KR20240140186A - 향상된 웨이퍼 제조를 위한 시스템들 및 방법들 - Google Patents
향상된 웨이퍼 제조를 위한 시스템들 및 방법들 Download PDFInfo
- Publication number
- KR20240140186A KR20240140186A KR1020247030785A KR20247030785A KR20240140186A KR 20240140186 A KR20240140186 A KR 20240140186A KR 1020247030785 A KR1020247030785 A KR 1020247030785A KR 20247030785 A KR20247030785 A KR 20247030785A KR 20240140186 A KR20240140186 A KR 20240140186A
- Authority
- KR
- South Korea
- Prior art keywords
- thresholds
- scan data
- assembly line
- model
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
- G05B13/027—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion using neural networks only
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41805—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by assembly
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32359—Modeling, simulating assembly operations
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32368—Quality control
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40111—For assembly
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- General Physics & Mathematics (AREA)
- Artificial Intelligence (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Computation (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Medical Informatics (AREA)
- Software Systems (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/786,579 US11415971B2 (en) | 2020-02-10 | 2020-02-10 | Systems and methods for enhanced wafer manufacturing |
| US16/786,579 | 2020-02-10 | ||
| PCT/US2021/016136 WO2021162887A1 (en) | 2020-02-10 | 2021-02-02 | Systems and methods for enhanced wafer manufacturing |
| KR1020227031343A KR102708800B1 (ko) | 2020-02-10 | 2021-02-02 | 향상된 웨이퍼 제조를 위한 시스템들 및 방법들 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227031343A Division KR102708800B1 (ko) | 2020-02-10 | 2021-02-02 | 향상된 웨이퍼 제조를 위한 시스템들 및 방법들 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240140186A true KR20240140186A (ko) | 2024-09-24 |
Family
ID=74844999
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247030785A Pending KR20240140186A (ko) | 2020-02-10 | 2021-02-02 | 향상된 웨이퍼 제조를 위한 시스템들 및 방법들 |
| KR1020227031343A Active KR102708800B1 (ko) | 2020-02-10 | 2021-02-02 | 향상된 웨이퍼 제조를 위한 시스템들 및 방법들 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227031343A Active KR102708800B1 (ko) | 2020-02-10 | 2021-02-02 | 향상된 웨이퍼 제조를 위한 시스템들 및 방법들 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11415971B2 (https=) |
| EP (1) | EP4104023B1 (https=) |
| JP (1) | JP7661348B2 (https=) |
| KR (2) | KR20240140186A (https=) |
| CN (1) | CN115244472A (https=) |
| TW (1) | TWI851876B (https=) |
| WO (1) | WO2021162887A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4657342A3 (en) * | 2020-03-31 | 2026-03-11 | ATS Corporation | Systems and methods for modeling a manufacturing assembly line |
| US12386340B2 (en) * | 2022-02-25 | 2025-08-12 | Globalwafers Co., Ltd. | Systems and methods for generating post-polishing topography for enhanced wafer manufacturing |
| US12422822B2 (en) * | 2022-07-22 | 2025-09-23 | Sap Se | Resume of failed automates in end-to-end process |
| US20240037442A1 (en) * | 2022-07-26 | 2024-02-01 | Applied Materials, Inc. | Generating indications of learning of models for semiconductor processing |
| TWI911639B (zh) * | 2024-02-02 | 2026-01-11 | 黃廖全 | 鏡片研磨裝置 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0616475B2 (ja) * | 1987-04-03 | 1994-03-02 | 三菱電機株式会社 | 物品の製造システム及び物品の製造方法 |
| US6571134B1 (en) * | 1998-02-18 | 2003-05-27 | Siemens Aktiengesellschaft | Method and device for determining an intermediary profile of a metal strip |
| US6442496B1 (en) * | 2000-08-08 | 2002-08-27 | Advanced Micro Devices, Inc. | Method and apparatus for dynamic sampling of a production line |
| US7082345B2 (en) * | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US6772036B2 (en) * | 2001-08-30 | 2004-08-03 | Fisher-Rosemount Systems, Inc. | Control system using process model |
| US8296687B2 (en) * | 2003-09-30 | 2012-10-23 | Tokyo Electron Limited | System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool |
| WO2006018961A1 (ja) * | 2004-08-17 | 2006-02-23 | Shin-Etsu Handotai Co., Ltd. | 半導体ウェーハの測定方法、その製造工程の管理方法、及び半導体ウェーハの製造方法 |
| US8615314B1 (en) * | 2004-09-02 | 2013-12-24 | Advanced Micro Devices, Inc. | Process control using analysis of an upstream process |
| US20070194225A1 (en) * | 2005-10-07 | 2007-08-23 | Zorn Miguel D | Coherent electron junction scanning probe interference microscope, nanomanipulator and spectrometer with assembler and DNA sequencing applications |
| US7930058B2 (en) * | 2006-01-30 | 2011-04-19 | Memc Electronic Materials, Inc. | Nanotopography control and optimization using feedback from warp data |
| US7662023B2 (en) | 2006-01-30 | 2010-02-16 | Memc Electronic Materials, Inc. | Double side wafer grinder and methods for assessing workpiece nanotopology |
