|
US5608526A
(en)
|
1995-01-19 |
1997-03-04 |
Tencor Instruments |
Focused beam spectroscopic ellipsometry method and system
|
|
US6023338A
(en)
|
1996-07-12 |
2000-02-08 |
Bareket; Noah |
Overlay alignment measurement of wafers
|
|
US5859424A
(en)
|
1997-04-08 |
1999-01-12 |
Kla-Tencor Corporation |
Apodizing filter system useful for reducing spot size in optical measurements and other applications
|
|
US6429943B1
(en)
|
2000-03-29 |
2002-08-06 |
Therma-Wave, Inc. |
Critical dimension analysis with simultaneous multiple angle of incidence measurements
|
|
US6787773B1
(en)
|
2000-06-07 |
2004-09-07 |
Kla-Tencor Corporation |
Film thickness measurement using electron-beam induced x-ray microanalysis
|
|
US7317531B2
(en)
|
2002-12-05 |
2008-01-08 |
Kla-Tencor Technologies Corporation |
Apparatus and methods for detecting overlay errors using scatterometry
|
|
US7068833B1
(en)
|
2000-08-30 |
2006-06-27 |
Kla-Tencor Corporation |
Overlay marks, methods of overlay mark design and methods of overlay measurements
|
|
US7541201B2
(en)
|
2000-08-30 |
2009-06-02 |
Kla-Tencor Technologies Corporation |
Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
|
|
US20030002043A1
(en)
|
2001-04-10 |
2003-01-02 |
Kla-Tencor Corporation |
Periodic patterns and technique to control misalignment
|
|
US6716646B1
(en)
|
2001-07-16 |
2004-04-06 |
Advanced Micro Devices, Inc. |
Method and apparatus for performing overlay measurements using scatterometry
|
|
WO2003054475A2
(en)
|
2001-12-19 |
2003-07-03 |
Kla-Tencor Technologies Corporation |
Parametric profiling using optical spectroscopic systems
|
|
US6778275B2
(en)
|
2002-02-20 |
2004-08-17 |
Micron Technology, Inc. |
Aberration mark and method for estimating overlay error and optical aberrations
|
|
JP4222927B2
(ja)
|
2002-09-20 |
2009-02-12 |
エーエスエムエル ネザーランズ ビー.ブイ. |
少なくとも2波長を使用するリソグラフィ装置用アライメント・システム
|
|
US6992764B1
(en)
|
2002-09-30 |
2006-01-31 |
Nanometrics Incorporated |
Measuring an alignment target with a single polarization state
|
|
US7842933B2
(en)
|
2003-10-22 |
2010-11-30 |
Applied Materials Israel, Ltd. |
System and method for measuring overlay errors
|
|
US6937337B2
(en)
|
2003-11-19 |
2005-08-30 |
International Business Machines Corporation |
Overlay target and measurement method using reference and sub-grids
|
|
US7321426B1
(en)
|
2004-06-02 |
2008-01-22 |
Kla-Tencor Technologies Corporation |
Optical metrology on patterned samples
|
|
US7478019B2
(en)
|
2005-01-26 |
2009-01-13 |
Kla-Tencor Corporation |
Multiple tool and structure analysis
|
|
JP4585926B2
(ja)
|
2005-06-17 |
2010-11-24 |
株式会社日立ハイテクノロジーズ |
パターンレイヤーデータ生成装置、それを用いたパターンレイヤーデータ生成システム、半導体パターン表示装置、パターンレイヤーデータ生成方法、及びコンピュータプログラム
|
|
WO2007066787A1
(ja)
*
|
2005-12-05 |
2007-06-14 |
National University Corporation Nagoya University |
ハイブリッドgaによる複数パラメータの最適化方法、パターンマッチングによるデータ解析方法、放射線回折データに基づく物質構造の推定方法、ならびに関連するプログラム、記録媒体および各種装置
|
|
US7567351B2
(en)
|
2006-02-02 |
2009-07-28 |
Kla-Tencor Corporation |
High resolution monitoring of CD variations
|
|
JP4887062B2
(ja)
|
2006-03-14 |
2012-02-29 |
株式会社日立ハイテクノロジーズ |
試料寸法測定方法、及び試料寸法測定装置
|
|
US7406153B2
(en)
|
2006-08-15 |
2008-07-29 |
Jordan Valley Semiconductors Ltd. |
Control of X-ray beam spot size
|
|
US7873585B2
(en)
|
2007-08-31 |
2011-01-18 |
Kla-Tencor Technologies Corporation |
Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
|
|
US7929667B1
(en)
|
2008-10-02 |
2011-04-19 |
Kla-Tencor Corporation |
High brightness X-ray metrology
|
|
US8068662B2
(en)
|
2009-03-30 |
2011-11-29 |
Hermes Microvision, Inc. |
