JP2023509814A5 - - Google Patents
Info
- Publication number
- JP2023509814A5 JP2023509814A5 JP2022524185A JP2022524185A JP2023509814A5 JP 2023509814 A5 JP2023509814 A5 JP 2023509814A5 JP 2022524185 A JP2022524185 A JP 2022524185A JP 2022524185 A JP2022524185 A JP 2022524185A JP 2023509814 A5 JP2023509814 A5 JP 2023509814A5
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- cooling surface
- chamber
- sealing member
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2020/054782 WO2021170209A1 (en) | 2020-02-24 | 2020-02-24 | Vacuum processing apparatus, vacuum system, gas partial pressure control assembly, and method of controlling partial pressure of a gas in a vacuum processing chamber |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023509814A JP2023509814A (ja) | 2023-03-10 |
| JP2023509814A5 true JP2023509814A5 (cg-RX-API-DMAC7.html) | 2023-03-22 |
| JP7518165B2 JP7518165B2 (ja) | 2024-07-17 |
Family
ID=69699884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022524185A Active JP7518165B2 (ja) | 2020-02-24 | 2020-02-24 | 真空処理装置、真空システム、ガス分圧制御アセンブリ、及び真空処理チャンバ内のガス分圧を制御する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240102154A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7518165B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102789786B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN114630922B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI776394B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2021170209A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12695048B2 (en) | 2022-09-13 | 2026-07-28 | Applied Materials, Inc. | Managing beam power effects by varying base emissivity |
| CN115654922B (zh) * | 2022-12-28 | 2023-04-07 | 泰姆瑞（北京）精密技术有限公司 | 连续芯片封装焊接真空炉及其工作方法 |
| CN116949413B (zh) * | 2023-03-16 | 2024-04-12 | 无锡中科德芯感知科技有限公司 | 铟柱制备装置、制备方法、系统、电子设备及存储介质 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4230564B2 (ja) * | 1998-06-11 | 2009-02-25 | パナソニック株式会社 | スパッタリング装置 |
| JP2001254678A (ja) * | 2000-03-10 | 2001-09-21 | Sumitomo Heavy Ind Ltd | クライオポンプ |
| US6440280B1 (en) * | 2000-06-28 | 2002-08-27 | Sola International, Inc. | Multi-anode device and methods for sputter deposition |
| KR101135519B1 (ko) * | 2009-09-25 | 2012-04-09 | 주식회사 선익시스템 | 증발챔버의 진공펌프 보호장치 |
| US20160181066A1 (en) * | 2011-09-29 | 2016-06-23 | Nitride Solutions, Inc. | Laminated materials, methods and apparatus for making same, and uses thereof |
| US9103032B2 (en) * | 2012-11-09 | 2015-08-11 | Tsmc Solar Ltd. | Apparatus and method for forming thin films in solar cells |
| KR102052074B1 (ko) * | 2013-04-04 | 2019-12-05 | 삼성디스플레이 주식회사 | 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법 |
| JP6202098B2 (ja) * | 2013-09-10 | 2017-09-27 | 株式会社島津製作所 | 成膜装置および成膜方法 |
| CN104947039B (zh) * | 2014-03-24 | 2017-07-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 隔热挡板及反应腔室 |
| JP2015216096A (ja) * | 2014-04-25 | 2015-12-03 | シャープ株式会社 | 有機エレクトロルミネッセンス表示装置用基板、有機エレクトロルミネッセンス表示装置、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置の製造装置 |
| CN206624912U (zh) * | 2014-05-20 | 2017-11-10 | 应用材料公司 | 用于在基板上沉积材料的沉积装置 |
| WO2017149413A1 (en) * | 2016-03-04 | 2017-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| WO2017212363A1 (en) * | 2016-06-06 | 2017-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Sputtering apparatus, sputtering target, and method for forming semiconductor film with the sputtering apparatus |
| JP2018053272A (ja) * | 2016-09-26 | 2018-04-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 成膜装置 |
| DE102017106431A1 (de) * | 2017-03-24 | 2018-09-27 | Aixtron Se | Vorrichtung und Verfahren zum Herabsetzen des Wasserpartialdrucks in einer OVPD-Beschichtungseinrichtung |
| CN107489604A (zh) * | 2017-09-26 | 2017-12-19 | 安徽万瑞冷电科技有限公司 | 一种大容量低温泵及其工作方法 |
| JP6843089B2 (ja) * | 2018-04-09 | 2021-03-17 | 東京エレクトロン株式会社 | 結露防止方法および処理装置 |
-
2020
- 2020-02-24 WO PCT/EP2020/054782 patent/WO2021170209A1/en not_active Ceased
- 2020-02-24 US US17/768,799 patent/US20240102154A1/en active Pending
- 2020-02-24 KR KR1020227013474A patent/KR102789786B1/ko active Active
- 2020-02-24 CN CN202080076762.3A patent/CN114630922B/zh active Active
- 2020-02-24 JP JP2022524185A patent/JP7518165B2/ja active Active
-
2021
- 2021-02-20 TW TW110105921A patent/TWI776394B/zh active
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