JP2024503422A - 波状チャネルを備えたmosfetデバイス - Google Patents

波状チャネルを備えたmosfetデバイス Download PDF

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Publication number
JP2024503422A
JP2024503422A JP2023542472A JP2023542472A JP2024503422A JP 2024503422 A JP2024503422 A JP 2024503422A JP 2023542472 A JP2023542472 A JP 2023542472A JP 2023542472 A JP2023542472 A JP 2023542472A JP 2024503422 A JP2024503422 A JP 2024503422A
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region
jfet
channel region
channel
width
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Pending
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JP2023542472A
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Japanese (ja)
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JP2024503422A5 (https=
Inventor
ケヴィン チョ,
ボンヨン リー,
キョンソク パク,
ドゥジン チェ,
トーマス ナイヤー,
キミン キム,
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Semiconductor Components Industries LLC
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Semiconductor Components Industries LLC
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Publication of JP2024503422A publication Critical patent/JP2024503422A/ja
Publication of JP2024503422A5 publication Critical patent/JP2024503422A5/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/662Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/159Shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • H10D62/299Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
    • H10D62/307Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations the doping variations being parallel to the channel lengths
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
JP2023542472A 2021-01-12 2022-01-07 波状チャネルを備えたmosfetデバイス Pending JP2024503422A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/248,160 2021-01-12
US17/248,160 US11658214B2 (en) 2021-01-12 2021-01-12 MOSFET device with undulating channel
PCT/US2022/070083 WO2022155630A1 (en) 2021-01-12 2022-01-07 Mosfet device with undulating channel

Publications (2)

Publication Number Publication Date
JP2024503422A true JP2024503422A (ja) 2024-01-25
JP2024503422A5 JP2024503422A5 (https=) 2025-01-16

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Application Number Title Priority Date Filing Date
JP2023542472A Pending JP2024503422A (ja) 2021-01-12 2022-01-07 波状チャネルを備えたmosfetデバイス

Country Status (7)

Country Link
US (2) US11658214B2 (https=)
EP (1) EP4252284A1 (https=)
JP (1) JP2024503422A (https=)
KR (1) KR20230128022A (https=)
CN (1) CN116848640A (https=)
TW (1) TW202316675A (https=)
WO (1) WO2022155630A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12598781B2 (en) * 2023-02-08 2026-04-07 Ge Aviation Systems Llc Semiconductor switching device
CN116504841B (zh) * 2023-06-27 2023-10-03 无锡新洁能股份有限公司 一种高可靠性碳化硅mosfet器件及其形成方法
WO2025064118A2 (en) * 2023-08-17 2025-03-27 The Regents Of The University Of California Linear nitrogen-polar deep-recess gan mishemts through corrugation
CN117690951A (zh) * 2023-12-19 2024-03-12 湖北九峰山实验室 一种宽禁带半导体平面mosfet器件结构及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011211020A (ja) * 2010-03-30 2011-10-20 Rohm Co Ltd 半導体装置
JP2012160584A (ja) * 2011-02-01 2012-08-23 Sumitomo Electric Ind Ltd 半導体装置
JP2015084444A (ja) * 2014-12-24 2015-04-30 株式会社東芝 半導体装置
WO2016013182A1 (ja) * 2014-07-24 2016-01-28 パナソニックIpマネジメント株式会社 炭化珪素半導体素子およびその製造方法
US20160181365A1 (en) * 2014-12-19 2016-06-23 General Electric Company Semiconductor devices having channel regions with non-uniform edge

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5844277A (en) 1996-02-20 1998-12-01 Magepower Semiconductor Corp. Power MOSFETs and cell topology
JP4627272B2 (ja) 2006-03-09 2011-02-09 三菱電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
US20100213517A1 (en) 2007-10-19 2010-08-26 Nxp B.V. High voltage semiconductor device
US8754469B2 (en) 2010-10-26 2014-06-17 Texas Instruments Incorporated Hybrid active-field gap extended drain MOS transistor
KR102417367B1 (ko) 2017-12-14 2022-07-05 현대자동차 주식회사 반도체 소자
US10950695B1 (en) * 2019-11-05 2021-03-16 Semiq Incorporated Silicon carbide planar MOSFET with wave-shaped channel regions

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011211020A (ja) * 2010-03-30 2011-10-20 Rohm Co Ltd 半導体装置
JP2012160584A (ja) * 2011-02-01 2012-08-23 Sumitomo Electric Ind Ltd 半導体装置
WO2016013182A1 (ja) * 2014-07-24 2016-01-28 パナソニックIpマネジメント株式会社 炭化珪素半導体素子およびその製造方法
US20160181365A1 (en) * 2014-12-19 2016-06-23 General Electric Company Semiconductor devices having channel regions with non-uniform edge
JP2015084444A (ja) * 2014-12-24 2015-04-30 株式会社東芝 半導体装置

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Publication number Publication date
KR20230128022A (ko) 2023-09-01
CN116848640A (zh) 2023-10-03
EP4252284A1 (en) 2023-10-04
US12125884B2 (en) 2024-10-22
US20220223691A1 (en) 2022-07-14
US11658214B2 (en) 2023-05-23
WO2022155630A1 (en) 2022-07-21
TW202316675A (zh) 2023-04-16
US20230253460A1 (en) 2023-08-10

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