JP2024504187A5 - - Google Patents

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Publication number
JP2024504187A5
JP2024504187A5 JP2023545326A JP2023545326A JP2024504187A5 JP 2024504187 A5 JP2024504187 A5 JP 2024504187A5 JP 2023545326 A JP2023545326 A JP 2023545326A JP 2023545326 A JP2023545326 A JP 2023545326A JP 2024504187 A5 JP2024504187 A5 JP 2024504187A5
Authority
JP
Japan
Prior art keywords
precursors
precursor
deposition chamber
film deposition
introducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545326A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024504187A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/070347 external-priority patent/WO2022165484A1/en
Publication of JP2024504187A publication Critical patent/JP2024504187A/ja
Publication of JP2024504187A5 publication Critical patent/JP2024504187A5/ja
Pending legal-status Critical Current

Links

JP2023545326A 2021-01-27 2022-01-25 周期的堆積のための前駆体送達システム及び方法 Pending JP2024504187A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163142238P 2021-01-27 2021-01-27
US63/142,238 2021-01-27
PCT/US2022/070347 WO2022165484A1 (en) 2021-01-27 2022-01-25 Precursor delivery system and method for cyclic deposition

Publications (2)

Publication Number Publication Date
JP2024504187A JP2024504187A (ja) 2024-01-30
JP2024504187A5 true JP2024504187A5 (https=) 2025-01-08

Family

ID=82653968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545326A Pending JP2024504187A (ja) 2021-01-27 2022-01-25 周期的堆積のための前駆体送達システム及び方法

Country Status (6)

Country Link
US (2) US12325914B2 (https=)
JP (1) JP2024504187A (https=)
KR (1) KR20230133370A (https=)
CN (1) CN117098870A (https=)
TW (1) TW202237891A (https=)
WO (1) WO2022165484A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202517824A (zh) * 2023-06-29 2025-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 半導體裝置
US12404584B2 (en) * 2023-07-18 2025-09-02 Applied Materials, Inc. Parallel atomic layer deposition of target element interiors
CN116926504A (zh) * 2023-09-19 2023-10-24 上海星原驰半导体有限公司 前驱体输出装置和原子层沉积设备
WO2025188535A1 (en) * 2024-03-08 2025-09-12 Lam Research Corporation Ampoule containing solid precursor for atomic layer deposition processes

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897119B1 (en) * 1999-12-22 2005-05-24 Genus, Inc. Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition
US7628860B2 (en) * 2004-04-12 2009-12-08 Mks Instruments, Inc. Pulsed mass flow delivery system and method
US8088248B2 (en) * 2006-01-11 2012-01-03 Lam Research Corporation Gas switching section including valves having different flow coefficients for gas distribution system
KR101522725B1 (ko) * 2006-01-19 2015-05-26 에이에스엠 아메리카, 인코포레이티드 고온 원자층 증착용 인렛 매니폴드
US20090291209A1 (en) 2008-05-20 2009-11-26 Asm International N.V. Apparatus and method for high-throughput atomic layer deposition
US20100266765A1 (en) * 2009-04-21 2010-10-21 White Carl L Method and apparatus for growing a thin film onto a substrate
JP5636867B2 (ja) * 2010-10-19 2014-12-10 富士通株式会社 半導体装置及び半導体装置の製造方法
US8846443B2 (en) * 2011-08-05 2014-09-30 Intermolecular, Inc. Atomic layer deposition of metal oxides for memory applications
WO2015112467A1 (en) * 2014-01-21 2015-07-30 Applied Materials, Inc. Atomic layer deposition processing chamber permitting low-pressure tool replacement
DE112014006897T5 (de) * 2014-08-27 2017-05-11 Ultratech, Inc. Verbessertes Kontaktloch durch Silizium
KR102378021B1 (ko) 2016-05-06 2022-03-23 에이에스엠 아이피 홀딩 비.브이. SiOC 박막의 형성
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
JP2019054140A (ja) * 2017-09-15 2019-04-04 東芝メモリ株式会社 半導体製造装置
CN109778143B (zh) 2017-11-14 2021-05-07 北京北方华创微电子装备有限公司 一种沉积系统及其气体传输方法
KR102670124B1 (ko) 2018-05-03 2024-05-28 주성엔지니어링(주) 기판 처리 장치
TWI848974B (zh) 2018-09-14 2024-07-21 美商應用材料股份有限公司 用於多流前驅物配分劑量的裝置
US11087959B2 (en) 2020-01-09 2021-08-10 Nano-Master, Inc. Techniques for a hybrid design for efficient and economical plasma enhanced atomic layer deposition (PEALD) and plasma enhanced chemical vapor deposition (PECVD)
US12592364B2 (en) * 2020-08-03 2026-03-31 Applied Materials, Inc. Fluoride coating to improve chamber performance

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