JP2024536512A - エッチング組成物 - Google Patents

エッチング組成物 Download PDF

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Publication number
JP2024536512A
JP2024536512A JP2024522414A JP2024522414A JP2024536512A JP 2024536512 A JP2024536512 A JP 2024536512A JP 2024522414 A JP2024522414 A JP 2024522414A JP 2024522414 A JP2024522414 A JP 2024522414A JP 2024536512 A JP2024536512 A JP 2024536512A
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JP
Japan
Prior art keywords
composition
acid
weight
amount
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024522414A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024536512A5 (enExample
Inventor
ブジョロパヴリック、ミック
バジェステロス、カール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Electronic Materials USA Inc
Original Assignee
Fujifilm Electronic Materials USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Electronic Materials USA Inc filed Critical Fujifilm Electronic Materials USA Inc
Publication of JP2024536512A publication Critical patent/JP2024536512A/ja
Publication of JP2024536512A5 publication Critical patent/JP2024536512A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/10—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a boron compound
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2024522414A 2021-10-12 2022-10-06 エッチング組成物 Pending JP2024536512A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163254625P 2021-10-12 2021-10-12
US63/254,625 2021-10-12
PCT/US2022/045845 WO2023064145A1 (en) 2021-10-12 2022-10-06 Etching compositions

Publications (2)

Publication Number Publication Date
JP2024536512A true JP2024536512A (ja) 2024-10-04
JP2024536512A5 JP2024536512A5 (enExample) 2025-10-15

Family

ID=85797811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024522414A Pending JP2024536512A (ja) 2021-10-12 2022-10-06 エッチング組成物

Country Status (8)

Country Link
US (1) US12074020B2 (enExample)
EP (1) EP4416233A4 (enExample)
JP (1) JP2024536512A (enExample)
KR (1) KR20240089484A (enExample)
CN (1) CN118119686A (enExample)
IL (1) IL311940A (enExample)
TW (1) TW202315928A (enExample)
WO (1) WO2023064145A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118957589B (zh) * 2024-10-18 2025-02-11 润晶(合肥)光电材料有限公司 一种银铝蚀刻液组合物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015144230A (ja) * 2013-06-04 2015-08-06 富士フイルム株式会社 エッチング液およびそのキット、これらを用いたエッチング方法、半導体基板製品の製造方法および半導体素子の製造方法
US20200172808A1 (en) * 2018-12-03 2020-06-04 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
JP2021500748A (ja) * 2017-10-19 2021-01-07 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド エッチング組成物
WO2021004759A1 (en) * 2019-07-08 2021-01-14 Basf Se Composition, its use and a process for selectively etching silicon-germanium material
JP2021061391A (ja) * 2019-10-04 2021-04-15 東京応化工業株式会社 エッチング液、及び半導体素子の製造方法
WO2021176903A1 (ja) * 2020-03-04 2021-09-10 富士フイルム株式会社 処理液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030007969A (ko) * 2000-06-16 2003-01-23 카오카부시키가이샤 세정제 조성물
US6717019B2 (en) 2002-01-30 2004-04-06 Air Products And Chemicals, Inc. Glycidyl ether-capped acetylenic diol ethoxylate surfactants
JP7450334B2 (ja) 2018-12-27 2024-03-15 東京応化工業株式会社 エッチング液、及び半導体素子の製造方法
WO2022055814A1 (en) * 2020-09-11 2022-03-17 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
JP2025507176A (ja) * 2022-03-10 2025-03-13 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド エッチング組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015144230A (ja) * 2013-06-04 2015-08-06 富士フイルム株式会社 エッチング液およびそのキット、これらを用いたエッチング方法、半導体基板製品の製造方法および半導体素子の製造方法
JP2021500748A (ja) * 2017-10-19 2021-01-07 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド エッチング組成物
US20200172808A1 (en) * 2018-12-03 2020-06-04 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
WO2021004759A1 (en) * 2019-07-08 2021-01-14 Basf Se Composition, its use and a process for selectively etching silicon-germanium material
JP2021061391A (ja) * 2019-10-04 2021-04-15 東京応化工業株式会社 エッチング液、及び半導体素子の製造方法
WO2021176903A1 (ja) * 2020-03-04 2021-09-10 富士フイルム株式会社 処理液

Also Published As

Publication number Publication date
US12074020B2 (en) 2024-08-27
IL311940A (en) 2024-06-01
TW202315928A (zh) 2023-04-16
WO2023064145A1 (en) 2023-04-20
CN118119686A (zh) 2024-05-31
US20230112795A1 (en) 2023-04-13
KR20240089484A (ko) 2024-06-20
EP4416233A1 (en) 2024-08-21
EP4416233A4 (en) 2025-08-20

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