JP2023505782A5 - - Google Patents
Info
- Publication number
- JP2023505782A5 JP2023505782A5 JP2022534154A JP2022534154A JP2023505782A5 JP 2023505782 A5 JP2023505782 A5 JP 2023505782A5 JP 2022534154 A JP2022534154 A JP 2022534154A JP 2022534154 A JP2022534154 A JP 2022534154A JP 2023505782 A5 JP2023505782 A5 JP 2023505782A5
- Authority
- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025061531A JP2025102932A (ja) | 2019-12-13 | 2025-04-03 | 反り制御とマスク選択比とのバランスを達成するための多状態パルス化 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962948180P | 2019-12-13 | 2019-12-13 | |
| US62/948,180 | 2019-12-13 | ||
| US202062961358P | 2020-01-15 | 2020-01-15 | |
| US62/961,358 | 2020-01-15 | ||
| PCT/US2020/063142 WO2021118862A2 (en) | 2019-12-13 | 2020-12-03 | Multi-state pulsing for achieving a balance between bow control and mask selectivity |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025061531A Division JP2025102932A (ja) | 2019-12-13 | 2025-04-03 | 反り制御とマスク選択比とのバランスを達成するための多状態パルス化 |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2023505782A JP2023505782A (ja) | 2023-02-13 |
| JP2023505782A5 true JP2023505782A5 (https=) | 2024-11-19 |
| JPWO2021118862A5 JPWO2021118862A5 (https=) | 2024-11-19 |
| JP7662638B2 JP7662638B2 (ja) | 2025-04-15 |
Family
ID=76330734
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022534154A Active JP7662638B2 (ja) | 2019-12-13 | 2020-12-03 | 反り制御とマスク選択比とのバランスを達成するための多状態パルス化 |
| JP2025061531A Pending JP2025102932A (ja) | 2019-12-13 | 2025-04-03 | 反り制御とマスク選択比とのバランスを達成するための多状態パルス化 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025061531A Pending JP2025102932A (ja) | 2019-12-13 | 2025-04-03 | 反り制御とマスク選択比とのバランスを達成するための多状態パルス化 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US12217972B2 (https=) |
| JP (2) | JP7662638B2 (https=) |
| KR (1) | KR20220113502A (https=) |
| CN (1) | CN114787972A (https=) |
| WO (1) | WO2021118862A2 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114342049B (zh) * | 2019-08-22 | 2025-08-19 | 朗姆研究公司 | 用于控制掩模形状并打破选择性与工艺裕度权衡的多态rf脉冲 |
| US12609283B2 (en) * | 2020-06-15 | 2026-04-21 | Lam Research Corporation | Control of pulsing frequencies and duty cycles of parameters of RF signals |
| US20230215694A1 (en) * | 2021-02-05 | 2023-07-06 | Lam Research Corporation | Duty cycle control to achieve uniformity |
| US11694876B2 (en) * | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
| US12456607B2 (en) * | 2021-12-15 | 2025-10-28 | Applied Materials, Inc. | Auxiliary plasma source for robust ignition and restrikes in a plasma chamber |
| WO2023136913A1 (en) * | 2022-01-14 | 2023-07-20 | Lam Research Corporation | Method to control etch profile by rf pulsing |
| WO2024107552A1 (en) * | 2022-11-16 | 2024-05-23 | Lam Research Corporation | Systems and methods for driving passivation to increase an etch rate |
| CN119170473B (zh) * | 2023-06-19 | 2025-10-10 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其脉冲调节等离子体方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9462672B2 (en) | 2012-02-22 | 2016-10-04 | Lam Research Corporation | Adjustment of power and frequency based on three or more states |
| JP6002556B2 (ja) | 2012-11-27 | 2016-10-05 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| CN105453230B (zh) | 2013-08-16 | 2019-06-14 | 应用材料公司 | 用六氟化钨(wf6)回蚀进行钨沉积 |
| JP6320248B2 (ja) | 2014-03-04 | 2018-05-09 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
| US9691625B2 (en) | 2015-11-04 | 2017-06-27 | Lam Research Corporation | Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level |
| JP6568822B2 (ja) | 2016-05-16 | 2019-08-28 | 東京エレクトロン株式会社 | エッチング方法 |
| US10553465B2 (en) | 2016-07-25 | 2020-02-04 | Lam Research Corporation | Control of water bow in multiple stations |
| US10347498B2 (en) | 2016-12-31 | 2019-07-09 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Methods of minimizing plasma-induced sidewall damage during low K etch processes |
| JP6883495B2 (ja) | 2017-09-04 | 2021-06-09 | 東京エレクトロン株式会社 | エッチング方法 |
| US10002746B1 (en) | 2017-09-13 | 2018-06-19 | Lam Research Corporation | Multi regime plasma wafer processing to increase directionality of ions |
| JP7366918B2 (ja) | 2018-03-16 | 2023-10-23 | ラム リサーチ コーポレーション | 誘電体における高アスペクト比フィーチャのプラズマエッチング化学物質 |
| US10504744B1 (en) | 2018-07-19 | 2019-12-10 | Lam Research Corporation | Three or more states for achieving high aspect ratio dielectric etch |
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2020
- 2020-12-03 WO PCT/US2020/063142 patent/WO2021118862A2/en not_active Ceased
- 2020-12-03 JP JP2022534154A patent/JP7662638B2/ja active Active
- 2020-12-03 KR KR1020227024032A patent/KR20220113502A/ko not_active Ceased
- 2020-12-03 US US17/779,520 patent/US12217972B2/en active Active
- 2020-12-03 CN CN202080086253.9A patent/CN114787972A/zh active Pending
-
2025
- 2025-01-06 US US19/011,455 patent/US20250140565A1/en active Pending
- 2025-04-03 JP JP2025061531A patent/JP2025102932A/ja active Pending