TW202349529A - 用於產生拋光後形貌以供強化晶圓製造之用之系統及方法 - Google Patents

用於產生拋光後形貌以供強化晶圓製造之用之系統及方法 Download PDF

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Publication number
TW202349529A
TW202349529A TW112106476A TW112106476A TW202349529A TW 202349529 A TW202349529 A TW 202349529A TW 112106476 A TW112106476 A TW 112106476A TW 112106476 A TW112106476 A TW 112106476A TW 202349529 A TW202349529 A TW 202349529A
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TW
Taiwan
Prior art keywords
map
shape
wafer
shape map
computer device
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Application number
TW112106476A
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English (en)
Chinese (zh)
Inventor
瓦錫德 卡拉賈迪
桑米特 Ｓ 巴哈格維特
Original Assignee
環球晶圓股份有限公司
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Application filed by 環球晶圓股份有限公司 filed Critical 環球晶圓股份有限公司
Publication of TW202349529A publication Critical patent/TW202349529A/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37224—Inspect wafer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW112106476A 2022-02-25 2023-02-22 用於產生拋光後形貌以供強化晶圓製造之用之系統及方法 TW202349529A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/652,571 2022-02-25
US17/652,571 US12386340B2 (en) 2022-02-25 2022-02-25 Systems and methods for generating post-polishing topography for enhanced wafer manufacturing

Publications (1)

Publication Number Publication Date
TW202349529A true TW202349529A (zh) 2023-12-16

Family

ID=85778937

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112106476A TW202349529A (zh) 2022-02-25 2023-02-22 用於產生拋光後形貌以供強化晶圓製造之用之系統及方法

Country Status (7)

Country Link
US (2) US12386340B2 (https=)
EP (1) EP4483248A1 (https=)
JP (1) JP2025512675A (https=)
KR (1) KR20240158262A (https=)
CN (1) CN119053925A (https=)
TW (1) TW202349529A (https=)
WO (1) WO2023164540A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2026007342A1 (zh) * 2024-07-05 2026-01-08 西安奕斯伟材料科技股份有限公司 晶圆及其表面纳米形貌的预测方法、装置、设备及介质

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* Cited by examiner, † Cited by third party
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CN117203608A (zh) * 2021-04-30 2023-12-08 西门子股份公司 Hmi屏幕的自动布置
WO2025089152A1 (ja) * 2023-10-26 2025-05-01 東京エレクトロン株式会社 基板処理方法及び基板処理システム
WO2026015590A1 (en) * 2024-07-10 2026-01-15 Globalwafers Co., Ltd. Systems and methods for analyzing nanotopography of front-end processed semiconductor wafers
WO2026015756A1 (en) * 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Systems and methods for regression filters and zero edge exclusion filters
CN118522655A (zh) * 2024-07-17 2024-08-20 西安奕斯伟材料科技股份有限公司 晶圆及其表面纳米形貌的预测方法、装置、设备及介质
WO2026030291A1 (en) * 2024-07-29 2026-02-05 Globalwafers Co., Ltd. Systems and methods for wafer shape classification using machine learning for wire saw process control

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Publication number Priority date Publication date Assignee Title
US7662023B2 (en) 2006-01-30 2010-02-16 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
US7930058B2 (en) 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
DE102007035266B4 (de) 2007-07-27 2010-03-25 Siltronic Ag Verfahren zum Polieren eines Substrates aus Silicium oder einer Legierung aus Silicium und Germanium
US8712575B2 (en) 2010-03-26 2014-04-29 Memc Electronic Materials, Inc. Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
DE102010063179B4 (de) 2010-12-15 2012-10-04 Siltronic Ag Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben
JP6166383B2 (ja) 2012-12-28 2017-07-19 サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ エピタキシャル後反りの予測および制御方法
TWI845690B (zh) 2019-06-06 2024-06-21 日商東京威力科創股份有限公司 基板檢查裝置、基板檢查系統、基板檢查方法及電腦程式產品
US11415971B2 (en) 2020-02-10 2022-08-16 Globalwafers Co., Ltd. Systems and methods for enhanced wafer manufacturing
US11885767B2 (en) * 2021-06-21 2024-01-30 Rtx Corporation Automated scan data quality assessment in ultrasonic testing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026007342A1 (zh) * 2024-07-05 2026-01-08 西安奕斯伟材料科技股份有限公司 晶圆及其表面纳米形貌的预测方法、装置、设备及介质

Also Published As

Publication number Publication date
EP4483248A1 (en) 2025-01-01
JP2025512675A (ja) 2025-04-22
US20230274986A1 (en) 2023-08-31
KR20240158262A (ko) 2024-11-04
US20250341824A1 (en) 2025-11-06
WO2023164540A1 (en) 2023-08-31
CN119053925A (zh) 2024-11-29
US12386340B2 (en) 2025-08-12

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