JP2023170262A - 基板研磨方法、プログラム、および、基板研磨装置 - Google Patents

基板研磨方法、プログラム、および、基板研磨装置 Download PDF

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Publication number
JP2023170262A
JP2023170262A JP2022081873A JP2022081873A JP2023170262A JP 2023170262 A JP2023170262 A JP 2023170262A JP 2022081873 A JP2022081873 A JP 2022081873A JP 2022081873 A JP2022081873 A JP 2022081873A JP 2023170262 A JP2023170262 A JP 2023170262A
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JP
Japan
Prior art keywords
substrate
polishing
top ring
thickness
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022081873A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023170262A5 (enExample
Inventor
歩 斎藤
Ayumi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2022081873A priority Critical patent/JP2023170262A/ja
Priority to KR1020247039693A priority patent/KR20250011125A/ko
Priority to US18/866,312 priority patent/US20250312882A1/en
Priority to EP23807562.6A priority patent/EP4527553A1/en
Priority to CN202380053519.3A priority patent/CN119546417A/zh
Priority to PCT/JP2023/017893 priority patent/WO2023223959A1/ja
Priority to TW112118257A priority patent/TW202408724A/zh
Publication of JP2023170262A publication Critical patent/JP2023170262A/ja
Publication of JP2023170262A5 publication Critical patent/JP2023170262A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2022081873A 2022-05-18 2022-05-18 基板研磨方法、プログラム、および、基板研磨装置 Pending JP2023170262A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2022081873A JP2023170262A (ja) 2022-05-18 2022-05-18 基板研磨方法、プログラム、および、基板研磨装置
KR1020247039693A KR20250011125A (ko) 2022-05-18 2023-05-12 기판 연마 방법, 프로그램, 및 기판 연마 장치
US18/866,312 US20250312882A1 (en) 2022-05-18 2023-05-12 Substrate polishing method, program, and substrate polishing apparatus
EP23807562.6A EP4527553A1 (en) 2022-05-18 2023-05-12 Substrate polishing method, program, and substrate polishing device
CN202380053519.3A CN119546417A (zh) 2022-05-18 2023-05-12 基板研磨方法、程序及基板研磨装置
PCT/JP2023/017893 WO2023223959A1 (ja) 2022-05-18 2023-05-12 基板研磨方法、プログラム、および、基板研磨装置
TW112118257A TW202408724A (zh) 2022-05-18 2023-05-17 基板研磨方法、程式及基板研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022081873A JP2023170262A (ja) 2022-05-18 2022-05-18 基板研磨方法、プログラム、および、基板研磨装置

Publications (2)

Publication Number Publication Date
JP2023170262A true JP2023170262A (ja) 2023-12-01
JP2023170262A5 JP2023170262A5 (enExample) 2025-05-21

Family

ID=88835408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022081873A Pending JP2023170262A (ja) 2022-05-18 2022-05-18 基板研磨方法、プログラム、および、基板研磨装置

Country Status (7)

Country Link
US (1) US20250312882A1 (enExample)
EP (1) EP4527553A1 (enExample)
JP (1) JP2023170262A (enExample)
KR (1) KR20250011125A (enExample)
CN (1) CN119546417A (enExample)
TW (1) TW202408724A (enExample)
WO (1) WO2023223959A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025105383A (ja) * 2023-12-29 2025-07-10 江蘇科維儀表控制工程有限公司 膜の研磨装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0917760A (ja) * 1995-06-26 1997-01-17 Mitsubishi Materials Shilicon Corp 半導体ウェーハの研磨方法およびその装置
JP3798960B2 (ja) 2001-09-28 2006-07-19 株式会社荏原製作所 四辺形基板の研磨装置
JP2003158104A (ja) * 2001-11-22 2003-05-30 Disco Abrasive Syst Ltd 研磨装置
JP5390807B2 (ja) 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5384992B2 (ja) * 2009-04-20 2014-01-08 株式会社岡本工作機械製作所 研磨装置に用いる基板保持ヘッド
JP2014176950A (ja) 2013-02-12 2014-09-25 Ebara Corp 研磨装置、及び研磨パッド貼り付け方法
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
JP7453784B2 (ja) * 2019-12-18 2024-03-21 株式会社荏原製作所 プッシャ、基板搬送装置、および基板処理装置
JP2022081873A (ja) 2020-11-20 2022-06-01 シチズン時計株式会社 エポキシ樹脂硬化物の剥離剤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025105383A (ja) * 2023-12-29 2025-07-10 江蘇科維儀表控制工程有限公司 膜の研磨装置

Also Published As

Publication number Publication date
US20250312882A1 (en) 2025-10-09
WO2023223959A1 (ja) 2023-11-23
EP4527553A1 (en) 2025-03-26
CN119546417A (zh) 2025-02-28
KR20250011125A (ko) 2025-01-21
TW202408724A (zh) 2024-03-01

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