JP2023174600A - 接着剤用洗浄剤組成物 - Google Patents

接着剤用洗浄剤組成物 Download PDF

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Publication number
JP2023174600A
JP2023174600A JP2023086468A JP2023086468A JP2023174600A JP 2023174600 A JP2023174600 A JP 2023174600A JP 2023086468 A JP2023086468 A JP 2023086468A JP 2023086468 A JP2023086468 A JP 2023086468A JP 2023174600 A JP2023174600 A JP 2023174600A
Authority
JP
Japan
Prior art keywords
component
adhesive
mass
less
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023086468A
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English (en)
Japanese (ja)
Other versions
JP2023174600A5 (https=
Inventor
晃平 山田
Kohei Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of JP2023174600A publication Critical patent/JP2023174600A/ja
Publication of JP2023174600A5 publication Critical patent/JP2023174600A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/82—Compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/18—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/56—Cleaning of wafer backside
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/124—Preparing bulk and homogeneous wafers by processing the backside of the wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023086468A 2022-05-27 2023-05-25 接着剤用洗浄剤組成物 Pending JP2023174600A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022087164 2022-05-27
JP2022087164 2022-05-27

Publications (2)

Publication Number Publication Date
JP2023174600A true JP2023174600A (ja) 2023-12-07
JP2023174600A5 JP2023174600A5 (https=) 2026-04-10

Family

ID=88919422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023086468A Pending JP2023174600A (ja) 2022-05-27 2023-05-25 接着剤用洗浄剤組成物

Country Status (5)

Country Link
JP (1) JP2023174600A (https=)
KR (1) KR20250019013A (https=)
CN (1) CN118742997A (https=)
TW (1) TW202407086A (https=)
WO (1) WO2023228996A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04111314A (ja) * 1990-08-31 1992-04-13 Nippon Steel Chem Co Ltd ウエハ研磨用接着剤
JP3624809B2 (ja) * 2000-02-29 2005-03-02 昭和電工株式会社 洗浄剤組成物、洗浄方法及びその用途
JP4350364B2 (ja) * 2002-12-12 2009-10-21 昭和電工株式会社 洗浄剤組成物、半導体ウェーハの洗浄方法および製造方法
WO2014057860A1 (ja) * 2012-10-11 2014-04-17 セントラル硝子株式会社 基板の洗浄方法および洗浄液組成物
JP6381994B2 (ja) * 2014-06-27 2018-08-29 東京応化工業株式会社 剥離用組成物及び剥離方法
TWI732764B (zh) * 2015-06-01 2021-07-11 日商富士軟片股份有限公司 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組
JP2019183030A (ja) * 2018-04-12 2019-10-24 東京応化工業株式会社 剥離用組成物、接着剤を剥離する方法、及び電子部品の製造方法
WO2020179819A1 (ja) * 2019-03-05 2020-09-10 日産化学株式会社 洗浄剤組成物及び洗浄方法
JP7220119B2 (ja) * 2019-05-22 2023-02-09 信越化学工業株式会社 基板用仮接着剤の洗浄液、基板の洗浄方法および支持体または基板の洗浄方法

Also Published As

Publication number Publication date
KR20250019013A (ko) 2025-02-07
CN118742997A (zh) 2024-10-01
WO2023228996A1 (ja) 2023-11-30
TW202407086A (zh) 2024-02-16

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