JP2025512675A - 強化されたウエハ製造のためのポリッシング後のトポグラフィ生成システムおよび方法 - Google Patents

強化されたウエハ製造のためのポリッシング後のトポグラフィ生成システムおよび方法 Download PDF

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Publication number
JP2025512675A
JP2025512675A JP2024550252A JP2024550252A JP2025512675A JP 2025512675 A JP2025512675 A JP 2025512675A JP 2024550252 A JP2024550252 A JP 2024550252A JP 2024550252 A JP2024550252 A JP 2024550252A JP 2025512675 A JP2025512675 A JP 2025512675A
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JP
Japan
Prior art keywords
map
shape map
wafer
final shape
thresholds
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Pending
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JP2024550252A
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English (en)
Japanese (ja)
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JP2025512675A5 (https=
Inventor
ハラジャデー，ヴァヒド
エス バガバト，スミート
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GlobalWafers Co Ltd
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GlobalWafers Co Ltd
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Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Publication of JP2025512675A publication Critical patent/JP2025512675A/ja
Publication of JP2025512675A5 publication Critical patent/JP2025512675A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37224—Inspect wafer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2024550252A 2022-02-25 2023-02-23 強化されたウエハ製造のためのポリッシング後のトポグラフィ生成システムおよび方法 Pending JP2025512675A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/652,571 2022-02-25
US17/652,571 US12386340B2 (en) 2022-02-25 2022-02-25 Systems and methods for generating post-polishing topography for enhanced wafer manufacturing
PCT/US2023/063117 WO2023164540A1 (en) 2022-02-25 2023-02-23 Systems and methods for generating post-polishing topography for enhanced wafer manufacturing

Publications (2)

Publication Number Publication Date
JP2025512675A true JP2025512675A (ja) 2025-04-22
JP2025512675A5 JP2025512675A5 (https=) 2026-03-02

Family

ID=85778937

Family Applications (1)

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JP2024550252A Pending JP2025512675A (ja) 2022-02-25 2023-02-23 強化されたウエハ製造のためのポリッシング後のトポグラフィ生成システムおよび方法

Country Status (7)

Country Link
US (2) US12386340B2 (https=)
EP (1) EP4483248A1 (https=)
JP (1) JP2025512675A (https=)
KR (1) KR20240158262A (https=)
CN (1) CN119053925A (https=)
TW (1) TW202349529A (https=)
WO (1) WO2023164540A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117203608A (zh) * 2021-04-30 2023-12-08 西门子股份公司 Hmi屏幕的自动布置
WO2025089152A1 (ja) * 2023-10-26 2025-05-01 東京エレクトロン株式会社 基板処理方法及び基板処理システム
CN118431103B (zh) * 2024-07-05 2024-10-22 西安奕斯伟材料科技股份有限公司 晶圆及其表面纳米形貌的预测方法、装置、设备及介质
WO2026015590A1 (en) * 2024-07-10 2026-01-15 Globalwafers Co., Ltd. Systems and methods for analyzing nanotopography of front-end processed semiconductor wafers
WO2026015756A1 (en) * 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Systems and methods for regression filters and zero edge exclusion filters
CN118522655A (zh) * 2024-07-17 2024-08-20 西安奕斯伟材料科技股份有限公司 晶圆及其表面纳米形貌的预测方法、装置、设备及介质
WO2026030291A1 (en) * 2024-07-29 2026-02-05 Globalwafers Co., Ltd. Systems and methods for wafer shape classification using machine learning for wire saw process control

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7662023B2 (en) 2006-01-30 2010-02-16 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
US7930058B2 (en) 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
DE102007035266B4 (de) 2007-07-27 2010-03-25 Siltronic Ag Verfahren zum Polieren eines Substrates aus Silicium oder einer Legierung aus Silicium und Germanium
US8712575B2 (en) 2010-03-26 2014-04-29 Memc Electronic Materials, Inc. Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
DE102010063179B4 (de) 2010-12-15 2012-10-04 Siltronic Ag Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben
JP6166383B2 (ja) 2012-12-28 2017-07-19 サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ エピタキシャル後反りの予測および制御方法
TWI845690B (zh) 2019-06-06 2024-06-21 日商東京威力科創股份有限公司 基板檢查裝置、基板檢查系統、基板檢查方法及電腦程式產品
US11415971B2 (en) 2020-02-10 2022-08-16 Globalwafers Co., Ltd. Systems and methods for enhanced wafer manufacturing
US11885767B2 (en) * 2021-06-21 2024-01-30 Rtx Corporation Automated scan data quality assessment in ultrasonic testing

Also Published As

Publication number Publication date
EP4483248A1 (en) 2025-01-01
TW202349529A (zh) 2023-12-16
US20230274986A1 (en) 2023-08-31
KR20240158262A (ko) 2024-11-04
US20250341824A1 (en) 2025-11-06
WO2023164540A1 (en) 2023-08-31
CN119053925A (zh) 2024-11-29
US12386340B2 (en) 2025-08-12

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