JP2023172703A5 - - Google Patents

Download PDF

Info

Publication number
JP2023172703A5
JP2023172703A5 JP2022084683A JP2022084683A JP2023172703A5 JP 2023172703 A5 JP2023172703 A5 JP 2023172703A5 JP 2022084683 A JP2022084683 A JP 2022084683A JP 2022084683 A JP2022084683 A JP 2022084683A JP 2023172703 A5 JP2023172703 A5 JP 2023172703A5
Authority
JP
Japan
Prior art keywords
component
cleaning
mass
less
cleaning method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022084683A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023172703A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2022084683A priority Critical patent/JP2023172703A/ja
Priority claimed from JP2022084683A external-priority patent/JP2023172703A/ja
Publication of JP2023172703A publication Critical patent/JP2023172703A/ja
Publication of JP2023172703A5 publication Critical patent/JP2023172703A5/ja
Pending legal-status Critical Current

Links

JP2022084683A 2022-05-24 2022-05-24 洗浄方法 Pending JP2023172703A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022084683A JP2023172703A (ja) 2022-05-24 2022-05-24 洗浄方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022084683A JP2023172703A (ja) 2022-05-24 2022-05-24 洗浄方法

Publications (2)

Publication Number Publication Date
JP2023172703A JP2023172703A (ja) 2023-12-06
JP2023172703A5 true JP2023172703A5 (cg-RX-API-DMAC7.html) 2025-03-04

Family

ID=89029277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022084683A Pending JP2023172703A (ja) 2022-05-24 2022-05-24 洗浄方法

Country Status (1)

Country Link
JP (1) JP2023172703A (cg-RX-API-DMAC7.html)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0578507B1 (en) * 1992-07-09 2005-09-28 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
JP2007165416A (ja) * 2005-12-09 2007-06-28 Fujifilm Corp 回路基板の製造方法及び回路基板
WO2009051237A1 (ja) * 2007-10-17 2009-04-23 Henkel Corporation 剥離液組成物、それを用いた樹脂層の剥離方法
US8357646B2 (en) * 2008-03-07 2013-01-22 Air Products And Chemicals, Inc. Stripper for dry film removal
CN102411269A (zh) * 2011-11-18 2012-04-11 西安东旺精细化学有限公司 光致抗蚀剂膜的剥离液组合物
JP2014157339A (ja) * 2013-02-18 2014-08-28 Lion Corp レジスト剥離剤組成物

Similar Documents

Publication Publication Date Title
WO2010060274A1 (zh) 一种光刻胶清洗剂组合物
TWI751293B (zh) 微電路形成方法
WO2015000211A1 (zh) 一种新型的光刻胶剥离液及其应用工艺
JP2008509554A5 (cg-RX-API-DMAC7.html)
TW201835384A (zh) 利用導電金屬薄膜晶種層與蝕刻劑組合物之選擇性蝕刻形成電路之方法
CN1407409A (zh) 抗蚀剂和蚀刻副产品除去组合物及使用该组合物除去抗蚀剂的方法
JP3962239B2 (ja) エッチング剤組成物及びパターン形成方法
CN117821182A (zh) 一种芯片清洗液、其制备方法及应用
WO2021020410A1 (ja) フォトレジスト除去用組成物
JP2023172703A5 (cg-RX-API-DMAC7.html)
JP2013527323A (ja) 銅および銅合金のマイクロエッチングのための組成物および方法
JP3964189B2 (ja) 無電解メッキ用触媒および金属メッキパターンの形成方法
JPWO2021210599A5 (cg-RX-API-DMAC7.html)
JP5371465B2 (ja) 非シアン無電解金めっき液及び導体パターンのめっき方法
JPH10168578A (ja) 無電解金めっき方法
JP2000241991A (ja) ホトレジスト用剥離液組成物およびこれを用いたホトレジスト剥離方法
JPWO2023286555A5 (cg-RX-API-DMAC7.html)
JP5480277B2 (ja) 表面のはんだ付け性を向上させる方法
JP2024049897A5 (cg-RX-API-DMAC7.html)
JP2004317641A (ja) 非有機溶剤型レジスト剥離剤組成物
TWI669994B (zh) Method for manufacturing miniaturized circuit and its products
CN102039282A (zh) 半导体晶圆的清洗方法
JP2025007286A5 (cg-RX-API-DMAC7.html)
KR100970067B1 (ko) 스루홀을 가진 프린트 배선 기판에의 무전해 도금용 촉매,및 그 촉매를 이용하여 처리된 스루홀을 가진 프린트 배선기판
CN115315788B (zh) 半导体基板的清洗方法、经加工的半导体基板的制造方法以及剥离用组合物