|
JPH0616475B2
(ja)
*
|
1987-04-03 |
1994-03-02 |
三菱電機株式会社 |
物品の製造システム及び物品の製造方法
|
|
US6571134B1
(en)
*
|
1998-02-18 |
2003-05-27 |
Siemens Aktiengesellschaft |
Method and device for determining an intermediary profile of a metal strip
|
|
US6442496B1
(en)
*
|
2000-08-08 |
2002-08-27 |
Advanced Micro Devices, Inc. |
Method and apparatus for dynamic sampling of a production line
|
|
US7082345B2
(en)
*
|
2001-06-19 |
2006-07-25 |
Applied Materials, Inc. |
Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
|
|
US6772036B2
(en)
*
|
2001-08-30 |
2004-08-03 |
Fisher-Rosemount Systems, Inc. |
Control system using process model
|
|
US8296687B2
(en)
*
|
2003-09-30 |
2012-10-23 |
Tokyo Electron Limited |
System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
|
|
WO2006018961A1
(ja)
*
|
2004-08-17 |
2006-02-23 |
Shin-Etsu Handotai Co., Ltd. |
半導体ウェーハの測定方法、その製造工程の管理方法、及び半導体ウェーハの製造方法
|
|
US8615314B1
(en)
*
|
2004-09-02 |
2013-12-24 |
Advanced Micro Devices, Inc. |
Process control using analysis of an upstream process
|
|
US20070194225A1
(en)
*
|
2005-10-07 |
2007-08-23 |
Zorn Miguel D |
Coherent electron junction scanning probe interference microscope, nanomanipulator and spectrometer with assembler and DNA sequencing applications
|
|
US7930058B2
(en)
*
|
2006-01-30 |
2011-04-19 |
Memc Electronic Materials, Inc. |
Nanotopography control and optimization using feedback from warp data
|
|
US7662023B2
(en)
|
2006-01-30 |
2010-02-16 |
Memc Electronic Materials, Inc. |
Double side wafer grinder and methods for assessing workpiece nanotopology
|
|
US20080140590A1
(en)
*
|
2006-12-12 |
2008-06-12 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Process control integration systems and methods
|
|
TWI321503B
(en)
*
|
2007-06-15 |
2010-03-11 |
Univ Nat Taiwan Science Tech |
The analytical method of the effective polishing frequency and number of times towards the polishing pads having different grooves and profiles
|
|
DE102007035266B4
(de)
|
2007-07-27 |
2010-03-25 |
Siltronic Ag |
Verfahren zum Polieren eines Substrates aus Silicium oder einer Legierung aus Silicium und Germanium
|
|
KR101610734B1
(ko)
*
|
2008-06-03 |
2016-04-08 |
에이에스엠엘 네델란즈 비.브이. |
모델-기반 스캐너 튜닝 방법
|
|
EP3866047A1
(en)
*
|
2008-06-10 |
2021-08-18 |
Oasis Tooling, Inc. |
Methods and devices for independent evaluation of cell integrity, changes and origin in chip design for production workflow
|
|
CN101403915A
(zh)
*
|
2008-11-07 |
2009-04-08 |
同济大学 |
一种可重组生产线产品质量预测方法
|
|
US8712575B2
(en)
|
2010-03-26 |
2014-04-29 |
Memc Electronic Materials, Inc. |
Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
|
|
DE102010063179B4
(de)
|
2010-12-15 |
2012-10-04 |
Siltronic Ag |
Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben
|
|
US8572518B2
(en)
*
|
2011-06-23 |
2013-10-29 |
Nikon Precision Inc. |
Predicting pattern critical dimensions in a lithographic exposure process
|
|
US10295993B2
(en)
*
|
2011-09-01 |
2019-05-21 |
Kla-Tencor Corporation |
Method and system for detecting and correcting problematic advanced process control parameters
|
|
JP6166383B2
(ja)
*
|
2012-12-28 |
2017-07-19 |
サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ |
エピタキシャル後反りの予測および制御方法
|
|
US9026954B2
(en)
*
|
2013-03-14 |
2015-05-05 |
Globalfoundries Singapore Pte. Ltd. |
Surface topography enhanced pattern (STEP) matching
|
|
US10502694B2
(en)
*
|
2013-08-06 |
2019-12-10 |
Kla-Tencor Corporation |
Methods and apparatus for patterned wafer characterization
|
|
TWI492010B
(zh)
*
|
2013-10-23 |
2015-07-11 |
Nat Univ Tsing Hua |
Used in the factory to carry out the manufacturing method of verification
|
|
US9087176B1
(en)
*
|
2014-03-06 |
2015-07-21 |
Kla-Tencor Corporation |
Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control
|
|
US10514685B2
(en)
*
|
2014-06-13 |
2019-12-24 |
KLA—Tencor Corp. |
Automatic recipe stability monitoring and reporting
|
|
KR102521159B1
(ko)
*
|
2014-11-25 |
2023-04-13 |
피디에프 솔루션즈, 인코포레이티드 |
반도체 제조 공정을 위한 개선된 공정 제어 기술
|
|
US10430719B2
(en)
*
|
2014-11-25 |
2019-10-01 |
Stream Mosaic, Inc. |
Process control techniques for semiconductor manufacturing processes
|
|
US9792393B2
(en)
*
|
2016-02-08 |
2017-10-17 |
Lam Research Corporation |
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
|
|
KR102334937B1
(ko)
*
|
2016-10-21 |
2021-12-03 |
에이에스엠엘 네델란즈 비.브이. |
패터닝 프로세스용 보정 결정 방법
|
|
US11275361B2
(en)
*
|
2017-06-30 |
2022-03-15 |
Kla-Tencor Corporation |
Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process
|
|
CN111758152B
(zh)
*
|
2018-02-21 |
2023-10-31 |
胜高股份有限公司 |
晶片的制造方法
|
|
SG11202009105YA
(en)
*
|
2018-03-20 |
2020-10-29 |
Tokyo Electron Ltd |
Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
|
|
EP3594750A1
(en)
*
|
2018-07-10 |
2020-01-15 |
ASML Netherlands B.V. |
Hidden defect detection and epe estimation based on the extracted 3d information from e-beam images
|
|
US20200033842A1
(en)
*
|
2018-07-25 |
2020-01-30 |
Jtekt Corporation |
Grinding quality estimation model generating device, grinding quality estimating device, poor quality factor estimating device, grinding machine operation command data adjustment model generating device, and grinding machine operation command data updating device
|