工業株式会社 エッチング液、及び半導体素子の製造方法
WO2021176903A1 (ja) * 2020-03-04 2021-09-10 富士フイルム株式会社 処理液
WO2022055814A1 (en) * 2020-09-11 2022-03-17 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
JP2025507176A (ja) * 2022-03-10 2025-03-13 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド エッチング組成物

Also Published As

Publication number Publication date
US12074020B2 (en) 2024-08-27
IL311940A (en) 2024-06-01
WO2023064145A1 (en) 2023-04-20
CN118119686A (zh) 2024-05-31
US20230112795A1 (en) 2023-04-13
KR20240089484A (ko) 2024-06-20
JP2024536512A (ja) 2024-10-04
EP4416233A1 (en) 2024-08-21
EP4416233A4 (en) 2025-08-20

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