JP7478255B2 - 凹部を基板中に生成するための方法 - Google Patents

凹部を基板中に生成するための方法 Download PDF

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Publication number
JP7478255B2
JP7478255B2 JP2022564582A JP2022564582A JP7478255B2 JP 7478255 B2 JP7478255 B2 JP 7478255B2 JP 2022564582 A JP2022564582 A JP 2022564582A JP 2022564582 A JP2022564582 A JP 2022564582A JP 7478255 B2 JP7478255 B2 JP 7478255B2
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substrate
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recesses
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Japanese (ja)
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JP2023523031A (ja
Inventor
アンブロジウス・ノルベルト
オストホルト・ローマン
ドゥンカー・ダーニエール
デルゲ・モーリッツ
ハレ・ケヴィン
フォークト・アーロン・ミヒャエル
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LPKF Laser and Electronics SE
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LPKF Laser and Electronics SE
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Priority to JP2024028952A priority Critical patent/JP2024075582A/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Dicing (AREA)
JP2022564582A 2020-05-27 2021-03-31 凹部を基板中に生成するための方法 Active JP7478255B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024028952A JP2024075582A (ja) 2020-05-27 2024-02-28 凹部を基板中に生成するための方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020114195.5 2020-05-27
DE102020114195.5A DE102020114195A1 (de) 2020-05-27 2020-05-27 Verfahren zum Einbringen einer Ausnehmung in ein Substrat
PCT/EP2021/058498 WO2021239302A1 (de) 2020-05-27 2021-03-31 Verfahren zum einbringen einer ausnehmung in ein substrat

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024028952A Division JP2024075582A (ja) 2020-05-27 2024-02-28 凹部を基板中に生成するための方法

Publications (2)

Publication Number Publication Date
JP2023523031A JP2023523031A (ja) 2023-06-01
JP7478255B2 true JP7478255B2 (ja) 2024-05-02

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Family Applications (2)

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JP2022564582A Active JP7478255B2 (ja) 2020-05-27 2021-03-31 凹部を基板中に生成するための方法
JP2024028952A Pending JP2024075582A (ja) 2020-05-27 2024-02-28 凹部を基板中に生成するための方法

Family Applications After (1)

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JP2024028952A Pending JP2024075582A (ja) 2020-05-27 2024-02-28 凹部を基板中に生成するための方法

Country Status (7)

Country Link
US (1) US20230192535A1 (https=)
EP (1) EP4157580A1 (https=)
JP (2) JP7478255B2 (https=)
KR (1) KR102835652B1 (https=)
CN (1) CN115697625B (https=)
DE (1) DE102020114195A1 (https=)
WO (1) WO2021239302A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
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US12581979B2 (en) * 2022-03-31 2026-03-17 Beijing Boe Optoelectronics Technology Co., Ltd. Substrate and preparation method thereof, integrated passive device, and electronic apparatus
DE102022116784A1 (de) * 2022-07-05 2024-01-11 Lpkf Laser & Electronics Aktiengesellschaft Mikromechanische Kammstruktur aus Glas sowie zugehöriges Verfahren und Verwendung
DE102022127259B4 (de) 2022-10-18 2026-02-12 Lpkf Laser & Electronics Aktiengesellschaft Verfahren sowie Vorrichtung zur Abbildung eines Strahls auf ein Objekt und Verfahren zum Einbringen einer Öffnung in ein Werkstück mittels dieses Verfahrens
DE102022130976B3 (de) 2022-11-23 2023-11-30 Lpkf Laser & Electronics Aktiengesellschaft Monolithische Membran aus Glas, Doppel-Vertikalmembran-Anordnung, mikromechanische Federstruktur und zugehöriges Herstellungsverfahren
EP4407635A1 (en) * 2023-01-30 2024-07-31 Koninklijke Philips N.V. Microstructure for selective transmission of electromagnetic radiation

Citations (4)

