CN116949413B - 铟柱制备装置、制备方法、系统、电子设备及存储介质 - Google Patents
铟柱制备装置、制备方法、系统、电子设备及存储介质 Download PDFInfo
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- CN116949413B CN116949413B CN202310256799.XA CN202310256799A CN116949413B CN 116949413 B CN116949413 B CN 116949413B CN 202310256799 A CN202310256799 A CN 202310256799A CN 116949413 B CN116949413 B CN 116949413B
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- China
- Prior art keywords
- indium
- focal plane
- temperature
- plane chip
- refrigeration module
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title claims abstract description 184
- 229910052738 indium Inorganic materials 0.000 title claims abstract description 165
- 238000002360 preparation method Methods 0.000 title claims abstract description 37
- 238000003860 storage Methods 0.000 title claims abstract description 12
- 238000005057 refrigeration Methods 0.000 claims abstract description 56
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000010408 film Substances 0.000 claims description 53
- 229920002120 photoresistant polymer Polymers 0.000 claims description 28
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000004590 computer program Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000000206 photolithography Methods 0.000 claims 2
- 239000003507 refrigerant Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310256799.XA CN116949413B (zh) | 2023-03-16 | 2023-03-16 | 铟柱制备装置、制备方法、系统、电子设备及存储介质 |
Applications Claiming Priority (1)
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CN202310256799.XA CN116949413B (zh) | 2023-03-16 | 2023-03-16 | 铟柱制备装置、制备方法、系统、电子设备及存储介质 |
Publications (2)
Publication Number | Publication Date |
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CN116949413A CN116949413A (zh) | 2023-10-27 |
CN116949413B true CN116949413B (zh) | 2024-04-12 |
Family
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Family Applications (1)
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CN202310256799.XA Active CN116949413B (zh) | 2023-03-16 | 2023-03-16 | 铟柱制备装置、制备方法、系统、电子设备及存储介质 |
Country Status (1)
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CN (1) | CN116949413B (zh) |
Citations (15)
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US5092036A (en) * | 1989-06-30 | 1992-03-03 | Hughes Aircraft Company | Ultra-tall indium or alloy bump array for IR detector hybrids and micro-electronics |
KR100657234B1 (ko) * | 2005-07-12 | 2006-12-14 | (주)케이알씨 | 인듐 증착 장치 및 그 인듐을 이용한 소재의 코팅 방법 |
CN101393151A (zh) * | 2008-10-22 | 2009-03-25 | 中国科学院上海技术物理研究所 | 热阻法检测红外焦平面互连铟柱连通性的方法 |
CN101649444A (zh) * | 2009-08-11 | 2010-02-17 | 中国电子科技集团公司第十一研究所 | 一种在碲镉汞探测器芯片表面生长铟柱的方法 |
RU2419178C1 (ru) * | 2010-04-08 | 2011-05-20 | Российская Федерация, от имени которой выступает государственный заказчик Министерство промышленности и торговли Российской Федерации | Способ изготовления индиевых столбиков |
CN102881607A (zh) * | 2012-09-27 | 2013-01-16 | 中国科学院长春光学精密机械与物理研究所 | 一种新型焦平面阵列电互连工艺 |
CN104120397A (zh) * | 2014-07-31 | 2014-10-29 | 深圳市豪威薄膜技术有限公司 | 氧化铟锡低温沉积方法及系统 |
WO2015157880A1 (zh) * | 2014-04-18 | 2015-10-22 | 傅榆 | 用于异形金属上的纳米表面镀层的镀膜方法 |
CN106024982A (zh) * | 2016-07-11 | 2016-10-12 | 中国科学院上海技术物理研究所 | 一种红外焦平面芯片的铟柱制备方法 |
CN108977887A (zh) * | 2018-07-20 | 2018-12-11 | 深圳市科创数字显示技术有限公司 | 单晶氮化铟的生长方法 |
