IL311940A - Etching compounds - Google Patents
Etching compoundsInfo
- Publication number
- IL311940A IL311940A IL311940A IL31194024A IL311940A IL 311940 A IL311940 A IL 311940A IL 311940 A IL311940 A IL 311940A IL 31194024 A IL31194024 A IL 31194024A IL 311940 A IL311940 A IL 311940A
- Authority
- IL
- Israel
- Prior art keywords
- etching compositions
- etching
- compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/10—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a boron compound
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163254625P | 2021-10-12 | 2021-10-12 | |
| PCT/US2022/045845 WO2023064145A1 (en) | 2021-10-12 | 2022-10-06 | Etching compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL311940A true IL311940A (en) | 2024-06-01 |
Family
ID=85797811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL311940A IL311940A (en) | 2021-10-12 | 2022-10-06 | Etching compounds |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12074020B2 (enExample) |
| EP (1) | EP4416233A4 (enExample) |
| JP (1) | JP2024536512A (enExample) |
| KR (1) | KR20240089484A (enExample) |
| CN (1) | CN118119686A (enExample) |
| IL (1) | IL311940A (enExample) |
| TW (1) | TW202315928A (enExample) |
| WO (1) | WO2023064145A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118957589B (zh) * | 2024-10-18 | 2025-02-11 | 润晶(合肥)光电材料有限公司 | 一种银铝蚀刻液组合物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030007969A (ko) * | 2000-06-16 | 2003-01-23 | 카오카부시키가이샤 | 세정제 조성물 |
| US6717019B2 (en) | 2002-01-30 | 2004-04-06 | Air Products And Chemicals, Inc. | Glycidyl ether-capped acetylenic diol ethoxylate surfactants |
| JP6110814B2 (ja) * | 2013-06-04 | 2017-04-05 | 富士フイルム株式会社 | エッチング液およびそのキット、これらを用いたエッチング方法、半導体基板製品の製造方法および半導体素子の製造方法 |
| US10889757B2 (en) * | 2017-10-19 | 2021-01-12 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
| US10920144B2 (en) | 2018-12-03 | 2021-02-16 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
| JP7450334B2 (ja) | 2018-12-27 | 2024-03-15 | 東京応化工業株式会社 | エッチング液、及び半導体素子の製造方法 |
| KR102880474B1 (ko) | 2019-07-08 | 2025-11-03 | 바스프 에스이 | 실리콘-게르마늄 재료를 선택적으로 에칭하기 위한 조성물, 그의 용도 및 방법 |
| JP7668626B2 (ja) | 2019-10-04 | 2025-04-25 | 東京応化工業株式会社 | エッチング液、及び半導体素子の製造方法 |
| WO2021176903A1 (ja) * | 2020-03-04 | 2021-09-10 | 富士フイルム株式会社 | 処理液 |
| WO2022055814A1 (en) * | 2020-09-11 | 2022-03-17 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
| JP2025507176A (ja) * | 2022-03-10 | 2025-03-13 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | エッチング組成物 |
-
2022
- 2022-10-06 EP EP22881576.7A patent/EP4416233A4/en active Pending
- 2022-10-06 US US17/960,895 patent/US12074020B2/en active Active
- 2022-10-06 KR KR1020247015383A patent/KR20240089484A/ko active Pending
- 2022-10-06 IL IL311940A patent/IL311940A/en unknown
- 2022-10-06 WO PCT/US2022/045845 patent/WO2023064145A1/en not_active Ceased
- 2022-10-06 CN CN202280068831.5A patent/CN118119686A/zh active Pending
- 2022-10-06 JP JP2024522414A patent/JP2024536512A/ja active Pending
- 2022-10-07 TW TW111138274A patent/TW202315928A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US12074020B2 (en) | 2024-08-27 |
| TW202315928A (zh) | 2023-04-16 |
| WO2023064145A1 (en) | 2023-04-20 |
| CN118119686A (zh) | 2024-05-31 |
| US20230112795A1 (en) | 2023-04-13 |
| KR20240089484A (ko) | 2024-06-20 |
| JP2024536512A (ja) | 2024-10-04 |
| EP4416233A1 (en) | 2024-08-21 |
| EP4416233A4 (en) | 2025-08-20 |
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