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JP2015173293A (ja) 2011-05-23 2015-10-01 並木精密宝石株式会社 発光素子の製造方法および発光素子
DE102017106372A1 (de) 2017-03-24 2018-09-27 Lpkf Laser & Electronics Ag Verfahren zur Bearbeitung eines Werkstückes und ein dadurch hergestelltes Werkstück
WO2018210484A1 (de) 2017-05-15 2018-11-22 Lpkf Laser & Electronics Ag Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen
JP2019214507A (ja) 2018-04-27 2019-12-19 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 脆性材料から成る基板の容積に微細な構造を形成する方法

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US20090013724A1 (en) * 2006-02-22 2009-01-15 Nippon Sheet Glass Company, Limited Glass Processing Method Using Laser and Processing Device
JP5312761B2 (ja) * 2007-08-09 2013-10-09 浜松ホトニクス株式会社 切断用加工方法
US9079268B2 (en) * 2007-09-14 2015-07-14 Robert C. Fry Analytical laser ablation of solid samples for ICP, ICP-MS, and FAG-MS analysis
CN101422848B (zh) * 2008-11-21 2013-07-17 陈伟良 一种应用于激光切割加工的测距对焦方法
JP5600427B2 (ja) 2009-12-25 2014-10-01 株式会社フジクラ 貫通配線基板の材料基板
WO2011096356A1 (ja) 2010-02-05 2011-08-11 株式会社フジクラ 表面微細構造の形成方法および表面微細構造を有する基体
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same
DE102011111998A1 (de) 2011-08-31 2013-02-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Strukturierung einer Oberfläche
ES2908956T3 (es) * 2013-04-04 2022-05-04 Lpkf Laser & Electronics Ag Procedimiento para introducir rupturas en un sustrato
US10082333B2 (en) 2014-07-02 2018-09-25 Praxair Technology, Inc. Argon condensation system and method
DE102014109792A1 (de) 2014-07-11 2016-01-14 Schott Ag Verfahren zum Erzeugen eines langzeitstabilen Anrisses auf der Oberfläche eines Elements aus sprödhartem Material
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
KR20170044143A (ko) 2014-09-16 2017-04-24 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
DE102015006971A1 (de) * 2015-04-09 2016-10-13 Siltectra Gmbh Verfahren zum verlustarmen Herstellen von Mehrkomponentenwafern
JP6898998B2 (ja) * 2017-03-06 2021-07-07 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 電磁放射及び続くエッチングプロセスにより材料内に少なくとも１つの空隙を施すための方法
WO2018162386A1 (de) * 2017-03-06 2018-09-13 Lpkf Laser & Electronics Ag Verfahren zur herstellung einer technischen maske
WO2019079417A2 (en) * 2017-10-20 2019-04-25 Corning Incorporated METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS
CN112512959A (zh) * 2018-08-09 2021-03-16 Lpkf激光电子股份公司 用于制造微结构的方法
DE102019121827A1 (de) * 2019-08-13 2021-02-18 Trumpf Laser- Und Systemtechnik Gmbh Laserätzen mit variierender Ätzselektivität
DE102019217466A1 (de) * 2019-11-12 2021-05-12 Lpkf Laser & Electronics Ag Reaktionsgefäße aus Glas, Herstellungsverfahren und Verfahren zur Analyse

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015173293A (ja) 2011-05-23 2015-10-01 並木精密宝石株式会社 発光素子の製造方法および発光素子
DE102017106372A1 (de) 2017-03-24 2018-09-27 Lpkf Laser & Electronics Ag Verfahren zur Bearbeitung eines Werkstückes und ein dadurch hergestelltes Werkstück
WO2018210484A1 (de) 2017-05-15 2018-11-22 Lpkf Laser & Electronics Ag Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen
JP2019214507A (ja) 2018-04-27 2019-12-19 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 脆性材料から成る基板の容積に微細な構造を形成する方法

Also Published As

Publication number Publication date
EP4157580A1 (de) 2023-04-05
JP2023523031A (ja) 2023-06-01
CN115697625A (zh) 2023-02-03
US20230192535A1 (en) 2023-06-22
DE102020114195A1 (de) 2021-12-02
JP2024075582A (ja) 2024-06-04
KR20230003020A (ko) 2023-01-05
KR102835652B1 (ko) 2025-07-17
WO2021239302A1 (de) 2021-12-02
CN115697625B (zh) 2026-03-31

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