JP2023167124A - Chip peeling device and chip peeling method - Google Patents

Abstract

To provide a chip peeling device which enables downsizing of the device and reduction of chips, and to provide a chip peeling method.SOLUTION: A chip peeling device 100 includes a housing 101 having a placing surface 111 capable of placing a wafer 10 thereon, having a recessed portion 113 and first vacuum suction holes 112 on the placing surface 111, and having second vacuum suction holes 115, blow holes 116, and protrusions 114 in the recessed portion 113. The chip peeling device further includes: a vacuum suction source 102 that evacuates the first vacuum suction holes 112 and the second vacuum suction holes 115; a pressure detector 105 that detects a degree of vacuum of the second vacuum suction holes 115; a pressurization source 107 that sends a fluid to the blow holes 116; a controller 106 that determines a flow rate of the fluid to be sent to the blow holes 116 based on the degree of vacuum; and a flow rate control valve 108 which controls a flow rate of the fluid to the flow rate determined by the controller 106. The controller 106 provides control to evacuate the second vacuum suction holes 115 and send the fluid to the blow holes 116.SELECTED DRAWING: Figure 1

Description

The present invention relates to a chip peeling apparatus and a chip peeling method, and more particularly, to a chip peeling apparatus and a chip peeling method used in semiconductor manufacturing equipment.

In the semiconductor packaging process, there is a die bonding process in which diced chips are peeled off using a chip peeling device, picked up, and mounted on another wafer.

Chip peeling methods include a method of pushing up the chip along with the dicing tape using a sharp pin. For example, when pushing up a thin chip with a size of 10 mm square and 30 μm or less, the chip is thin and the tip of the pin is sharp, so cracks and chips occur from the pushed up part.

Patent Documents 1 to 3 are being considered as methods to solve this problem. Patent Document 1 describes a chip peeling device in which the ejector at the bottom of the dicing tape has a sliding type. Further, Patent Document 2 describes a split-type chip peeling device. Patent Document 3 describes a chip peeling device with a devised push-up shape.

Patent No. 5184303 Japanese Patent Application Publication No. 2013-214739 Patent No. 4816598

However, the chip peeling apparatuses disclosed in Patent Documents 1 to 3 have a problem that the mechanism is complicated and occupies the space of the apparatus, resulting in an increase in the size of the apparatus.

A chip peeling apparatus according to an embodiment has a mounting surface on which a wafer can be mounted, a recess and a first vacuum suction hole in the recess, a second vacuum suction hole in the recess, and a blower. A housing having a hole and a protrusion, a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole, and a pressure detector that detects the degree of vacuum of the second vacuum suction hole. a pressure source that sends fluid to the blow hole; a controller that determines the flow rate of the fluid to be sent to the blow hole based on the degree of vacuum; and a flow rate that controls the fluid to the flow rate determined by the controller. A control valve is provided, and the controller evacuates the second vacuum suction hole and controls sending fluid to the blow hole.

According to the chip peeling device of one embodiment, since the vacuum suction pressure is controlled by the pressurized flow rate, cracking and chipping can be reduced by suppressing rapid chip deformation during vacuum suction.

In the chip peeling apparatus of one embodiment, the opening area of the blow hole is smaller than the opening area of the second vacuum suction hole.

According to the chip peeling device of one embodiment, the occurrence of sudden pressure can be suppressed.

In one embodiment of the chip peeling apparatus, the controller controls the flow rate of the fluid sent to the blowhole to decrease over time.

According to the chip peeling apparatus of one embodiment, a sudden increase in vacuum pressure can be prevented.

In one embodiment of the chip peeling device, the housing has a block portion that can protrude from the recess.

According to the chip peeling apparatus of one embodiment, by pressurizing the chip to be peeled with fluid and raising the chip, peeling at the four corners around the chip can be promoted.

In one embodiment of the chip peeling apparatus, the flow rate control valve is a servo valve that can periodically change the flow rate.

