JP2024503422A - 波状チャネルを備えたmosfetデバイス - Google Patents
波状チャネルを備えたmosfetデバイス Download PDFInfo
- Publication number
- JP2024503422A JP2024503422A JP2023542472A JP2023542472A JP2024503422A JP 2024503422 A JP2024503422 A JP 2024503422A JP 2023542472 A JP2023542472 A JP 2023542472A JP 2023542472 A JP2023542472 A JP 2023542472A JP 2024503422 A JP2024503422 A JP 2024503422A
- Authority
- JP
- Japan
- Prior art keywords
- region
- jfet
- channel region
- channel
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/662—Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/159—Shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
- H10D62/299—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
- H10D62/307—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations the doping variations being parallel to the channel lengths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/393—Body regions of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
Landscapes
- Junction Field-Effect Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/248,160 | 2021-01-12 | ||
| US17/248,160 US11658214B2 (en) | 2021-01-12 | 2021-01-12 | MOSFET device with undulating channel |
| PCT/US2022/070083 WO2022155630A1 (en) | 2021-01-12 | 2022-01-07 | Mosfet device with undulating channel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024503422A true JP2024503422A (ja) | 2024-01-25 |
| JP2024503422A5 JP2024503422A5 (https=) | 2025-01-16 |
Family
ID=80445790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542472A Pending JP2024503422A (ja) | 2021-01-12 | 2022-01-07 | 波状チャネルを備えたmosfetデバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11658214B2 (https=) |
| EP (1) | EP4252284A1 (https=) |
| JP (1) | JP2024503422A (https=) |
| KR (1) | KR20230128022A (https=) |
| CN (1) | CN116848640A (https=) |
| TW (1) | TW202316675A (https=) |
| WO (1) | WO2022155630A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12598781B2 (en) * | 2023-02-08 | 2026-04-07 | Ge Aviation Systems Llc | Semiconductor switching device |
| CN116504841B (zh) * | 2023-06-27 | 2023-10-03 | 无锡新洁能股份有限公司 | 一种高可靠性碳化硅mosfet器件及其形成方法 |
| WO2025064118A2 (en) * | 2023-08-17 | 2025-03-27 | The Regents Of The University Of California | Linear nitrogen-polar deep-recess gan mishemts through corrugation |
| CN117690951A (zh) * | 2023-12-19 | 2024-03-12 | 湖北九峰山实验室 | 一种宽禁带半导体平面mosfet器件结构及其制作方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211020A (ja) * | 2010-03-30 | 2011-10-20 | Rohm Co Ltd | 半導体装置 |
| JP2012160584A (ja) * | 2011-02-01 | 2012-08-23 | Sumitomo Electric Ind Ltd | 半導体装置 |
| JP2015084444A (ja) * | 2014-12-24 | 2015-04-30 | 株式会社東芝 | 半導体装置 |
| WO2016013182A1 (ja) * | 2014-07-24 | 2016-01-28 | パナソニックIpマネジメント株式会社 | 炭化珪素半導体素子およびその製造方法 |
| US20160181365A1 (en) * | 2014-12-19 | 2016-06-23 | General Electric Company | Semiconductor devices having channel regions with non-uniform edge |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5844277A (en) | 1996-02-20 | 1998-12-01 | Magepower Semiconductor Corp. | Power MOSFETs and cell topology |
| JP4627272B2 (ja) | 2006-03-09 | 2011-02-09 | 三菱電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| US20100213517A1 (en) | 2007-10-19 | 2010-08-26 | Nxp B.V. | High voltage semiconductor device |
| US8754469B2 (en) | 2010-10-26 | 2014-06-17 | Texas Instruments Incorporated | Hybrid active-field gap extended drain MOS transistor |
| KR102417367B1 (ko) | 2017-12-14 | 2022-07-05 | 현대자동차 주식회사 | 반도체 소자 |
| US10950695B1 (en) * | 2019-11-05 | 2021-03-16 | Semiq Incorporated | Silicon carbide planar MOSFET with wave-shaped channel regions |
-
2021
- 2021-01-12 US US17/248,160 patent/US11658214B2/en active Active
-
2022
- 2022-01-07 EP EP22703530.0A patent/EP4252284A1/en active Pending
- 2022-01-07 JP JP2023542472A patent/JP2024503422A/ja active Pending
- 2022-01-07 KR KR1020237023429A patent/KR20230128022A/ko not_active Ceased
- 2022-01-07 WO PCT/US2022/070083 patent/WO2022155630A1/en not_active Ceased
- 2022-01-07 CN CN202280014999.8A patent/CN116848640A/zh active Pending
- 2022-01-11 TW TW111101054A patent/TW202316675A/zh unknown
-
2023
- 2023-04-14 US US18/301,146 patent/US12125884B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211020A (ja) * | 2010-03-30 | 2011-10-20 | Rohm Co Ltd | 半導体装置 |
| JP2012160584A (ja) * | 2011-02-01 | 2012-08-23 | Sumitomo Electric Ind Ltd | 半導体装置 |
| WO2016013182A1 (ja) * | 2014-07-24 | 2016-01-28 | パナソニックIpマネジメント株式会社 | 炭化珪素半導体素子およびその製造方法 |
| US20160181365A1 (en) * | 2014-12-19 | 2016-06-23 | General Electric Company | Semiconductor devices having channel regions with non-uniform edge |
| JP2015084444A (ja) * | 2014-12-24 | 2015-04-30 | 株式会社東芝 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230128022A (ko) | 2023-09-01 |
| CN116848640A (zh) | 2023-10-03 |
| EP4252284A1 (en) | 2023-10-04 |
| US12125884B2 (en) | 2024-10-22 |
| US20220223691A1 (en) | 2022-07-14 |
| US11658214B2 (en) | 2023-05-23 |
| WO2022155630A1 (en) | 2022-07-21 |
| TW202316675A (zh) | 2023-04-16 |
| US20230253460A1 (en) | 2023-08-10 |
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