| US20080140590A1 (en) * | 2006-12-12 | 2008-06-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Process control integration systems and methods |
| TWI321503B (en) * | 2007-06-15 | 2010-03-11 | Univ Nat Taiwan Science Tech | The analytical method of the effective polishing frequency and number of times towards the polishing pads having different grooves and profiles |
| DE102007035266B4 (de) | 2007-07-27 | 2010-03-25 | Siltronic Ag | Verfahren zum Polieren eines Substrates aus Silicium oder einer Legierung aus Silicium und Germanium |
| KR101610734B1 (ko) * | 2008-06-03 | 2016-04-08 | 에이에스엠엘 네델란즈 비.브이. | 모델-기반 스캐너 튜닝 방법 |
| EP3866047A1 (en) * | 2008-06-10 | 2021-08-18 | Oasis Tooling, Inc. | Methods and devices for independent evaluation of cell integrity, changes and origin in chip design for production workflow |
| CN101403915A (zh) * | 2008-11-07 | 2009-04-08 | 同济大学 | 一种可重组生产线产品质量预测方法 |
| US8712575B2 (en) | 2010-03-26 | 2014-04-29 | Memc Electronic Materials, Inc. | Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder |
| DE102010063179B4 (de) | 2010-12-15 | 2012-10-04 | Siltronic Ag | Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben |
| US8572518B2 (en) * | 2011-06-23 | 2013-10-29 | Nikon Precision Inc. | Predicting pattern critical dimensions in a lithographic exposure process |
| US10295993B2 (en) * | 2011-09-01 | 2019-05-21 | Kla-Tencor Corporation | Method and system for detecting and correcting problematic advanced process control parameters |
| JP6166383B2 (ja) * | 2012-12-28 | 2017-07-19 | サンエディソン・セミコンダクター・リミテッドSunEdison Semiconductor Limited | エピタキシャル後反りの予測および制御方法 |
| US9026954B2 (en) * | 2013-03-14 | 2015-05-05 | Globalfoundries Singapore Pte. Ltd. | Surface topography enhanced pattern (STEP) matching |
| US10502694B2 (en) * | 2013-08-06 | 2019-12-10 | Kla-Tencor Corporation | Methods and apparatus for patterned wafer characterization |
| TWI492010B (zh) * | 2013-10-23 | 2015-07-11 | Nat Univ Tsing Hua | Used in the factory to carry out the manufacturing method of verification |
| US9087176B1 (en) * | 2014-03-06 | 2015-07-21 | Kla-Tencor Corporation | Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control |
| US10514685B2 (en) * | 2014-06-13 | 2019-12-24 | KLA—Tencor Corp. | Automatic recipe stability monitoring and reporting |
| KR102521159B1 (ko) * | 2014-11-25 | 2023-04-13 | 피디에프 솔루션즈, 인코포레이티드 | 반도체 제조 공정을 위한 개선된 공정 제어 기술 |
| US10430719B2 (en) * | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US9792393B2 (en) * | 2016-02-08 | 2017-10-17 | Lam Research Corporation | Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization |
| KR102334937B1 (ko) * | 2016-10-21 | 2021-12-03 | 에이에스엠엘 네델란즈 비.브이. | 패터닝 프로세스용 보정 결정 방법 |
| US11275361B2 (en) * | 2017-06-30 | 2022-03-15 | Kla-Tencor Corporation | Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process |
| CN111758152B (zh) * | 2018-02-21 | 2023-10-31 | 胜高股份有限公司 | 晶片的制造方法 |
| SG11202009105YA (en) * | 2018-03-20 | 2020-10-29 | Tokyo Electron Ltd | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same |
| EP3594750A1 (en) * | 2018-07-10 | 2020-01-15 | ASML Netherlands B.V. | Hidden defect detection and epe estimation based on the extracted 3d information from e-beam images |
| US20200033842A1 (en) * | 2018-07-25 | 2020-01-30 | Jtekt Corporation | Grinding quality estimation model generating device, grinding quality estimating device, poor quality factor estimating device, grinding machine operation command data adjustment model generating device, and grinding machine operation command data updating device |
-
2020
- 2020-02-10 US US16/786,579 patent/US11415971B2/en active Active
-
2021
- 2021-02-02 CN CN202180018313.8A patent/CN115244472A/zh active Pending
- 2021-02-02 KR KR1020247030785A patent/KR20240140186A/ko active Pending
- 2021-02-02 EP EP21709175.0A patent/EP4104023B1/en active Active
- 2021-02-02 WO PCT/US2021/016136 patent/WO2021162887A1/en not_active Ceased
- 2021-02-02 KR KR1020227031343A patent/KR102708800B1/ko active Active
- 2021-02-02 JP JP2022548505A patent/JP7661348B2/ja active Active
- 2021-02-08 TW TW110104765A patent/TWI851876B/zh active
-
2022
- 2022-07-06 US US17/810,976 patent/US11846917B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US11846917B2 (en) | 2023-12-19 |
| KR20220140793A (ko) | 2022-10-18 |
| US11415971B2 (en) | 2022-08-16 |
| WO2021162887A1 (en) | 2021-08-19 |
| EP4104023B1 (en) | 2024-06-26 |
| EP4104023A1 (en) | 2022-12-21 |
| JP2023513276A (ja) | 2023-03-30 |
| CN115244472A (zh) | 2022-10-25 |
| US20220334568A1 (en) | 2022-10-20 |
| TWI851876B (zh) | 2024-08-11 |
| US20210247748A1 (en) | 2021-08-12 |
| KR102708800B1 (ko) | 2024-09-23 |
| TW202137026A (zh) | 2021-10-01 |
| JP7661348B2 (ja) | 2025-04-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20240912 Application number text: 1020227031343 Filing date: 20220908 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application |