TW202408724A - 基板研磨方法、程式及基板研磨裝置 - Google Patents

基板研磨方法、程式及基板研磨裝置 Download PDF

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Publication number
TW202408724A
TW202408724A TW112118257A TW112118257A TW202408724A TW 202408724 A TW202408724 A TW 202408724A TW 112118257 A TW112118257 A TW 112118257A TW 112118257 A TW112118257 A TW 112118257A TW 202408724 A TW202408724 A TW 202408724A
Authority
TW
Taiwan
Prior art keywords
substrate
polishing
top ring
thickness
sensor
Prior art date
Application number
TW112118257A
Other languages
English (en)
Chinese (zh)
Inventor
斎藤歩
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202408724A publication Critical patent/TW202408724A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW112118257A 2022-05-18 2023-05-17 基板研磨方法、程式及基板研磨裝置 TW202408724A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-081873 2022-05-18
JP2022081873A JP2023170262A (ja) 2022-05-18 2022-05-18 基板研磨方法、プログラム、および、基板研磨装置

Publications (1)

Publication Number Publication Date
TW202408724A true TW202408724A (zh) 2024-03-01

Family

ID=88835408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112118257A TW202408724A (zh) 2022-05-18 2023-05-17 基板研磨方法、程式及基板研磨裝置

Country Status (7)

Country Link
US (1) US20250312882A1 (enExample)
EP (1) EP4527553A1 (enExample)
JP (1) JP2023170262A (enExample)
KR (1) KR20250011125A (enExample)
CN (1) CN119546417A (enExample)
TW (1) TW202408724A (enExample)
WO (1) WO2023223959A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117564914A (zh) * 2023-12-29 2024-02-20 江苏科维仪表控制工程有限公司 一种膜片抛光装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0917760A (ja) * 1995-06-26 1997-01-17 Mitsubishi Materials Shilicon Corp 半導体ウェーハの研磨方法およびその装置
JP3798960B2 (ja) 2001-09-28 2006-07-19 株式会社荏原製作所 四辺形基板の研磨装置
JP2003158104A (ja) * 2001-11-22 2003-05-30 Disco Abrasive Syst Ltd 研磨装置
JP5390807B2 (ja) 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5384992B2 (ja) * 2009-04-20 2014-01-08 株式会社岡本工作機械製作所 研磨装置に用いる基板保持ヘッド
JP2014176950A (ja) 2013-02-12 2014-09-25 Ebara Corp 研磨装置、及び研磨パッド貼り付け方法
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
JP7453784B2 (ja) * 2019-12-18 2024-03-21 株式会社荏原製作所 プッシャ、基板搬送装置、および基板処理装置
JP2022081873A (ja) 2020-11-20 2022-06-01 シチズン時計株式会社 エポキシ樹脂硬化物の剥離剤

Also Published As

Publication number Publication date
US20250312882A1 (en) 2025-10-09
JP2023170262A (ja) 2023-12-01
WO2023223959A1 (ja) 2023-11-23
EP4527553A1 (en) 2025-03-26
CN119546417A (zh) 2025-02-28
KR20250011125A (ko) 2025-01-21

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