JP2024075582A5 - - Google Patents
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- JP2024075582A5 JP2024075582A5 JP2024028952A JP2024028952A JP2024075582A5 JP 2024075582 A5 JP2024075582 A5 JP 2024075582A5 JP 2024028952 A JP2024028952 A JP 2024028952A JP 2024028952 A JP2024028952 A JP 2024028952A JP 2024075582 A5 JP2024075582 A5 JP 2024075582A5
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- 239000000758 substrate Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 18
- 230000004075 alteration Effects 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 230000007547 defect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 2
- 230000001419 dependent effect Effects 0.000 claims 1
- 230000002925 chemical effect Effects 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102020114195.5 | 2020-05-27 | ||
| DE102020114195.5A DE102020114195A1 (de) | 2020-05-27 | 2020-05-27 | Verfahren zum Einbringen einer Ausnehmung in ein Substrat |
| PCT/EP2021/058498 WO2021239302A1 (de) | 2020-05-27 | 2021-03-31 | Verfahren zum einbringen einer ausnehmung in ein substrat |
| JP2022564582A JP7478255B2 (ja) | 2020-05-27 | 2021-03-31 | 凹部を基板中に生成するための方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022564582A Division JP7478255B2 (ja) | 2020-05-27 | 2021-03-31 | 凹部を基板中に生成するための方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024075582A JP2024075582A (ja) | 2024-06-04 |
| JP2024075582A5 true JP2024075582A5 (https=) | 2024-07-04 |
Family
ID=75438743
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022564582A Active JP7478255B2 (ja) | 2020-05-27 | 2021-03-31 | 凹部を基板中に生成するための方法 |
| JP2024028952A Pending JP2024075582A (ja) | 2020-05-27 | 2024-02-28 | 凹部を基板中に生成するための方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022564582A Active JP7478255B2 (ja) | 2020-05-27 | 2021-03-31 | 凹部を基板中に生成するための方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230192535A1 (https=) |
| EP (1) | EP4157580A1 (https=) |
| JP (2) | JP7478255B2 (https=) |
| KR (1) | KR102835652B1 (https=) |
| CN (1) | CN115697625B (https=) |
| DE (1) | DE102020114195A1 (https=) |
| WO (1) | WO2021239302A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12581979B2 (en) * | 2022-03-31 | 2026-03-17 | Beijing Boe Optoelectronics Technology Co., Ltd. | Substrate and preparation method thereof, integrated passive device, and electronic apparatus |
| DE102022116784A1 (de) * | 2022-07-05 | 2024-01-11 | Lpkf Laser & Electronics Aktiengesellschaft | Mikromechanische Kammstruktur aus Glas sowie zugehöriges Verfahren und Verwendung |
| DE102022127259B4 (de) | 2022-10-18 | 2026-02-12 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren sowie Vorrichtung zur Abbildung eines Strahls auf ein Objekt und Verfahren zum Einbringen einer Öffnung in ein Werkstück mittels dieses Verfahrens |
| DE102022130976B3 (de) | 2022-11-23 | 2023-11-30 | Lpkf Laser & Electronics Aktiengesellschaft | Monolithische Membran aus Glas, Doppel-Vertikalmembran-Anordnung, mikromechanische Federstruktur und zugehöriges Herstellungsverfahren |
| EP4407635A1 (en) * | 2023-01-30 | 2024-07-31 | Koninklijke Philips N.V. | Microstructure for selective transmission of electromagnetic radiation |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090013724A1 (en) * | 2006-02-22 | 2009-01-15 | Nippon Sheet Glass Company, Limited | Glass Processing Method Using Laser and Processing Device |
| JP5312761B2 (ja) * | 2007-08-09 | 2013-10-09 | 浜松ホトニクス株式会社 | 切断用加工方法 |
