JP2023512448A5 - - Google Patents

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Publication number
JP2023512448A5
JP2023512448A5 JP2022542644A JP2022542644A JP2023512448A5 JP 2023512448 A5 JP2023512448 A5 JP 2023512448A5 JP 2022542644 A JP2022542644 A JP 2022542644A JP 2022542644 A JP2022542644 A JP 2022542644A JP 2023512448 A5 JP2023512448 A5 JP 2023512448A5
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JP
Japan
Prior art keywords
base plate
thermal expansion
coefficient
value
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022542644A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023512448A (ja
JP7805297B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/012593 external-priority patent/WO2021146098A1/en
Publication of JP2023512448A publication Critical patent/JP2023512448A/ja
Publication of JP2023512448A5 publication Critical patent/JP2023512448A5/ja
Priority to JP2026003259A priority Critical patent/JP2026065080A/ja
Application granted granted Critical
Publication of JP7805297B2 publication Critical patent/JP7805297B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022542644A 2020-01-13 2021-01-08 熱酸化物スプレーコートとの熱膨張整合を改善するための混合金属ベースプレート Active JP7805297B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2026003259A JP2026065080A (ja) 2020-01-13 2026-01-13 熱酸化物スプレーコートとの熱膨張整合を改善するための混合金属ベースプレート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062960417P 2020-01-13 2020-01-13
US62/960,417 2020-01-13
PCT/US2021/012593 WO2021146098A1 (en) 2020-01-13 2021-01-08 Mixed metal baseplates for improved thermal expansion matching with thermal oxide spraycoat

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2026003259A Division JP2026065080A (ja) 2020-01-13 2026-01-13 熱酸化物スプレーコートとの熱膨張整合を改善するための混合金属ベースプレート

Publications (3)

Publication Number Publication Date
JP2023512448A JP2023512448A (ja) 2023-03-27
JP2023512448A5 true JP2023512448A5 (https=) 2024-01-09
JP7805297B2 JP7805297B2 (ja) 2026-01-23

Family

ID=76864772

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022542644A Active JP7805297B2 (ja) 2020-01-13 2021-01-08 熱酸化物スプレーコートとの熱膨張整合を改善するための混合金属ベースプレート
JP2026003259A Pending JP2026065080A (ja) 2020-01-13 2026-01-13 熱酸化物スプレーコートとの熱膨張整合を改善するための混合金属ベースプレート

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2026003259A Pending JP2026065080A (ja) 2020-01-13 2026-01-13 熱酸化物スプレーコートとの熱膨張整合を改善するための混合金属ベースプレート

Country Status (5)

Country Link
US (1) US20230039670A1 (https=)
JP (2) JP7805297B2 (https=)
KR (1) KR20220126763A (https=)
CN (1) CN114981950A (https=)
WO (1) WO2021146098A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114830312A (zh) * 2019-12-17 2022-07-29 应用材料公司 腔室部件的表面成形和纹理化
JP7529412B2 (ja) * 2020-02-25 2024-08-06 東京エレクトロン株式会社 プラズマ処理方法およびプラズマ処理装置
CN117020177A (zh) * 2023-07-20 2023-11-10 东莞美景科技有限公司 一种中框制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0790421A (ja) * 1993-09-28 1995-04-04 Toyoda Spinning & Weaving Co Ltd 繊維強化複合金属材料とその製造方法
US5688358A (en) * 1995-03-08 1997-11-18 Applied Materials, Inc. R.F. plasma reactor with larger-than-wafer pedestal conductor
US6596139B2 (en) * 2000-05-31 2003-07-22 Honeywell International Inc. Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications
KR20010111058A (ko) * 2000-06-09 2001-12-15 조셉 제이. 스위니 전체 영역 온도 제어 정전기 척 및 그 제조방법
JP2005150370A (ja) * 2003-11-14 2005-06-09 Kyocera Corp 静電チャック
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
JP2009084686A (ja) * 2007-09-11 2009-04-23 Tokyo Electron Ltd 基板載置機構、基板処理装置、基板載置機構上への膜堆積抑制方法及び記憶媒体
US8619406B2 (en) * 2010-05-28 2013-12-31 Fm Industries, Inc. Substrate supports for semiconductor applications
US9153463B2 (en) * 2011-11-25 2015-10-06 Nhk Spring Co., Ltd. Substrate support device
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
US10008399B2 (en) * 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
US10957572B2 (en) * 2018-05-02 2021-03-23 Applied Materials, Inc. Multi-zone gasket for substrate support assembly
US11562890B2 (en) * 2018-12-06 2023-01-24 Applied Materials, Inc. Corrosion resistant ground shield of processing chamber

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