CN115697625B - 用于在基材中开设凹部的方法 - Google Patents

用于在基材中开设凹部的方法

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Publication number
CN115697625B
CN115697625B CN202180037651.6A CN202180037651A CN115697625B CN 115697625 B CN115697625 B CN 115697625B CN 202180037651 A CN202180037651 A CN 202180037651A CN 115697625 B CN115697625 B CN 115697625B
Authority
CN
China
Prior art keywords
substrate
modification
recess
recesses
adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180037651.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN115697625A (zh
Inventor
N.安布罗修斯
R.奥斯托尔特
D.邓克
M.多格
K.黑尔
A.M.沃格特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics AG
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Publication of CN115697625A publication Critical patent/CN115697625A/zh
Application granted granted Critical
Publication of CN115697625B publication Critical patent/CN115697625B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Dicing (AREA)
CN202180037651.6A 2020-05-27 2021-03-31 用于在基材中开设凹部的方法 Active CN115697625B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020114195.5 2020-05-27
DE102020114195.5A DE102020114195A1 (de) 2020-05-27 2020-05-27 Verfahren zum Einbringen einer Ausnehmung in ein Substrat
PCT/EP2021/058498 WO2021239302A1 (de) 2020-05-27 2021-03-31 Verfahren zum einbringen einer ausnehmung in ein substrat

Publications (2)

Publication Number Publication Date
CN115697625A CN115697625A (zh) 2023-02-03
CN115697625B true CN115697625B (zh) 2026-03-31

Family

ID=75438743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180037651.6A Active CN115697625B (zh) 2020-05-27 2021-03-31 用于在基材中开设凹部的方法

Country Status (7)

Country Link
US (1) US20230192535A1 (https=)
EP (1) EP4157580A1 (https=)
JP (2) JP7478255B2 (https=)
KR (1) KR102835652B1 (https=)
CN (1) CN115697625B (https=)
DE (1) DE102020114195A1 (https=)
WO (1) WO2021239302A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12581979B2 (en) * 2022-03-31 2026-03-17 Beijing Boe Optoelectronics Technology Co., Ltd. Substrate and preparation method thereof, integrated passive device, and electronic apparatus
DE102022116784A1 (de) * 2022-07-05 2024-01-11 Lpkf Laser & Electronics Aktiengesellschaft Mikromechanische Kammstruktur aus Glas sowie zugehöriges Verfahren und Verwendung
DE102022127259B4 (de) 2022-10-18 2026-02-12 Lpkf Laser & Electronics Aktiengesellschaft Verfahren sowie Vorrichtung zur Abbildung eines Strahls auf ein Objekt und Verfahren zum Einbringen einer Öffnung in ein Werkstück mittels dieses Verfahrens
DE102022130976B3 (de) 2022-11-23 2023-11-30 Lpkf Laser & Electronics Aktiengesellschaft Monolithische Membran aus Glas, Doppel-Vertikalmembran-Anordnung, mikromechanische Federstruktur und zugehöriges Herstellungsverfahren
EP4407635A1 (en) * 2023-01-30 2024-07-31 Koninklijke Philips N.V. Microstructure for selective transmission of electromagnetic radiation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017106372A1 (de) * 2017-03-24 2018-09-27 Lpkf Laser & Electronics Ag Verfahren zur Bearbeitung eines Werkstückes und ein dadurch hergestelltes Werkstück
CN110405369A (zh) * 2018-04-27 2019-11-05 肖特股份有限公司 用于在由脆硬材料制成的基板的体积中产生微结构的方法
CN110545948A (zh) * 2017-05-15 2019-12-06 Lpkf激光电子股份公司 借助激光诱导的深度蚀刻来加工、尤其分割基板的方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090013724A1 (en) * 2006-02-22 2009-01-15 Nippon Sheet Glass Company, Limited Glass Processing Method Using Laser and Processing Device
JP5312761B2 (ja) * 2007-08-09 2013-10-09 浜松ホトニクス株式会社 切断用加工方法
US9079268B2 (en) * 2007-09-14 2015-07-14 Robert C. Fry Analytical laser ablation of solid samples for ICP, ICP-MS, and FAG-MS analysis
CN101422848B (zh) * 2008-11-21 2013-07-17 陈伟良 一种应用于激光切割加工的测距对焦方法
JP5600427B2 (ja) 2009-12-25 2014-10-01 株式会社フジクラ 貫通配線基板の材料基板
WO2011096356A1 (ja) 2010-02-05 2011-08-11 株式会社フジクラ 表面微細構造の形成方法および表面微細構造を有する基体
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same
KR101516609B1 (ko) 2011-05-23 2015-05-04 나미키 세이미쓰 하우세키 가부시키가이샤 발광소자의 제조 방법 및 발광소자
DE102011111998A1 (de) 2011-08-31 2013-02-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Strukturierung einer Oberfläche
ES2908956T3 (es) * 2013-04-04 2022-05-04 Lpkf Laser & Electronics Ag Procedimiento para introducir rupturas en un sustrato
US10082333B2 (en) 2014-07-02 2018-09-25 Praxair Technology, Inc. Argon condensation system and method
DE102014109792A1 (de) 2014-07-11 2016-01-14 Schott Ag Verfahren zum Erzeugen eines langzeitstabilen Anrisses auf der Oberfläche eines Elements aus sprödhartem Material
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
KR20170044143A (ko) 2014-09-16 2017-04-24 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
DE102015006971A1 (de) * 2015-04-09 2016-10-13 Siltectra Gmbh Verfahren zum verlustarmen Herstellen von Mehrkomponentenwafern
JP6898998B2 (ja) * 2017-03-06 2021-07-07 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 電磁放射及び続くエッチングプロセスにより材料内に少なくとも１つの空隙を施すための方法
WO2018162386A1 (de) * 2017-03-06 2018-09-13 Lpkf Laser & Electronics Ag Verfahren zur herstellung einer technischen maske
WO2019079417A2 (en) * 2017-10-20 2019-04-25 Corning Incorporated METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS
CN112512959A (zh) * 2018-08-09 2021-03-16 Lpkf激光电子股份公司 用于制造微结构的方法
DE102019121827A1 (de) * 2019-08-13 2021-02-18 Trumpf Laser- Und Systemtechnik Gmbh Laserätzen mit variierender Ätzselektivität
DE102019217466A1 (de) * 2019-11-12 2021-05-12 Lpkf Laser & Electronics Ag Reaktionsgefäße aus Glas, Herstellungsverfahren und Verfahren zur Analyse

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017106372A1 (de) * 2017-03-24 2018-09-27 Lpkf Laser & Electronics Ag Verfahren zur Bearbeitung eines Werkstückes und ein dadurch hergestelltes Werkstück
CN110545948A (zh) * 2017-05-15 2019-12-06 Lpkf激光电子股份公司 借助激光诱导的深度蚀刻来加工、尤其分割基板的方法
CN110405369A (zh) * 2018-04-27 2019-11-05 肖特股份有限公司 用于在由脆硬材料制成的基板的体积中产生微结构的方法

Also Published As

Publication number Publication date
JP7478255B2 (ja) 2024-05-02
EP4157580A1 (de) 2023-04-05
JP2023523031A (ja) 2023-06-01
CN115697625A (zh) 2023-02-03
US20230192535A1 (en) 2023-06-22
DE102020114195A1 (de) 2021-12-02
JP2024075582A (ja) 2024-06-04
KR20230003020A (ko) 2023-01-05
KR102835652B1 (ko) 2025-07-17
WO2021239302A1 (de) 2021-12-02

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