According to the chip peeling device of one embodiment, chip peeling can be promoted by vibration force while changing the cycle of pressurization.

A chip peeling method according to an embodiment includes a mounting surface on which a wafer can be mounted, a recess and a first vacuum suction hole in the recess, a second vacuum suction hole in the recess, and a blower. A housing having a hole and a protrusion, a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole, and a pressure detector that detects the degree of vacuum of the second vacuum suction hole. In the chip peeling apparatus, the chip peeling apparatus includes: a pressure source that sends a fluid to the blow hole; and a flow rate control valve that controls the flow rate of the fluid; The fluid is now controlled to be delivered to the

According to the chip peeling method of one embodiment, since the vacuum suction pressure is controlled by the pressurized flow rate, cracking and chipping can be reduced by suppressing rapid chip deformation during vacuum suction.

According to the chip peeling device and the chip peeling method of the present invention, the device can be miniaturized, and the vacuum suction pressure is controlled by the pressurized flow rate, so that cracking and chipping can be prevented by suppressing rapid chip deformation during vacuum suction. Can be reduced.

1 is a cross-sectional view showing an example of a chip peeling device according to a first embodiment. 1 is a top perspective view showing an example of a chip peeling device according to a first embodiment; FIG. FIG. 3 is a top view showing an example of a recess 113 of the chip peeling device according to the first embodiment. 1 is a cross-sectional view showing an example of a chip peeling device according to a first embodiment. 1 is a cross-sectional view showing an example of a chip peeling device according to a first embodiment. It is a graph comparing presence and absence of flow rate control. FIG. 2 is a cross-sectional view showing an example of a chip peeling device according to a second embodiment. FIG. 3 is a top view for explaining peeling. FIG. 7 is a cross-sectional view showing an example of a chip peeling device according to a third embodiment. FIG. 7 is a cross-sectional view showing an example of a chip peeling device according to a third embodiment.

(Embodiment 1)
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of a chip peeling apparatus according to a first embodiment. In FIG. 1, the chip peeling apparatus 100 includes a housing 101, a vacuum suction source 102, a first valve 103, a second valve 104, a pressure detector 105, a controller 106, a pressurization source 107, and a flow rate control A valve 108 is provided. The picker 20 is configured to pick up the chips 12 from the semiconductor wafer 10 from which the dicing tape 11 has been peeled off. In FIG. 1, an example will be described in which the downward direction of the drawing is the direction of gravity.

A diced semiconductor wafer 10 is placed on a placement surface 111 of the housing 101 . Vacuum suction holes 112 are distributed throughout the mounting surface 111. Furthermore, a recess 113 is provided on the mounting surface 111 in an area the size of one chip. FIG. 2 is a top perspective view showing an example of the chip peeling apparatus according to the first embodiment. Further, FIG. 3 is a top view showing an example of the recess 113 of the chip peeling device according to the first embodiment. As shown in FIGS. 1 to 3, this recess 113 is provided with a protrusion 114, a vacuum suction hole 115, and a blow hole 116. As shown in FIG. 1, the upper end of the protrusion 114 is at the same height as the mounting surface 111.

Further, the opening area of the blow hole 116 is smaller than the opening area of the vacuum suction hole 115. Depending on the size of the hole area, sudden pressurization can be suppressed.

Furthermore, a block portion 117 that is movable up and down is provided in the recessed portion 113 of the housing 101 . The housing 101 and the block portion 117 constitute an ejector. That is, the protrusion 114, the vacuum suction hole 115, and the blow hole 116 are provided in the block portion 117 of the housing 101.

Returning to FIG. 1, the vacuum suction source 102 evacuates the vacuum suction hole 112 via the first valve 103. Further, the vacuum suction source 102 evacuates the vacuum suction hole 115 via the second valve 104 .

The first valve 103 is a stop valve provided in the middle of a pipe connecting the vacuum suction hole 112 and the vacuum suction source 102.

