JP2023549871A - 半導体熱処理設備の載置装置及び半導体熱処理設備 - Google Patents

半導体熱処理設備の載置装置及び半導体熱処理設備 Download PDF

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Publication number
JP2023549871A
JP2023549871A JP2023529037A JP2023529037A JP2023549871A JP 2023549871 A JP2023549871 A JP 2023549871A JP 2023529037 A JP2023529037 A JP 2023529037A JP 2023529037 A JP2023529037 A JP 2023529037A JP 2023549871 A JP2023549871 A JP 2023549871A
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JP
Japan
Prior art keywords
mounting
semiconductor heat
heat treatment
temperature measuring
mounting device
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Pending
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JP2023529037A
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English (en)
Japanese (ja)
Inventor
ズージャ ハン
ジン イャォ
シュァイ ヤン
シーチュェン イェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
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Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of JP2023549871A publication Critical patent/JP2023549871A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photovoltaic Devices (AREA)
JP2023529037A 2020-11-27 2021-11-24 半導体熱処理設備の載置装置及び半導体熱処理設備 Pending JP2023549871A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202011362061.4A CN112530826B (zh) 2020-11-27 2020-11-27 半导体热处理设备的承载装置及半导体热处理设备
CN202011362061.4 2020-11-27
PCT/CN2021/132757 WO2022111519A1 (zh) 2020-11-27 2021-11-24 半导体热处理设备的承载装置及半导体热处理设备

Publications (1)

Publication Number Publication Date
JP2023549871A true JP2023549871A (ja) 2023-11-29

Family

ID=74994403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529037A Pending JP2023549871A (ja) 2020-11-27 2021-11-24 半導体熱処理設備の載置装置及び半導体熱処理設備

Country Status (5)

Country Link
JP (1) JP2023549871A (zh)
KR (1) KR20230091979A (zh)
CN (1) CN112530826B (zh)
TW (1) TWI802098B (zh)
WO (1) WO2022111519A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112530826B (zh) * 2020-11-27 2024-05-17 北京北方华创微电子装备有限公司 半导体热处理设备的承载装置及半导体热处理设备
CN114086146B (zh) * 2021-11-18 2023-09-08 北京北方华创微电子装备有限公司 半导体工艺设备及其承载装置
CN114355998B (zh) * 2021-12-17 2023-05-12 西安北方华创微电子装备有限公司 半导体热处理设备的补偿参数获取方法和设备
CN116631909B (zh) * 2023-05-25 2024-03-22 上海稷以科技有限公司 半导体测试设备及位置调整方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283454A (ja) * 1996-04-17 1997-10-31 Kokusai Electric Co Ltd 電気炉の温度制御装置
JP4393009B2 (ja) * 2001-03-30 2010-01-06 東京エレクトロン株式会社 縦型熱処理装置
JP3377996B1 (ja) * 2001-12-27 2003-02-17 東京エレクトロン株式会社 熱処理用ボート及び縦型熱処理装置
JP3802889B2 (ja) * 2003-07-01 2006-07-26 東京エレクトロン株式会社 熱処理装置及びその校正方法
JP4712343B2 (ja) * 2003-10-30 2011-06-29 東京エレクトロン株式会社 熱処理装置、熱処理方法、プログラム及び記録媒体
JP5642612B2 (ja) * 2011-04-05 2014-12-17 東京エレクトロン株式会社 熱処理装置および熱処理方法
JP5973173B2 (ja) * 2012-01-23 2016-08-23 東京エレクトロン株式会社 熱処理装置及び熱処理装置の制御方法
JP5644007B2 (ja) * 2012-02-10 2014-12-24 東京エレクトロン株式会社 温度センサ及び熱処理装置
JP6820766B2 (ja) * 2017-03-02 2021-01-27 東京エレクトロン株式会社 ガス導入機構及び熱処理装置
CN109244011B (zh) * 2018-09-05 2021-07-23 黄家仓 一种半导体集成圆片生产用热处理装置
CN110739252B (zh) * 2019-11-27 2021-09-17 北京北方华创微电子装备有限公司 半导体加工设备
CN110993550B (zh) * 2019-12-25 2022-12-09 北京北方华创微电子装备有限公司 半导体热处理设备
CN111524835B (zh) * 2020-04-29 2021-09-17 北京北方华创微电子装备有限公司 一种半导体加工设备
CN112530826B (zh) * 2020-11-27 2024-05-17 北京北方华创微电子装备有限公司 半导体热处理设备的承载装置及半导体热处理设备

Also Published As

Publication number Publication date
WO2022111519A1 (zh) 2022-06-02
TWI802098B (zh) 2023-05-11
CN112530826B (zh) 2024-05-17
CN112530826A (zh) 2021-03-19
KR20230091979A (ko) 2023-06-23
TW202221842A (zh) 2022-06-01

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