JP2024507151A5 - - Google Patents

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Publication number
JP2024507151A5
JP2024507151A5 JP2023548616A JP2023548616A JP2024507151A5 JP 2024507151 A5 JP2024507151 A5 JP 2024507151A5 JP 2023548616 A JP2023548616 A JP 2023548616A JP 2023548616 A JP2023548616 A JP 2023548616A JP 2024507151 A5 JP2024507151 A5 JP 2024507151A5
Authority
JP
Japan
Prior art keywords
line portion
thin film
precursor
conductance line
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023548616A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024507151A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/070611 external-priority patent/WO2022174243A1/en
Publication of JP2024507151A publication Critical patent/JP2024507151A/ja
Publication of JP2024507151A5 publication Critical patent/JP2024507151A5/ja
Pending legal-status Critical Current

Links

JP2023548616A 2021-02-12 2022-02-10 高速周期的堆積のための前駆体送達システム及び方法 Pending JP2024507151A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163149039P 2021-02-12 2021-02-12
US63/149,039 2021-02-12
PCT/US2022/070611 WO2022174243A1 (en) 2021-02-12 2022-02-10 Precursor delivery system and method for high speed cyclic deposition

Publications (2)

Publication Number Publication Date
JP2024507151A JP2024507151A (ja) 2024-02-16
JP2024507151A5 true JP2024507151A5 (https=) 2025-02-18

Family

ID=82837287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023548616A Pending JP2024507151A (ja) 2021-02-12 2022-02-10 高速周期的堆積のための前駆体送達システム及び方法

Country Status (5)

Country Link
US (1) US20220267898A1 (https=)
JP (1) JP2024507151A (https=)
KR (1) KR20230143175A (https=)
CN (1) CN117098869A (https=)
WO (1) WO2022174243A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210262092A1 (en) * 2020-02-26 2021-08-26 Applied Materials, Inc. Sequential pulse and purge for ald processes
US12068422B2 (en) * 2021-10-08 2024-08-20 Simmonds Precision Products, Inc. Systems and methods for cooling electronics
CN118256895A (zh) * 2022-12-26 2024-06-28 中微半导体设备(上海)股份有限公司 一种化学气相沉积设备
US12404584B2 (en) * 2023-07-18 2025-09-02 Applied Materials, Inc. Parallel atomic layer deposition of target element interiors
KR102801960B1 (ko) * 2023-11-22 2025-04-30 주식회사 유진테크 기판 처리 장치
US20250391671A1 (en) * 2024-06-20 2025-12-25 Applied Materials, Inc. Reaction chamber with multi phase precursor delivery
US20260098340A1 (en) * 2024-10-07 2026-04-09 Applied Materials, Inc. Precursor delivery system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897119B1 (en) * 1999-12-22 2005-05-24 Genus, Inc. Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition
US6660662B2 (en) * 2001-01-26 2003-12-09 Applied Materials, Inc. Method of reducing plasma charge damage for plasma processes
CN1894526A (zh) * 2003-10-17 2007-01-10 松德沃技术公司 故障保险气动致动阀
US20050147749A1 (en) * 2004-01-05 2005-07-07 Msp Corporation High-performance vaporizer for liquid-precursor and multi-liquid-precursor vaporization in semiconductor thin film deposition
US8211231B2 (en) * 2007-09-26 2012-07-03 Eastman Kodak Company Delivery device for deposition
JP2011166167A (ja) * 2011-05-16 2011-08-25 Hitachi High-Technologies Corp プラズマエッチング装置およびプラズマエッチング方法
JP5755958B2 (ja) * 2011-07-08 2015-07-29 株式会社フジキン 半導体製造装置の原料ガス供給装置
US10214817B2 (en) * 2013-10-16 2019-02-26 The Board Of Trustees Of The University Of Illinois Multi-metal films, alternating film multilayers, formation methods and deposition system
JP7033882B2 (ja) * 2017-05-01 2022-03-11 東京エレクトロン株式会社 成膜方法および成膜装置
KR102065243B1 (ko) * 2017-05-01 2020-01-10 도쿄엘렉트론가부시키가이샤 성막 방법 및 성막 장치
US10927459B2 (en) * 2017-10-16 2021-02-23 Asm Ip Holding B.V. Systems and methods for atomic layer deposition
TWI821363B (zh) * 2018-08-31 2023-11-11 美商應用材料股份有限公司 前驅物遞送系統
CN111549333B (zh) * 2020-04-27 2021-11-02 长江存储科技有限责任公司 薄膜沉积装置及3d存储器件的制造方法

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