The second valve 104 is a stop valve provided in the middle of a pipe connecting the vacuum suction hole 115 and the vacuum suction source 102.

The pressure detector 105 detects the pressure sucked from the vacuum suction hole 115 (that is, the pressure in the space formed by the semiconductor wafer 10 and the recess 113 of the housing 101). The pressure detector 105 then outputs the detected pressure value to the controller 106.

Controller 106 adjusts the flow rate at flow control valve 108 based on the pressure value detected by pressure detector 105. Further, the controller 106 controls opening and closing of the first valve 103 and the second valve 104. Details of control by the controller 106 will be described later.

Pressure source 107 pressurizes semiconductor wafer 10 by supplying fluid to blow hole 116 via flow control valve 108 . The fluid is preferably a gas. Preferably, the fluid is an inert gas. For example, the pressurization source 107 is preferably a pressurization pump or a cylinder filled with gas.

Flow control valve 108 adjusts the amount of fluid delivered from pressurization source 107 to blowhole 116 according to instructions from controller 106 .

With the above configuration, the chip peeling apparatus 100 peels the dicing tape 11 from the chips 12. Next, the operation of the chip peeling apparatus 100 will be explained. 4 and 5 are cross-sectional views showing an example of the chip peeling apparatus according to the first embodiment. Further, FIG. 6 is a graph comparing the presence and absence of flow rate control. The operations described below are controlled by the controller 106.

First, as shown in FIG. 4A, in the chip peeling apparatus 100, the diced semiconductor wafer 10 with rings is placed on (the housing 101 of) the ejector. The tape is peeled off from the chip on this ejector.

Next, the height of the ejector is moved to the same height as the dicing tape 11 while the horizontal position of the recess 113 of the ejector is aligned with the chip 12 to be peeled.

Then, as shown in FIG. 4B, the dicing tape 11 is vacuum suctioned by the vacuum suction source 102 of the ejector.

Then, the vacuum pressure is detected by the pressure detector 105, and pressurized air is introduced into the blow hole 116 via the flow rate control valve 108 provided on the pressurizing side to control so as to prevent a sudden increase in the vacuum pressure. Figure 6 shows the changes in vacuum pressure with and without flow rate control. In FIG. 6, the vertical axis indicates the degree of vacuum. Moreover, the horizontal axis shows time. As shown in FIG. 6, a rapid increase in vacuum pressure is prevented by controlling the flow rate of pressurized air to decrease over time. As a result of vacuum suction of the dicing tape 11, the result is as shown in A of FIG.

Then, as shown in FIG. 5B, the block portion 117 is raised by an actuator (not shown) or the like so as not to come into contact with adjacent chips.

The pick-up head of the picker 20 is placed above the chip 12 and lowered to approach the chip 12 and adsorb the chip 12 by vacuum suction at a position where it can be adsorbed. By this operation, the chip is picked up as shown in FIG. 5C.
Through the above operations, chips are picked up from the semiconductor wafer.

The concave portion 113 of the housing 101 is previously provided with a protrusion 114 (or groove) in the shape of a base for vacuum suction. With this shape, the contact area between the chip 12 and the tape 11 can be limited to the protrusion 114 when vacuum suction is performed, so that the contact area between the chip 12 and the tape 11 can be reduced and separation can be promoted.

For example, when forming a central groove, it is preferable that the central groove is smaller than the size of the chip to be peeled and has an area ratio of 90% to 99% with respect to the chip.

Further, the depth of the groove is preferably 100 μm to 500 μm in addition to the thickness of the dicing tape.

It is desirable that the apex position of the protrusion 114 is movable so that it can protrude from the housing 101 of the ejector by 100 μm to 500 μm.

The diameter of the vacuum suction hole 112 and the vacuum suction hole 115 is preferably about 0.5 mm. Further, it is desirable that the diameter of the pressurizing blow hole 116 be considerably smaller than the diameters of the vacuum suction holes 112 and 115. Specifically, the diameter of the blow hole 116 is preferably 0.1 mm or less.
By performing vacuum suction using the vacuum suction source 102, the dicing tape 11 is suctioned, and accordingly, the dicing contact area between the chip 12 and the tape 11 is reduced, and the chip 12 is peeled off from the semiconductor wafer 10.

