JP2024520311A5 - - Google Patents
Info
- Publication number
- JP2024520311A5 JP2024520311A5 JP2023570344A JP2023570344A JP2024520311A5 JP 2024520311 A5 JP2024520311 A5 JP 2024520311A5 JP 2023570344 A JP2023570344 A JP 2023570344A JP 2023570344 A JP2023570344 A JP 2023570344A JP 2024520311 A5 JP2024520311 A5 JP 2024520311A5
- Authority
- JP
- Japan
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/303,333 US11735575B2 (en) | 2021-05-27 | 2021-05-27 | Bonding of bridge to multiple semiconductor chips |
| US17/303,333 | 2021-05-27 | ||
| PCT/IB2022/054874 WO2022249077A1 (en) | 2021-05-27 | 2022-05-25 | Bonding of bridge to multiple semiconductor chips |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2024520311A JP2024520311A (ja) | 2024-05-24 |
| JP2024520311A5 true JP2024520311A5 (https=) | 2024-07-31 |
| JPWO2022249077A5 JPWO2022249077A5 (https=) | 2024-07-31 |
| JP7789088B2 JP7789088B2 (ja) | 2025-12-19 |
Family
ID=84194293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023570344A Active JP7789088B2 (ja) | 2021-05-27 | 2022-05-25 | 複数の半導体チップへのブリッジのボンディング |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11735575B2 (https=) |
| JP (1) | JP7789088B2 (https=) |
| CN (1) | CN117397025A (https=) |
| DE (1) | DE112022001645B4 (https=) |
| GB (1) | GB2622173A (https=) |
| TW (1) | TWI824443B (https=) |
| WO (1) | WO2022249077A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11735575B2 (en) * | 2021-05-27 | 2023-08-22 | International Business Machines Corporation | Bonding of bridge to multiple semiconductor chips |
| US12300660B2 (en) * | 2022-01-27 | 2025-05-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of forming a bonded semiconductor structure |
| KR102737071B1 (ko) * | 2024-01-02 | 2024-12-03 | 엘지이노텍 주식회사 | 회로기판 및 이를 포함하는 반도체 패키지 기판 |
| CN118156222B (zh) * | 2024-05-13 | 2024-08-06 | 日月新半导体(威海)有限公司 | 一种半导体芯片的封装模块及其制备方法 |
| WO2026059959A1 (en) * | 2024-09-16 | 2026-03-19 | Kulicke And Soffa Industries, Inc. | Systems for bonding a semiconductor element to a substrate using reducing gas and related methods |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6882546B2 (en) | 2001-10-03 | 2005-04-19 | Formfactor, Inc. | Multiple die interconnect system |
| JP3872763B2 (ja) | 2003-02-26 | 2007-01-24 | 東レエンジニアリング株式会社 | ボンディング方法 |
| US7348666B2 (en) | 2004-06-30 | 2008-03-25 | Endwave Corporation | Chip-to-chip trench circuit structure |
| JP4265997B2 (ja) | 2004-07-14 | 2009-05-20 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| JP4581768B2 (ja) | 2005-03-16 | 2010-11-17 | ソニー株式会社 | 半導体装置の製造方法 |
| JP4484831B2 (ja) * | 2006-03-02 | 2010-06-16 | パナソニック株式会社 | 電子部品内蔵モジュールおよび電子部品内蔵モジュールの製造方法 |
| JP5183028B2 (ja) | 2006-03-02 | 2013-04-17 | 神港精機株式会社 | 固着材およびバンプ形成方法 |
| JP4991495B2 (ja) * | 2007-11-26 | 2012-08-01 | 東京エレクトロン株式会社 | 検査用保持部材及び検査用保持部材の製造方法 |
| US8227904B2 (en) | 2009-06-24 | 2012-07-24 | Intel Corporation | Multi-chip package and method of providing die-to-die interconnects in same |
| JP5645592B2 (ja) | 2010-10-21 | 2014-12-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| KR101740483B1 (ko) | 2011-05-02 | 2017-06-08 | 삼성전자 주식회사 | 고정 부재 및 할로겐-프리 패키지간 연결부를 포함하는 적층 패키지 |
| US9142532B2 (en) | 2012-04-24 | 2015-09-22 | Bondtech Co., Ltd. | Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer |
| WO2015023232A1 (en) | 2013-08-14 | 2015-02-19 | Orion Systems Integration Pte Ltd | Apparatus And Method For Bonding A Plurality Of Semiconductor Chips Onto A Substrate |
| US9666559B2 (en) | 2014-09-05 | 2017-05-30 | Invensas Corporation | Multichip modules and methods of fabrication |
| TWI652778B (zh) | 2016-01-27 | 2019-03-01 | Amkor Technology, Inc. | 半導體封裝以及其製造方法 |
| US10170428B2 (en) * | 2016-06-29 | 2019-01-01 | Intel Corporation | Cavity generation for embedded interconnect bridges utilizing temporary structures |
| US10483156B2 (en) * | 2017-11-29 | 2019-11-19 | International Business Machines Corporation | Non-embedded silicon bridge chip for multi-chip module |
| US10490503B2 (en) | 2018-03-27 | 2019-11-26 | Intel Corporation | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same |
| US10535608B1 (en) | 2018-07-24 | 2020-01-14 | International Business Machines Corporation | Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate |
| US10916507B2 (en) | 2018-12-04 | 2021-02-09 | International Business Machines Corporation | Multiple chip carrier for bridge assembly |
| US10833051B2 (en) | 2019-01-24 | 2020-11-10 | International Business Machines Corporation | Precision alignment of multi-chip high density interconnects |
| US10991635B2 (en) | 2019-07-20 | 2021-04-27 | International Business Machines Corporation | Multiple chip bridge connector |
| US11164817B2 (en) * | 2019-11-01 | 2021-11-02 | International Business Machines Corporation | Multi-chip package structures with discrete redistribution layers |
| US11094637B2 (en) | 2019-11-06 | 2021-08-17 | International Business Machines Corporation | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers |
| US12159840B2 (en) * | 2020-06-23 | 2024-12-03 | Intel Corporation | Scalable and interoperable PHYLESS die-to-die IO solution |
| US11735575B2 (en) * | 2021-05-27 | 2023-08-22 | International Business Machines Corporation | Bonding of bridge to multiple semiconductor chips |
-
2021
- 2021-05-27 US US17/303,333 patent/US11735575B2/en active Active
-
2022
- 2022-03-18 TW TW111109996A patent/TWI824443B/zh active
- 2022-05-25 JP JP2023570344A patent/JP7789088B2/ja active Active
- 2022-05-25 DE DE112022001645.0T patent/DE112022001645B4/de active Active
- 2022-05-25 WO PCT/IB2022/054874 patent/WO2022249077A1/en not_active Ceased
- 2022-05-25 CN CN202280037411.0A patent/CN117397025A/zh active Pending
- 2022-05-25 GB GB2318919.4A patent/GB2622173A/en active Pending
-
2023
- 2023-05-26 US US18/324,743 patent/US12142603B2/en active Active
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