Method and system for determining a defect during charged particle beam inspection of a sample
|
|
JP5764380B2
(ja)
|
2010-04-29 |
2015-08-19 |
エフ イー アイ カンパニFei Company |
Sem画像化法
|
|
WO2012092132A2
(en)
|
2010-12-29 |
2012-07-05 |
Cognex Corporation |
Determining the uniqueness of a model for machine vision
|
|
EP3779598B1
(en)
|
2011-04-06 |
2022-12-21 |
Kla-Tencor Corporation |
Method for providing a set of process tool correctables
|
|
US9046475B2
(en)
|
2011-05-19 |
2015-06-02 |
Applied Materials Israel, Ltd. |
High electron energy based overlay error measurement methods and systems
|
|
US9709903B2
(en)
*
|
2011-11-01 |
2017-07-18 |
Kla-Tencor Corporation |
Overlay target geometry for measuring multiple pitches
|
|
US10107621B2
(en)
|
2012-02-15 |
2018-10-23 |
Nanometrics Incorporated |
Image based overlay measurement with finite gratings
|
|
US10801975B2
(en)
|
2012-05-08 |
2020-10-13 |
Kla-Tencor Corporation |
Metrology tool with combined X-ray and optical scatterometers
|
|
US10013518B2
(en)
|
2012-07-10 |
2018-07-03 |
Kla-Tencor Corporation |
Model building and analysis engine for combined X-ray and optical metrology
|
|
US9129715B2
(en)
|
2012-09-05 |
2015-09-08 |
SVXR, Inc. |
High speed x-ray inspection microscope
|
|
WO2014062972A1
(en)
|
2012-10-18 |
2014-04-24 |
Kla-Tencor Corporation |
Symmetric target design in scatterometry overlay metrology
|
|
US9581430B2
(en)
|
2012-10-19 |
2017-02-28 |
Kla-Tencor Corporation |
Phase characterization of targets
|
|
US10769320B2
(en)
|
2012-12-18 |
2020-09-08 |
Kla-Tencor Corporation |
Integrated use of model-based metrology and a process model
|
|
US9291554B2
(en)
|
2013-02-05 |
2016-03-22 |
Kla-Tencor Corporation |
Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection
|
|
US9826614B1
(en)
|
2013-03-15 |
2017-11-21 |
Kla-Tencor Corporation |
Compac X-ray source for semiconductor metrology
|
|
EP2978377B1
(en)
*
|
2013-03-26 |
2021-05-05 |
Institute of Experimental and Applied Physics |
Method of phase gradient radiography and arrangement of an imaging system for application of the method
|
|
US10101670B2
(en)
|
2013-03-27 |
2018-10-16 |
Kla-Tencor Corporation |
Statistical model-based metrology
|
|
US9255877B2
(en)
*
|
2013-05-21 |
2016-02-09 |
Kla-Tencor Corporation |
Metrology system optimization for parameter tracking
|
|
US9915522B1
(en)
|
2013-06-03 |
2018-03-13 |
Kla-Tencor Corporation |
Optimized spatial modeling for optical CD metrology
|
|
US9177873B2
(en)
|
2013-07-29 |
2015-11-03 |
GlobalFoundries, Inc. |
Systems and methods for fabricating semiconductor device structures
|
|
US10502694B2
(en)
|
2013-08-06 |
2019-12-10 |
Kla-Tencor Corporation |
Methods and apparatus for patterned wafer characterization
|
|
US9760018B2
(en)
|
2013-08-13 |
2017-09-12 |
Asml Netherlands B.V. |
Method and inspection apparatus and computer program product for assessing a quality of reconstruction of a value of a parameter of interest of a structure
|
|
US9846132B2
(en)
|
2013-10-21 |
2017-12-19 |
Kla-Tencor Corporation |
Small-angle scattering X-ray metrology systems and methods
|
|
US9885962B2
(en)
|
2013-10-28 |
2018-02-06 |
Kla-Tencor Corporation |
Methods and apparatus for measuring semiconductor device overlay using X-ray metrology
|
|
WO2015167753A2
(en)
|
2014-04-03 |
2015-11-05 |
Massachusetts Institute Of Technology |
Compact x-ray source for cd-saxs
|
|
US9494535B2
(en)
|
2014-04-21 |
2016-11-15 |
Kla-Tencor Corporation |
Scatterometry-based imaging and critical dimension metrology
|
|
US10352876B2
(en)
*
|
2014-05-09 |
2019-07-16 |
KLA—Tencor Corporation |