As described above, according to the chip peeling apparatus of the first embodiment, since the vacuum suction pressure is controlled by the pressurized flow rate, cracking and chipping can be reduced by suppressing rapid chip deformation during vacuum suction. Further, according to the chip peeling apparatus of the first embodiment, the drive system can be miniaturized because the block portion is minutely driven. Further, according to the chip peeling apparatus of the first embodiment, since the vacuum pressure is controlled using pressurized air, the response is faster than controlling only with a vacuum valve, and the time until peeling can be shortened.

(Embodiment 2)
In Embodiment 2, an example will be described in which the recessed portion is raised only by applying pressure. The configuration of the chip peeling apparatus of the second embodiment is the same as that of the chip peeling apparatus of the first embodiment, but the operation is different.

The operation will be explained using FIG. 7. FIG. 7 is a cross-sectional view showing an example of a chip peeling apparatus according to the second embodiment. Moreover, FIG. 8 is a top view for explaining peeling.

First, as shown in FIG. 7A, in the chip peeling apparatus 100, the diced semiconductor wafer 10 with rings is placed on (the housing 101 of) the ejector. The tape is peeled off from the chip on this ejector.

Next, the height of the ejector is moved to the same height as the dicing tape 11 while the horizontal position of the recess 113 of the ejector is aligned with the chip 12 to be peeled.

Then, as shown in FIG. 7B, pressurized air is introduced into the blow hole 116 via the flow rate control valve 108 provided on the pressurizing side, and is blocked by an actuator (not shown) to prevent it from coming into contact with the adjacent chip. part 117 is raised. This operation lifts the tape and chip and bends the tape into an arched shape, thereby promoting peeling at the four corners around the chip. In other words, peeling of the portion surrounded by a circle 801 in FIG. 8 is promoted.

Then, as shown in FIG. 7C, the block portion 117 is lowered by an actuator or the like (not shown), and the dicing tape 11 is vacuum suctioned by the vacuum suction source 102 of the ejector. Further, the vacuum pressure is detected by the pressure detector 105, and pressurized air is introduced into the blow hole 116 via the flow control valve 108 provided on the pressurizing side.

The pick-up head of the picker 20 is placed above the chip 12 and lowered to approach the chip 12 and adsorb the chip 12 by vacuum suction at a position where it can be adsorbed. By this operation, the chip is picked up as shown in D of FIG.

In this manner, according to the chip peeling apparatus of the second embodiment, by pressurizing the chip to be peeled with fluid and raising it, peeling of the four corners around the chip can be promoted.

(Embodiment 3)
In Embodiment 3, an example will be described in which a servo valve is provided in the flow path on the pressurizing side. FIG. 9 is a cross-sectional view showing an example of a chip peeling apparatus according to the third embodiment. In FIG. 9, a chip peeling apparatus 900 includes a housing 101, a vacuum suction source 102, a first valve 103, a second valve 104, a pressure detector 105, a controller 906, a pressure source 107, and a servo valve. 908. In FIG. 9, the same components as those in FIG. 1 are given the same numbers, and the description thereof will be omitted.

Controller 906 adjusts the flow rate at servo valve 908 based on the pressure value detected by pressure detector 105. Further, the controller 106 controls opening and closing of the first valve 103 and the second valve 104. The details of the control of the controller 906 are the same as the controller 106 of the first embodiment plus the control of the servo valve 908.

Servo valve 908 adjusts the amount of fluid delivered from pressurization source 107 to blowhole 116 according to instructions from controller 906 . Specifically, servo valve 908 periodically adjusts the amount of fluid.

Next, the operation of the chip peeling apparatus 900 will be explained. FIG. 10 is a cross-sectional view showing an example of a chip peeling apparatus according to the third embodiment. The operations described below are controlled by controller 906.

