JP2025512675A5 - - Google Patents
Info
- Publication number
- JP2025512675A5 JP2025512675A5 JP2024550252A JP2024550252A JP2025512675A5 JP 2025512675 A5 JP2025512675 A5 JP 2025512675A5 JP 2024550252 A JP2024550252 A JP 2024550252A JP 2024550252 A JP2024550252 A JP 2024550252A JP 2025512675 A5 JP2025512675 A5 JP 2025512675A5
- Authority
- JP
- Japan
- Prior art keywords
- shape map
- map
- final shape
- thresholds
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/652,571 | 2022-02-25 | ||
| US17/652,571 US12386340B2 (en) | 2022-02-25 | 2022-02-25 | Systems and methods for generating post-polishing topography for enhanced wafer manufacturing |
| PCT/US2023/063117 WO2023164540A1 (en) | 2022-02-25 | 2023-02-23 | Systems and methods for generating post-polishing topography for enhanced wafer manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025512675A JP2025512675A (ja) | 2025-04-22 |
| JP2025512675A5 true JP2025512675A5 (https=) | 2026-03-02 |
Family
ID=85778937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550252A Pending JP2025512675A (ja) | 2022-02-25 | 2023-02-23 | 強化されたウエハ製造のためのポリッシング後のトポグラフィ生成システムおよび方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US12386340B2 (https=) |
| EP (1) | EP4483248A1 (https=) |
| JP (1) | JP2025512675A (https=) |
| KR (1) | KR20240158262A (https=) |
| CN (1) | CN119053925A (https=) |
| TW (1) | TW202349529A (https=) |
| WO (1) | WO2023164540A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117203608A (zh) * | 2021-04-30 | 2023-12-08 | 西门子股份公司 | Hmi屏幕的自动布置 |
| WO2025089152A1 (ja) * | 2023-10-26 | 2025-05-01 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| CN118431103B (zh) * | 2024-07-05 | 2024-10-22 | 西安奕斯伟材料科技股份有限公司 | 晶圆及其表面纳米形貌的预测方法、装置、设备及介质 |
| WO2026015590A1 (en) * | 2024-07-10 | 2026-01-15 | Globalwafers Co., Ltd. | Systems and methods for analyzing nanotopography of front-end processed semiconductor wafers |
| WO2026015756A1 (en) * | 2024-07-11 | 2026-01-15 | Globalwafers Co., Ltd. | Systems and methods for regression filters and zero edge exclusion filters |
| CN118522655A (zh) * | 2024-07-17 | 2024-08-20 | 西安奕斯伟材料科技股份有限公司 | 晶圆及其表面纳米形貌的预测方法、装置、设备及介质 |
| WO2026030291A1 (en) * | 2024-07-29 | 2026-02-05 | Globalwafers Co., Ltd. | Systems and methods for wafer shape classification using machine learning for wire saw process control |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7662023B2 (en) | 2006-01-30 | 2010-02-16 | Memc Electronic Materials, Inc. | Double side wafer grinder and methods for assessing workpiece nanotopology |
| US7930058B2 (en) | 2006-01-30 | 2011-04-19 | Memc Electronic Materials, Inc. | Nanotopography control and optimization using feedback from warp data |
| DE102007035266B4 (de) | 2007-07-27 | 2010-03-25 | Siltronic Ag | Verfahren zum Polieren eines Substrates aus Silicium oder einer Legierung aus Silicium und Germanium |
| US8712575B2 (en) | 2010-03-26 | 2014-04-29 | Memc Electronic Materials, Inc. | Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder |
| DE102010063179B4 (de) | 2010-12-15 | 2012-10-04 | Siltronic Ag | Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben |
| JP6166383B2 (ja) | 2012-12-28 | 2017-07-19 | サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ | エピタキシャル後反りの予測および制御方法 |
| TWI845690B (zh) | 2019-06-06 | 2024-06-21 | 日商東京威力科創股份有限公司 | 基板檢查裝置、基板檢查系統、基板檢查方法及電腦程式產品 |
| US11415971B2 (en) | 2020-02-10 | 2022-08-16 | Globalwafers Co., Ltd. | Systems and methods for enhanced wafer manufacturing |
| US11885767B2 (en) * | 2021-06-21 | 2024-01-30 | Rtx Corporation | Automated scan data quality assessment in ultrasonic testing |
-
2022
- 2022-02-25 US US17/652,571 patent/US12386340B2/en active Active
-
2023
- 2023-02-22 TW TW112106476A patent/TW202349529A/zh unknown
- 2023-02-23 KR KR1020247031667A patent/KR20240158262A/ko active Pending
- 2023-02-23 WO PCT/US2023/063117 patent/WO2023164540A1/en not_active Ceased
- 2023-02-23 EP EP23714026.4A patent/EP4483248A1/en active Pending
- 2023-02-23 CN CN202380029118.4A patent/CN119053925A/zh active Pending
- 2023-02-23 JP JP2024550252A patent/JP2025512675A/ja active Pending
-
2025
- 2025-07-16 US US19/271,067 patent/US20250341824A1/en active Pending
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