JP2024144537A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2024144537A5 JP2024144537A5 JP2024118015A JP2024118015A JP2024144537A5 JP 2024144537 A5 JP2024144537 A5 JP 2024144537A5 JP 2024118015 A JP2024118015 A JP 2024118015A JP 2024118015 A JP2024118015 A JP 2024118015A JP 2024144537 A5 JP2024144537 A5 JP 2024144537A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- composition according
- molding resin
- benzene ring
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 14
- 239000011342 resin composition Substances 0.000 claims 14
- 239000003822 epoxy resin Substances 0.000 claims 10
- 239000002245 particle Substances 0.000 claims 10
- 229920000647 polyepoxide Polymers 0.000 claims 10
- 125000000217 alkyl group Chemical group 0.000 claims 9
- 125000004432 carbon atom Chemical group C* 0.000 claims 9
- 239000011256 inorganic filler Substances 0.000 claims 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims 9
- 150000002790 naphthalenes Chemical group 0.000 claims 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 9
- -1 ester compound Chemical class 0.000 claims 8
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 4
- 150000001555 benzenes Chemical group 0.000 claims 3
- 125000006267 biphenyl group Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- 125000001624 naphthyl group Chemical group 0.000 claims 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 2
- 239000004305 biphenyl Substances 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020206029 | 2020-12-11 | ||
| JP2020206029 | 2020-12-11 | ||
| PCT/JP2021/045637 WO2022124406A1 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
| JP2022568353A JP7609173B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568353A Division JP7609173B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024144537A JP2024144537A (ja) | 2024-10-11 |
| JP2024144537A5 true JP2024144537A5 (enExample) | 2025-01-09 |
Family
ID=81974588
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568353A Active JP7609173B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
| JP2024118015A Pending JP2024144537A (ja) | 2020-12-11 | 2024-07-23 | 成形用樹脂組成物及び電子部品装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568353A Active JP7609173B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240026118A1 (enExample) |
| JP (2) | JP7609173B2 (enExample) |
| KR (1) | KR20230118100A (enExample) |
| CN (1) | CN116583548A (enExample) |
| TW (1) | TW202222888A (enExample) |
| WO (1) | WO2022124406A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119677792A (zh) * | 2022-11-22 | 2025-03-21 | 株式会社力森诺科 | 成形用树脂组合物及电子零件装置 |
| WO2025249327A1 (ja) * | 2024-05-27 | 2025-12-04 | 株式会社レゾナック | 液状硬化性組成物及び電子部品装置 |
| KR102789700B1 (ko) | 2024-11-19 | 2025-04-03 | 주식회사 티에스아이코리아 | 이차전지 검사 장치 및 검사 방법 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080028679A (ko) * | 2006-09-27 | 2008-04-01 | 삼성전자주식회사 | 인쇄회로기판 및 이를 갖는 표시장치 |
| JP2011021166A (ja) * | 2009-07-21 | 2011-02-03 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
| JP2012216685A (ja) * | 2011-03-31 | 2012-11-08 | Nippon Zeon Co Ltd | 多層基板 |
| KR101454111B1 (ko) * | 2013-04-17 | 2014-10-22 | 삼성전기주식회사 | 열팽창율 및 유전손실율이 낮은 인쇄회로기판용 절연수지 조성물, 이를 이용한 프리프레그 및 인쇄회로기판 |
| CN103351578B (zh) * | 2013-07-19 | 2015-08-19 | 广东生益科技股份有限公司 | 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途 |
| JP6066865B2 (ja) | 2013-08-15 | 2017-01-25 | 信越化学工業株式会社 | 高誘電率エポキシ樹脂組成物および半導体装置 |
| CN104744892A (zh) * | 2013-12-27 | 2015-07-01 | 台燿科技股份有限公司 | 树脂组合物及其应用 |
| JP6679849B2 (ja) * | 2015-07-01 | 2020-04-15 | 味の素株式会社 | 樹脂組成物 |
| JP6519424B2 (ja) | 2015-09-16 | 2019-05-29 | 住友ベークライト株式会社 | 高誘電樹脂組成物 |
| JP6832193B2 (ja) | 2017-02-27 | 2021-02-24 | 京セラ株式会社 | 樹脂組成物および樹脂封止型半導体装置 |
| JPWO2020066856A1 (ja) * | 2018-09-27 | 2021-09-02 | 昭和電工マテリアルズ株式会社 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
| JP7115568B2 (ja) * | 2019-01-23 | 2022-08-09 | 株式会社村田製作所 | アンテナモジュール及び通信装置 |
-
2021
- 2021-12-10 WO PCT/JP2021/045637 patent/WO2022124406A1/ja not_active Ceased
- 2021-12-10 KR KR1020237019296A patent/KR20230118100A/ko active Pending
- 2021-12-10 JP JP2022568353A patent/JP7609173B2/ja active Active
- 2021-12-10 US US18/265,971 patent/US20240026118A1/en active Pending
- 2021-12-10 CN CN202180083043.9A patent/CN116583548A/zh active Pending
- 2021-12-13 TW TW110146623A patent/TW202222888A/zh unknown
-
2024
- 2024-07-23 JP JP2024118015A patent/JP2024144537A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2024144537A5 (enExample) | ||
| JP2024096290A5 (enExample) | ||
| JPH0790052A (ja) | エポキシ樹脂組成物 | |
| JP2023087627A5 (enExample) | ||
| JP2003073453A (ja) | 液状エポキシ樹脂組成物及びエポキシ樹脂硬化物 | |
| US20180022897A1 (en) | Insulating Tapes For A Coil And Wrapping Tape Insulation Systems For Electric Machines | |
| JP2003012763A5 (enExample) | ||
| JPWO2022124396A5 (enExample) | ||
| CN105131881B (zh) | 一种低固含量的中常温快速固化的导电银胶 | |
| KR20110115635A (ko) | 저온 경화용 에폭시 도료 희석제 및 그 제조방법 | |
| JPWO2022124406A5 (enExample) | ||
| JP6963565B2 (ja) | アルケニル基含有樹脂、硬化性樹脂組成物およびその硬化物 | |
| WO2014036711A1 (zh) | 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 | |
| CN103555246A (zh) | 用于电子元器件一体成型技术的环氧胶黏剂及其制备方法 | |
| JP4843256B2 (ja) | 硬化促進剤 | |
| Ogura et al. | Multi-functional epoxy resins performing high thermal resistance with good flow-ability based on dimeric naphthols | |
| JP2017145345A (ja) | 熱硬化性樹脂組成物、その製造方法および用途 | |
| JP5725826B2 (ja) | エポキシ樹脂組成物、プリプレグおよびそれらの硬化物 | |
| CN110431640B (zh) | 用于电机的缠绕带绝缘体系、其用途和电机 | |
| JPH0436175B2 (enExample) | ||
| JP3350975B2 (ja) | 液状エポキシ樹脂組成物 | |
| JPWO2022102489A5 (enExample) | ||
| CN112080104B (zh) | 一种潜固化剂在单组份环氧树脂密封材料中的应用 | |
| JPH10324733A (ja) | エポキシ樹脂組成物、エポキシ樹脂の製造方法及び半導体封止材料 | |
| JPWO2022118723A5 (enExample) |