First, as shown in FIG. 10A, in the chip peeling apparatus 100, the diced semiconductor wafer 10 with rings is placed on (the housing 101 of) the ejector. The tape is peeled off from the chip on this ejector.

Next, the height of the ejector is moved to the same height as the dicing tape 11 while the horizontal position of the recess 113 of the ejector is aligned with the chip 12 to be peeled.

Then, as shown in FIG. 10B, pressurized air is introduced into the blow hole 116 via a servo valve 908 provided on the pressurizing side.

Then, as shown in FIG. 10C, the dicing tape 11 is vacuum suctioned by the vacuum suction source 102 of the ejector.

The pressurization shown in B in FIG. 10 and the vacuum suction shown in C in FIG. 10 are repeated alternately.

Then, the pick-up head of the picker 20 is placed above the chip 12 and lowered to approach the chip 12 and pick up the chip 12 by vacuum suction at a position where it can be picked up. By this operation, the chip is picked up as shown in FIG. 10D.
Through the above operations, chips are picked up from the semiconductor wafer.

In this way, according to the chip peeling device of the third embodiment, chip peeling can be promoted by the force of vibration while changing the cycle of pressurization.

Note that the present invention is not limited to the above embodiments, and can be modified as appropriate without departing from the spirit. For example, in the above embodiment, the gravity direction is described as being downward in the drawing, but the gravity direction may be implemented in other directions.

10 Semiconductor wafer 11 Dicing tape 12 Chip 20 Picker 100, 900 Chip peeling device 101 Housing 102 Vacuum suction source 103 First valve 104 Second valve 105 Pressure detector 106, 906 Controller 107 Pressure source 108 Flow rate control valve 111 Placement surface 112, 115 Vacuum suction hole 113 Recess 114 Protrusion 116 Blow hole 117 Block portion 908 Servo valve

Claims (10)

A housing having a placement surface on which a wafer can be placed, a recess and a first vacuum suction hole in the placement surface, and a second vacuum suction hole, a blow hole, and a protrusion in the recess; ,
a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole;
a pressure detector that detects the degree of vacuum of the second vacuum suction hole;
a pressurizing source that delivers fluid to the blowhole;
a controller that determines the flow rate of fluid sent to the blowhole based on the degree of vacuum;
a flow rate control valve that controls the fluid to a flow rate determined by the controller;
Equipped with
In the chip peeling device, the controller evacuates the second vacuum suction hole and controls sending fluid to the blow hole. The chip peeling apparatus according to claim 1, wherein the opening area of the blow hole is smaller than the opening area of the second vacuum suction hole. The chip peeling apparatus according to claim 1, wherein the controller controls the flow rate of the fluid sent to the blowhole to decrease over time. The chip peeling apparatus according to claim 2, wherein the controller controls the flow rate of the fluid sent to the blowhole to decrease over time. The chip peeling device according to claim 1, wherein the housing has a block portion that can protrude from the recess. The chip peeling device according to claim 2, wherein the housing has a block portion that can protrude from the recess. 4. The chip peeling device according to claim 3, wherein the housing includes a block portion that can protrude from the recess. The chip peeling device according to claim 4, wherein the housing includes a block portion that can protrude from the recess. The chip peeling apparatus according to any one of claims 1 to 8, wherein the flow rate control valve is a servo valve that can periodically change the flow rate. A housing having a placement surface on which a wafer can be placed, a recess and a first vacuum suction hole in the placement surface, and a second vacuum suction hole, a blow hole, and a protrusion in the recess; ,
a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole;
a pressure detector that detects the degree of vacuum of the second vacuum suction hole;
a pressurizing source that delivers fluid to the blowhole;
a flow rate control valve that controls the flow rate of the fluid;
In a chip peeling device comprising:
A chip peeling method in which the second vacuum suction hole is evacuated and a fluid is controlled to be sent to the blow hole.

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