Signal response metrology for scatterometry based overlay measurements
|
|
US10151986B2
(en)
*
|
2014-07-07 |
2018-12-11 |
Kla-Tencor Corporation |
Signal response metrology based on measurements of proxy structures
|
|
US10139352B2
(en)
*
|
2014-10-18 |
2018-11-27 |
Kla-Tenor Corporation |
Measurement of small box size targets
|
|
US10152678B2
(en)
|
2014-11-19 |
2018-12-11 |
Kla-Tencor Corporation |
System, method and computer program product for combining raw data from multiple metrology tools
|
|
US10324050B2
(en)
|
2015-01-14 |
2019-06-18 |
Kla-Tencor Corporation |
Measurement system optimization for X-ray based metrology
|
|
US10365225B1
(en)
*
|
2015-03-04 |
2019-07-30 |
Kla-Tencor Corporation |
Multi-location metrology
|
|
US10502549B2
(en)
*
|
2015-03-24 |
2019-12-10 |
Kla-Tencor Corporation |
Model-based single parameter measurement
|
|
US10545104B2
(en)
|
2015-04-28 |
2020-01-28 |
Kla-Tencor Corporation |
Computationally efficient X-ray based overlay measurement
|
|
JP6959614B2
(ja)
*
|
2015-10-28 |
2021-11-02 |
国立大学法人 東京大学 |
分析装置,及びフローサイトメータ
|
|
US10352695B2
(en)
|
2015-12-11 |
2019-07-16 |
Kla-Tencor Corporation |
X-ray scatterometry metrology for high aspect ratio structures
|
|
US10504759B2
(en)
*
|
2016-04-04 |
2019-12-10 |
Kla-Tencor Corporation |
Semiconductor metrology with information from multiple processing steps
|
|
US10346740B2
(en)
*
|
2016-06-01 |
2019-07-09 |
Kla-Tencor Corp. |
Systems and methods incorporating a neural network and a forward physical model for semiconductor applications
|
|
WO2018071716A1
(en)
*
|
2016-10-13 |
2018-04-19 |
Kla-Tencor Corporation |
Metrology systems and methods for process control
|
|
US10775323B2
(en)
|
2016-10-18 |
2020-09-15 |
Kla-Tencor Corporation |
Full beam metrology for X-ray scatterometry systems
|
|
US10481111B2
(en)
|
2016-10-21 |
2019-11-19 |
Kla-Tencor Corporation |
Calibration of a small angle X-ray scatterometry based metrology system
|
|
US10444643B2
(en)
*
|
2017-03-24 |
2019-10-15 |
Nikon Research Corporation Of America |
Lithographic thermal distortion compensation with the use of machine learning
|
|
US11073487B2
(en)
|
2017-05-11 |
2021-07-27 |
Kla-Tencor Corporation |
Methods and systems for characterization of an x-ray beam with high spatial resolution
|
|
US11333621B2
(en)
|
2017-07-11 |
2022-05-17 |
Kla-Tencor Corporation |
Methods and systems for semiconductor metrology based on polychromatic soft X-Ray diffraction
|
|
US10732515B2
(en)
*
|
2017-09-27 |
2020-08-04 |
Kla-Tencor Corporation |
Detection and measurement of dimensions of asymmetric structures
|
|
JP2020535484A
(ja)
*
|
2017-09-28 |
2020-12-03 |
エーエスエムエル ネザーランズ ビー.ブイ. |
リソグラフィ方法
|
|
US11517197B2
(en)
*
|
2017-10-06 |
2022-12-06 |
Canon Medical Systems Corporation |
Apparatus and method for medical image reconstruction using deep learning for computed tomography (CT) image noise and artifacts reduction
|
|
US11519869B2
(en)
|
2018-03-20 |
2022-12-06 |
Kla Tencor Corporation |
Methods and systems for real time measurement control
|
|
WO2019185233A1
(en)
|
2018-03-29 |
2019-10-03 |
Asml Netherlands B.V. |
Method for evaluating control strategies in a semicondcutor manufacturing process
|
|
TWI749355B
(zh)
*
|
2018-08-17 |
2021-12-11 |
荷蘭商Asml荷蘭公司 |
用於校正圖案化程序之度量衡資料之方法及相關的電腦程式產品
|
|
EP3637186A1
(en)
*
|
2018-10-09 |
2020-04-15 |
ASML Netherlands B.V. |
Method of calibrating a plurality of metrology apparatuses, method of determining a parameter of interest, and metrology apparatus
|
|
US12044980B2
(en)
*
|
2018-12-03 |
2024-07-23 |
Asml Netherlands B.V. |
Method of manufacturing devices
|