CN111584368A (zh) * | 2020-04-23 | 2020-08-25 | 中国科学院上海技术物理研究所 | 红外焦平面器件用高密度微细铟柱阵列顶端凹点成型方法 |
CN111584672A (zh) * | 2020-04-23 | 2020-08-25 | 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) | 一种红外焦平面探测器的铟柱及其制备方法 |
WO2021170209A1 (en) * | 2020-02-24 | 2021-09-02 | Applied Materials, Inc. | Vacuum processing apparatus, vacuum system, gas partial pressure control assembly, and method of controlling partial pressure of a gas in a vacuum processing chamber |
CN114300604A (zh) * | 2021-12-27 | 2022-04-08 | 中国电子科技集团公司第五十五研究所 | 一种高分辨率Micro-LED微显示器件的高容差铟柱及其制备方法 |
CN217357791U (zh) * | 2022-03-16 | 2022-09-02 | 成都天一国泰真空设备有限公司 | 一种用于真空镀膜机的快速制冷及回温装置 |
-
2023
- 2023-03-16 CN CN202310256799.XA patent/CN116949413B/zh active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US5092036A (en) * | 1989-06-30 | 1992-03-03 | Hughes Aircraft Company | Ultra-tall indium or alloy bump array for IR detector hybrids and micro-electronics |
KR100657234B1 (ko) * | 2005-07-12 | 2006-12-14 | (주)케이알씨 | 인듐 증착 장치 및 그 인듐을 이용한 소재의 코팅 방법 |
CN101393151A (zh) * | 2008-10-22 | 2009-03-25 | 中国科学院上海技术物理研究所 | 热阻法检测红外焦平面互连铟柱连通性的方法 |
CN101649444A (zh) * | 2009-08-11 | 2010-02-17 | 中国电子科技集团公司第十一研究所 | 一种在碲镉汞探测器芯片表面生长铟柱的方法 |
RU2419178C1 (ru) * | 2010-04-08 | 2011-05-20 | Российская Федерация, от имени которой выступает государственный заказчик Министерство промышленности и торговли Российской Федерации | Способ изготовления индиевых столбиков |
CN102881607A (zh) * | 2012-09-27 | 2013-01-16 | 中国科学院长春光学精密机械与物理研究所 | 一种新型焦平面阵列电互连工艺 |
CN105018928A (zh) * | 2014-04-18 | 2015-11-04 | 傅榆 | 用于异形金属上的纳米表面镀层的镀膜方法 |
WO2015157880A1 (zh) * | 2014-04-18 | 2015-10-22 | 傅榆 | 用于异形金属上的纳米表面镀层的镀膜方法 |
CN104120397A (zh) * | 2014-07-31 | 2014-10-29 | 深圳市豪威薄膜技术有限公司 | 氧化铟锡低温沉积方法及系统 |
CN106024982A (zh) * | 2016-07-11 | 2016-10-12 | 中国科学院上海技术物理研究所 | 一种红外焦平面芯片的铟柱制备方法 |
CN108977887A (zh) * | 2018-07-20 | 2018-12-11 | 深圳市科创数字显示技术有限公司 | 单晶氮化铟的生长方法 |
WO2021170209A1 (en) * | 2020-02-24 | 2021-09-02 | Applied Materials, Inc. | Vacuum processing apparatus, vacuum system, gas partial pressure control assembly, and method of controlling partial pressure of a gas in a vacuum processing chamber |
CN111584368A (zh) * | 2020-04-23 | 2020-08-25 | 中国科学院上海技术物理研究所 | 红外焦平面器件用高密度微细铟柱阵列顶端凹点成型方法 |
CN111584672A (zh) * | 2020-04-23 | 2020-08-25 | 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) | 一种红外焦平面探测器的铟柱及其制备方法 |
CN114300604A (zh) * | 2021-12-27 | 2022-04-08 | 中国电子科技集团公司第五十五研究所 | 一种高分辨率Micro-LED微显示器件的高容差铟柱及其制备方法 |
CN217357791U (zh) * | 2022-03-16 | 2022-09-02 | 成都天一国泰真空设备有限公司 | 一种用于真空镀膜机的快速制冷及回温装置 |
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CN116949413A (zh) | 2023-10-27 |
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Effective date of registration: 20240506 Address after: Room 901-910, Jinqian block, No.10, Hongyi Road, Xinwu District, Wuxi City, Jiangsu Province, 214028 Patentee after: Wuxi zhongkedexin perception Technology Co.,Ltd. Country or region after: China Patentee after: SHANGHAI INSTITUTE OF TECHNICAL PHYSICS, CHINESE ACADEMY OF SCIENCE Address before: Room 901-910, Jinqian block, No.10, Hongyi Road, Xinwu District, Wuxi City, Jiangsu Province, 214028 Patentee before: Wuxi zhongkedexin perception Technology Co.,Ltd. Country or region before: China |
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