JP7609173B2 - 成形用樹脂組成物及び電子部品装置 - Google Patents

成形用樹脂組成物及び電子部品装置 Download PDF

Info

Publication number
JP7609173B2
JP7609173B2 JP2022568353A JP2022568353A JP7609173B2 JP 7609173 B2 JP7609173 B2 JP 7609173B2 JP 2022568353 A JP2022568353 A JP 2022568353A JP 2022568353 A JP2022568353 A JP 2022568353A JP 7609173 B2 JP7609173 B2 JP 7609173B2
Authority
JP
Japan
Prior art keywords
resin composition
molding resin
inorganic filler
volume
titanate particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022568353A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022124406A1 (enExample
JPWO2022124406A5 (enExample
Inventor
格 山浦
道俊 荒田
亜裕美 中山
裕介 近藤
祐司 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2022124406A1 publication Critical patent/JPWO2022124406A1/ja
Publication of JPWO2022124406A5 publication Critical patent/JPWO2022124406A5/ja
Priority to JP2024118015A priority Critical patent/JP2024144537A/ja
Application granted granted Critical
Publication of JP7609173B2 publication Critical patent/JP7609173B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP2022568353A 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置 Active JP7609173B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024118015A JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020206029 2020-12-11
JP2020206029 2020-12-11
PCT/JP2021/045637 WO2022124406A1 (ja) 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024118015A Division JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JPWO2022124406A1 JPWO2022124406A1 (enExample) 2022-06-16
JPWO2022124406A5 JPWO2022124406A5 (enExample) 2024-02-15
JP7609173B2 true JP7609173B2 (ja) 2025-01-07

Family

ID=81974588

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022568353A Active JP7609173B2 (ja) 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置
JP2024118015A Pending JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024118015A Pending JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Country Status (6)

Country Link
US (1) US20240026118A1 (enExample)
JP (2) JP7609173B2 (enExample)
KR (1) KR20230118100A (enExample)
CN (1) CN116583548A (enExample)
TW (1) TW202222888A (enExample)
WO (1) WO2022124406A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024111575A1 (ja) * 2022-11-22 2024-05-30 株式会社レゾナック 成形用樹脂組成物及び電子部品装置
WO2025249327A1 (ja) * 2024-05-27 2025-12-04 株式会社レゾナック 液状硬化性組成物及び電子部品装置
KR102789700B1 (ko) 2024-11-19 2025-04-03 주식회사 티에스아이코리아 이차전지 검사 장치 및 검사 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011021166A (ja) 2009-07-21 2011-02-03 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2012216685A (ja) 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 多層基板
CN103351578A (zh) 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
JP2015036410A (ja) 2013-08-15 2015-02-23 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
US20150183952A1 (en) 2013-12-27 2015-07-02 Taiwan Union Technology Corporation Resin composition and uses of the same
JP2017014406A (ja) 2015-07-01 2017-01-19 味の素株式会社 樹脂組成物
WO2020066856A1 (ja) 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2020153068A1 (ja) 2019-01-23 2020-07-30 株式会社村田製作所 アンテナモジュール及び通信装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080028679A (ko) * 2006-09-27 2008-04-01 삼성전자주식회사 인쇄회로기판 및 이를 갖는 표시장치
KR101454111B1 (ko) * 2013-04-17 2014-10-22 삼성전기주식회사 열팽창율 및 유전손실율이 낮은 인쇄회로기판용 절연수지 조성물, 이를 이용한 프리프레그 및 인쇄회로기판
JP6519424B2 (ja) 2015-09-16 2019-05-29 住友ベークライト株式会社 高誘電樹脂組成物
JP6832193B2 (ja) 2017-02-27 2021-02-24 京セラ株式会社 樹脂組成物および樹脂封止型半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011021166A (ja) 2009-07-21 2011-02-03 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2012216685A (ja) 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 多層基板
CN103351578A (zh) 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
JP2015036410A (ja) 2013-08-15 2015-02-23 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
US20150183952A1 (en) 2013-12-27 2015-07-02 Taiwan Union Technology Corporation Resin composition and uses of the same
JP2017014406A (ja) 2015-07-01 2017-01-19 味の素株式会社 樹脂組成物
WO2020066856A1 (ja) 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2020153068A1 (ja) 2019-01-23 2020-07-30 株式会社村田製作所 アンテナモジュール及び通信装置

Also Published As

Publication number Publication date
CN116583548A (zh) 2023-08-11
KR20230118100A (ko) 2023-08-10
JPWO2022124406A1 (enExample) 2022-06-16
TW202222888A (zh) 2022-06-16
WO2022124406A1 (ja) 2022-06-16
JP2024144537A (ja) 2024-10-11
US20240026118A1 (en) 2024-01-25

Similar Documents

Publication Publication Date Title
JP7651926B2 (ja) 成形用樹脂組成物及び電子部品装置
JP7388160B2 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7609173B2 (ja) 成形用樹脂組成物及び電子部品装置
JP2024091744A (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7613077B2 (ja) 樹脂組成物及び高周波デバイス
JP7501818B2 (ja) 成形用樹脂組成物及び電子部品装置
JP7635709B2 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7505661B2 (ja) 成形用樹脂組成物及び電子部品装置
JP7589435B2 (ja) 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP2020152825A (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7491223B2 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2022011184A (ja) 封止用樹脂組成物及び電子部品装置
JP7487596B2 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2020067016A1 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7790151B2 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7665983B2 (ja) 熱硬化性樹脂組成物及び電子部品装置
WO2024111575A1 (ja) 成形用樹脂組成物及び電子部品装置
WO2025023180A1 (ja) 樹脂組成物及び電子部品装置
WO2025052516A1 (ja) 樹脂組成物、電子部品装置及び樹脂組成物の製造方法
WO2024111461A1 (ja) 成形用樹脂組成物及び電子部品装置
JP2024055627A (ja) 成形用樹脂組成物及び電子部品装置
WO2025022963A1 (ja) 樹脂組成物及び電子部品装置
JP2024075422A (ja) 成形用樹脂組成物及び電子部品装置
JP2024055668A (ja) 成形用樹脂組成物及び電子部品装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240205

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240205

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240319

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240329

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20240423

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240723

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20240730

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241202

R150 Certificate of patent or registration of utility model

Ref document number: 7609173

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150