GB2622173A - Bonding of bridge to multiple semiconductor chips - Google Patents

Bonding of bridge to multiple semiconductor chips Download PDF

Info

Publication number
GB2622173A
GB2622173A GB2318919.4A GB202318919A GB2622173A GB 2622173 A GB2622173 A GB 2622173A GB 202318919 A GB202318919 A GB 202318919A GB 2622173 A GB2622173 A GB 2622173A
Authority
GB
United Kingdom
Prior art keywords
chip
handler
terminals
sets
bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB2318919.4A
Other languages
English (en)
Other versions
GB202318919D0 (en
Inventor
Horibe Akihiro
Watanabe Takahito
Aoki Toyohiro
Hisada Takashi
Mori Hiroyuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB202318919D0 publication Critical patent/GB202318919D0/en
Publication of GB2622173A publication Critical patent/GB2622173A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/616—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together package substrates, interposers or redistribution layers combined with bridge chips
    • H10W70/618—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together package substrates, interposers or redistribution layers combined with bridge chips the bridge chips being embedded in the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07188—Apparatus chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB2318919.4A 2021-05-27 2022-05-25 Bonding of bridge to multiple semiconductor chips Pending GB2622173A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/303,333 US11735575B2 (en) 2021-05-27 2021-05-27 Bonding of bridge to multiple semiconductor chips
PCT/IB2022/054874 WO2022249077A1 (en) 2021-05-27 2022-05-25 Bonding of bridge to multiple semiconductor chips

Publications (2)

Publication Number Publication Date
GB202318919D0 GB202318919D0 (en) 2024-01-24
GB2622173A true GB2622173A (en) 2024-03-06

Family

ID=84194293

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2318919.4A Pending GB2622173A (en) 2021-05-27 2022-05-25 Bonding of bridge to multiple semiconductor chips

Country Status (7)

Country Link
US (2) US11735575B2 (https=)
JP (1) JP7789088B2 (https=)
CN (1) CN117397025A (https=)
DE (1) DE112022001645B4 (https=)
GB (1) GB2622173A (https=)
TW (1) TWI824443B (https=)
WO (1) WO2022249077A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11735575B2 (en) * 2021-05-27 2023-08-22 International Business Machines Corporation Bonding of bridge to multiple semiconductor chips
US12300660B2 (en) * 2022-01-27 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a bonded semiconductor structure
KR102737071B1 (ko) * 2024-01-02 2024-12-03 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지 기판
CN118156222B (zh) * 2024-05-13 2024-08-06 日月新半导体(威海)有限公司 一种半导体芯片的封装模块及其制备方法
WO2026059959A1 (en) * 2024-09-16 2026-03-19 Kulicke And Soffa Industries, Inc. Systems for bonding a semiconductor element to a substrate using reducing gas and related methods

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7348666B2 (en) * 2004-06-30 2008-03-25 Endwave Corporation Chip-to-chip trench circuit structure
CN107017238A (zh) * 2016-01-27 2017-08-04 艾马克科技公司 电子装置
CN111357102A (zh) * 2017-11-29 2020-06-30 国际商业机器公司 用于多芯片模块的非嵌入式硅桥芯片
US20210020529A1 (en) * 2019-07-20 2021-01-21 International Business Machines Corporation Multiple chip bridge connector
US20210134728A1 (en) * 2019-11-06 2021-05-06 International Business Machines Corporation Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882546B2 (en) 2001-10-03 2005-04-19 Formfactor, Inc. Multiple die interconnect system
JP3872763B2 (ja) 2003-02-26 2007-01-24 東レエンジニアリング株式会社 ボンディング方法
JP4265997B2 (ja) 2004-07-14 2009-05-20 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
JP4581768B2 (ja) 2005-03-16 2010-11-17 ソニー株式会社 半導体装置の製造方法
JP4484831B2 (ja) * 2006-03-02 2010-06-16 パナソニック株式会社 電子部品内蔵モジュールおよび電子部品内蔵モジュールの製造方法
JP5183028B2 (ja) 2006-03-02 2013-04-17 神港精機株式会社 固着材およびバンプ形成方法
JP4991495B2 (ja) * 2007-11-26 2012-08-01 東京エレクトロン株式会社 検査用保持部材及び検査用保持部材の製造方法
US8227904B2 (en) 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
JP5645592B2 (ja) 2010-10-21 2014-12-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR101740483B1 (ko) 2011-05-02 2017-06-08 삼성전자 주식회사 고정 부재 및 할로겐-프리 패키지간 연결부를 포함하는 적층 패키지
US9142532B2 (en) 2012-04-24 2015-09-22 Bondtech Co., Ltd. Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
WO2015023232A1 (en) 2013-08-14 2015-02-19 Orion Systems Integration Pte Ltd Apparatus And Method For Bonding A Plurality Of Semiconductor Chips Onto A Substrate
US9666559B2 (en) 2014-09-05 2017-05-30 Invensas Corporation Multichip modules and methods of fabrication
US10170428B2 (en) * 2016-06-29 2019-01-01 Intel Corporation Cavity generation for embedded interconnect bridges utilizing temporary structures
US10490503B2 (en) 2018-03-27 2019-11-26 Intel Corporation Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
US10535608B1 (en) 2018-07-24 2020-01-14 International Business Machines Corporation Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
US10916507B2 (en) 2018-12-04 2021-02-09 International Business Machines Corporation Multiple chip carrier for bridge assembly
US10833051B2 (en) 2019-01-24 2020-11-10 International Business Machines Corporation Precision alignment of multi-chip high density interconnects
US11164817B2 (en) * 2019-11-01 2021-11-02 International Business Machines Corporation Multi-chip package structures with discrete redistribution layers
US12159840B2 (en) * 2020-06-23 2024-12-03 Intel Corporation Scalable and interoperable PHYLESS die-to-die IO solution
US11735575B2 (en) * 2021-05-27 2023-08-22 International Business Machines Corporation Bonding of bridge to multiple semiconductor chips