| US9079268B2 (en) * | 2007-09-14 | 2015-07-14 | Robert C. Fry | Analytical laser ablation of solid samples for ICP, ICP-MS, and FAG-MS analysis |
| CN101422848B (zh) * | 2008-11-21 | 2013-07-17 | 陈伟良 | 一种应用于激光切割加工的测距对焦方法 |
| JP5600427B2 (ja) | 2009-12-25 | 2014-10-01 | 株式会社フジクラ | 貫通配線基板の材料基板 |
| WO2011096356A1 (ja) | 2010-02-05 | 2011-08-11 | 株式会社フジクラ | 表面微細構造の形成方法および表面微細構造を有する基体 |
| US9108269B2 (en) | 2010-07-26 | 2015-08-18 | Hamamatsu Photonics K. K. | Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same |
| KR101516609B1 (ko) | 2011-05-23 | 2015-05-04 | 나미키 세이미쓰 하우세키 가부시키가이샤 | 발광소자의 제조 방법 및 발광소자 |
| DE102011111998A1 (de) | 2011-08-31 | 2013-02-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Strukturierung einer Oberfläche |
| ES2908956T3 (es) * | 2013-04-04 | 2022-05-04 | Lpkf Laser & Electronics Ag | Procedimiento para introducir rupturas en un sustrato |
| US10082333B2 (en) | 2014-07-02 | 2018-09-25 | Praxair Technology, Inc. | Argon condensation system and method |
| DE102014109792A1 (de) | 2014-07-11 | 2016-01-14 | Schott Ag | Verfahren zum Erzeugen eines langzeitstabilen Anrisses auf der Oberfläche eines Elements aus sprödhartem Material |
| KR20170028943A (ko) | 2014-07-14 | 2017-03-14 | 코닝 인코포레이티드 | 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템 |
| KR20170044143A (ko) | 2014-09-16 | 2017-04-24 | 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 | 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법 |
| DE102015006971A1 (de) * | 2015-04-09 | 2016-10-13 | Siltectra Gmbh | Verfahren zum verlustarmen Herstellen von Mehrkomponentenwafern |
| JP6898998B2 (ja) * | 2017-03-06 | 2021-07-07 | エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト | 電磁放射及び続くエッチングプロセスにより材料内に少なくとも１つの空隙を施すための方法 |
| WO2018162386A1 (de) * | 2017-03-06 | 2018-09-13 | Lpkf Laser & Electronics Ag | Verfahren zur herstellung einer technischen maske |
| DE102017106372B4 (de) | 2017-03-24 | 2021-04-29 | Lpkf Laser & Electronics Ag | Verfahren zur Bearbeitung eines Werkstückes |
| KR102260931B1 (ko) | 2017-05-15 | 2021-06-04 | 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 | 레이저 유도 디프 반응성 에칭을 이용해 기판을 가공하기 위한, 특히 분리하기 위한 방법 |
| WO2019079417A2 (en) * | 2017-10-20 | 2019-04-25 | Corning Incorporated | METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS |
| DE102018110211A1 (de) * | 2018-04-27 | 2019-10-31 | Schott Ag | Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material |
| CN112512959A (zh) * | 2018-08-09 | 2021-03-16 | Lpkf激光电子股份公司 | 用于制造微结构的方法 |
| DE102019121827A1 (de) * | 2019-08-13 | 2021-02-18 | Trumpf Laser- Und Systemtechnik Gmbh | Laserätzen mit variierender Ätzselektivität |
| DE102019217466A1 (de) * | 2019-11-12 | 2021-05-12 | Lpkf Laser & Electronics Ag | Reaktionsgefäße aus Glas, Herstellungsverfahren und Verfahren zur Analyse |
-
2020
- 2020-05-27 DE DE102020114195.5A patent/DE102020114195A1/de active Pending
-
2021
- 2021-03-31 JP JP2022564582A patent/JP7478255B2/ja active Active
- 2021-03-31 EP EP21717364.0A patent/EP4157580A1/de active Pending
- 2021-03-31 US US17/927,012 patent/US20230192535A1/en active Pending
- 2021-03-31 CN CN202180037651.6A patent/CN115697625B/zh active Active
- 2021-03-31 KR KR1020227041117A patent/KR102835652B1/ko active Active
- 2021-03-31 WO PCT/EP2021/058498 patent/WO2021239302A1/de not_active Ceased
-
2024
- 2024-02-28 JP JP2024028952A patent/JP2024075582A/ja active Pending
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