JP2024092647A - 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体 - Google Patents

研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体 Download PDF

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Publication number
JP2024092647A
JP2024092647A JP2022208734A JP2022208734A JP2024092647A JP 2024092647 A JP2024092647 A JP 2024092647A JP 2022208734 A JP2022208734 A JP 2022208734A JP 2022208734 A JP2022208734 A JP 2022208734A JP 2024092647 A JP2024092647 A JP 2024092647A
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JP
Japan
Prior art keywords
polishing
measurement
data point
data points
measurement data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022208734A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024092647A5 (enExample
Inventor
博俊 佐鳥
Hirotoshi Satori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2022208734A priority Critical patent/JP2024092647A/ja
Priority to CN202380088869.3A priority patent/CN120500399A/zh
Priority to KR1020257022495A priority patent/KR20250132481A/ko
Priority to EP23911415.0A priority patent/EP4644043A1/en
Priority to PCT/JP2023/040890 priority patent/WO2024142632A1/ja
Priority to TW112149903A priority patent/TW202440270A/zh
Publication of JP2024092647A publication Critical patent/JP2024092647A/ja
Publication of JP2024092647A5 publication Critical patent/JP2024092647A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Acoustics & Sound (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022208734A 2022-12-26 2022-12-26 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体 Pending JP2024092647A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022208734A JP2024092647A (ja) 2022-12-26 2022-12-26 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体
CN202380088869.3A CN120500399A (zh) 2022-12-26 2023-11-14 研磨方法、研磨装置及计算机可读取记录介质
KR1020257022495A KR20250132481A (ko) 2022-12-26 2023-11-14 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체
EP23911415.0A EP4644043A1 (en) 2022-12-26 2023-11-14 Polishing method, polishing device, and computer-readable recording medium
PCT/JP2023/040890 WO2024142632A1 (ja) 2022-12-26 2023-11-14 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体
TW112149903A TW202440270A (zh) 2022-12-26 2023-12-21 研磨方法、研磨裝置、及電腦可讀取記錄媒體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022208734A JP2024092647A (ja) 2022-12-26 2022-12-26 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体

Publications (2)

Publication Number Publication Date
JP2024092647A true JP2024092647A (ja) 2024-07-08
JP2024092647A5 JP2024092647A5 (enExample) 2025-11-20

Family

ID=91717295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022208734A Pending JP2024092647A (ja) 2022-12-26 2022-12-26 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体

Country Status (6)

Country Link
EP (1) EP4644043A1 (enExample)
JP (1) JP2024092647A (enExample)
KR (1) KR20250132481A (enExample)
CN (1) CN120500399A (enExample)
TW (1) TW202440270A (enExample)
WO (1) WO2024142632A1 (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5340795B2 (ja) 2009-04-27 2013-11-13 株式会社荏原製作所 研磨方法及び研磨装置
JP2021028099A (ja) * 2019-08-09 2021-02-25 株式会社荏原製作所 終点検知装置、終点検知方法
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
JP7783104B2 (ja) * 2021-04-28 2025-12-09 株式会社荏原製作所 研磨装置および研磨方法

Also Published As

Publication number Publication date
EP4644043A1 (en) 2025-11-05
WO2024142632A1 (ja) 2024-07-04
TW202440270A (zh) 2024-10-16
CN120500399A (zh) 2025-08-15
KR20250132481A (ko) 2025-09-04

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