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7348666B2 (en) * 2004-06-30 2008-03-25 Endwave Corporation Chip-to-chip trench circuit structure
CN107017238A (zh) * 2016-01-27 2017-08-04 艾马克科技公司 电子装置
CN111357102A (zh) * 2017-11-29 2020-06-30 国际商业机器公司 用于多芯片模块的非嵌入式硅桥芯片
US20210020529A1 (en) * 2019-07-20 2021-01-21 International Business Machines Corporation Multiple chip bridge connector
US20210134728A1 (en) * 2019-11-06 2021-05-06 International Business Machines Corporation Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers

Also Published As

Publication number Publication date
JP2024520311A (ja) 2024-05-24
DE112022001645B4 (de) 2024-06-06
US11735575B2 (en) 2023-08-22
TWI824443B (zh) 2023-12-01
US20230299067A1 (en) 2023-09-21
TW202247723A (zh) 2022-12-01
DE112022001645T5 (de) 2024-01-04
US12142603B2 (en) 2024-11-12
JP7789088B2 (ja) 2025-12-19
GB202318919D0 (en) 2024-01-24
US20220384412A1 (en) 2022-12-01
CN117397025A (zh) 2024-01-12
WO2022249077A1 (en) 2022-12-01

Similar Documents

Publication Publication Date Title
GB2622173A (en) Bonding of bridge to multiple semiconductor chips
KR102077351B1 (ko) 기판 홀더 및 한 쌍의 기판 홀더
US5528462A (en) Direct chip connection using demountable flip chip package
TWI671824B (zh) 半導體製造裝置及半導體裝置的製造方法
US8999758B2 (en) Fixing semiconductor die in dry and pressure supported assembly processes
WO2014082539A1 (zh) 贴合治具及其使用方法
WO2009128376A1 (ja) 基板貼り合わせ装置
US9870959B1 (en) Method and apparatus for testing a flip-chip assembly during manufacture
TWI803812B (zh) 磁性夾頭
KR20120128870A (ko) 솔더볼 리볼링 장치
TWI473176B (zh) 封裝體載板、半導體封裝體支撐裝置及清洗系統
CN111933756B (zh) 光伏组件的装框方法及装框系统
US20240203934A1 (en) Apparatus for bonding electronic component, method for bonding electronic component, and method for manufacturing light-emitting diode display
US5260514A (en) Wire bonder and vacuum pedestal workholder for same
CN112090687A (zh) 一种倒装互连芯片填充装置及方法
US6168971B1 (en) Method of assembling thin film jumper connectors to a substrate
KR20170099503A (ko) 반도체 자재 고정블럭, 이를 포함하는 반도체 자재 리드 부착장치 및 반도체 자재 리드 부착방법
KR101597644B1 (ko) 흡착 장치
TWI912829B (zh) 真空吸附裝置
KR102872243B1 (ko) Esd 방지를 위한 인서트 캐리어
US12532703B2 (en) Self-aligning tip
CN117260237B (zh) 一种光器件组装装置及组装方法
KR20010038101A (ko) 다공질의 흡착부를 갖는 칩 흡착 수단을 구비하는 칩 접착 장치
JP2025112971A (ja) 塗工装置
KR20220026545A (ko) 본딩 장치 및 본딩 스테이지