JP2023159356A5 - - Google Patents
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- Publication number
- JP2023159356A5 JP2023159356A5 JP2023136348A JP2023136348A JP2023159356A5 JP 2023159356 A5 JP2023159356 A5 JP 2023159356A5 JP 2023136348 A JP2023136348 A JP 2023136348A JP 2023136348 A JP2023136348 A JP 2023136348A JP 2023159356 A5 JP2023159356 A5 JP 2023159356A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- component
- composition according
- conductive potting
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 23
- 238000004382 potting Methods 0.000 claims 16
- 239000002245 particle Substances 0.000 claims 6
- 239000004593 Epoxy Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000003085 diluting agent Substances 0.000 claims 3
- 125000000524 functional group Chemical group 0.000 claims 3
- 150000008065 acid anhydrides Chemical class 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 239000011258 core-shell material Substances 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 239000002105 nanoparticle Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023136348A JP2023159356A (ja) | 2018-10-29 | 2023-08-24 | 熱伝導性注封組成物 |
| JP2025081179A JP2025122035A (ja) | 2018-10-29 | 2025-05-14 | 熱伝導性注封組成物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021547612A JP2022517694A (ja) | 2018-10-29 | 2018-10-29 | 熱伝導性注封組成物 |
| PCT/CN2018/112319 WO2020087196A1 (en) | 2018-10-29 | 2018-10-29 | Thermal conductive potting composition |
| JP2023136348A JP2023159356A (ja) | 2018-10-29 | 2023-08-24 | 熱伝導性注封組成物 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021547612A Division JP2022517694A (ja) | 2018-10-29 | 2018-10-29 | 熱伝導性注封組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025081179A Division JP2025122035A (ja) | 2018-10-29 | 2025-05-14 | 熱伝導性注封組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023159356A JP2023159356A (ja) | 2023-10-31 |
| JP2023159356A5 true JP2023159356A5 (OSRAM) | 2024-02-19 |
Family
ID=70464384
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021547612A Pending JP2022517694A (ja) | 2018-10-29 | 2018-10-29 | 熱伝導性注封組成物 |
| JP2023136348A Pending JP2023159356A (ja) | 2018-10-29 | 2023-08-24 | 熱伝導性注封組成物 |
| JP2025081179A Pending JP2025122035A (ja) | 2018-10-29 | 2025-05-14 | 熱伝導性注封組成物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021547612A Pending JP2022517694A (ja) | 2018-10-29 | 2018-10-29 | 熱伝導性注封組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025081179A Pending JP2025122035A (ja) | 2018-10-29 | 2025-05-14 | 熱伝導性注封組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12503586B2 (OSRAM) |
| EP (1) | EP3873986B1 (OSRAM) |
| JP (3) | JP2022517694A (OSRAM) |
| KR (1) | KR102644123B1 (OSRAM) |
| CN (1) | CN113242884B (OSRAM) |
| CA (1) | CA3117241A1 (OSRAM) |
| ES (1) | ES3062588T3 (OSRAM) |
| WO (1) | WO2020087196A1 (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113242884B (zh) | 2018-10-29 | 2023-12-08 | 汉高股份有限及两合公司 | 导热封装组合物 |
| JP7853135B2 (ja) * | 2022-03-29 | 2026-04-28 | 株式会社カネカ | 硬化性樹脂組成物、その硬化物、接着剤および積層体 |
| EP4631988A1 (en) | 2024-04-11 | 2025-10-15 | Henkel AG & Co. KGaA | Thermally conductive potting composition |
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| US4419496A (en) * | 1982-02-22 | 1983-12-06 | The Dow Chemical Company | Particle agglomeration in rubber latices |
| US4871806A (en) * | 1987-11-16 | 1989-10-03 | The Sherwin-Williams Company | Reactive coatings comprising an acid-functional compound, an anhydride-functional compound, an epoxy-functional compound and a hydroxy-functional compound |
| JP3454437B2 (ja) * | 1992-10-02 | 2003-10-06 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | 低粘度無溶媒の一液型エポキシ樹脂接着性組成物 |
| JP2000239489A (ja) | 1999-02-22 | 2000-09-05 | Nippon Kayaku Co Ltd | 封止材用液状エポキシ樹脂組成物及びその硬化物 |
| EP1094087B1 (en) * | 1999-03-11 | 2004-09-08 | Toray Industries, Inc. | Epoxy resin composition, epoxy resin composition for fiber-reinforced composite, and fiber-reinforced composite containing the same |
| JP4798848B2 (ja) * | 1999-03-16 | 2011-10-19 | ハンツマン アドバンスト マテリアルズ （スイッツァランド） ゲーエムベーハー | 特別な性質の組合せを有する硬化性組成物 |
| DE19912251A1 (de) * | 1999-03-18 | 2000-09-21 | Espe Dental Ag | Zweikomponentige Zubereitungen zur Herstellung von zahntechnischen Modellen |
| JP2002158450A (ja) * | 2000-09-06 | 2002-05-31 | Ngk Spark Plug Co Ltd | 配線基板 |
| US7192997B2 (en) * | 2001-02-07 | 2007-03-20 | International Business Machines Corporation | Encapsulant composition and electronic package utilizing same |
| US6512182B2 (en) | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
| DE10138127A1 (de) | 2001-08-03 | 2003-02-27 | Henkel Kgaa | Bindemittelkomponente für Oberflächenbeschichtungsmittel mit verbesserten Hafteigenschaften |
| JP2006045343A (ja) | 2004-08-04 | 2006-02-16 | Yaskawa Electric Corp | 注形用エポキシ樹脂組成物およびそれを用いた電動機用モールドコイル |
| US20080039555A1 (en) * | 2006-08-10 | 2008-02-14 | Michel Ruyters | Thermally conductive material |
| US20090023056A1 (en) * | 2007-07-18 | 2009-01-22 | Tesla Motors, Inc. | Battery pack thermal management system |
| JP2009073933A (ja) * | 2007-09-20 | 2009-04-09 | Toto Kasei Co Ltd | 耐熱劣化性を有するエポキシ樹脂組成物 |
| JP4614107B2 (ja) * | 2008-06-20 | 2011-01-19 | 住友電気工業株式会社 | 半導体装置 |
| JP4495768B2 (ja) * | 2008-08-18 | 2010-07-07 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
| JP2010132838A (ja) * | 2008-12-08 | 2010-06-17 | Mitsubishi Electric Corp | 高熱伝導性熱硬化性樹脂組成物 |
| WO2010103852A1 (ja) * | 2009-03-12 | 2010-09-16 | 国立大学法人信州大学 | 熱伝導性材料及びその製造方法並びに大電流用インダクタ |
| DE102010022523B4 (de) * | 2010-06-02 | 2017-09-14 | Siemens Healthcare Gmbh | Gradientenspule mit in einer Vergussmasse vergossenen Spulenwicklungen |
| JP6030126B2 (ja) | 2011-05-13 | 2016-11-24 | ダウ グローバル テクノロジーズ エルエルシー | 絶縁配合物 |
| BR112013033329B1 (pt) | 2011-06-26 | 2022-09-20 | Inductotherm Corp | Caixa de contenção e vazamento de metal fundido, e, método para vazar um metal fundido de uma caixa de contenção e vazamento de metal fundido |
| US8895148B2 (en) * | 2011-11-09 | 2014-11-25 | Cytec Technology Corp. | Structural adhesive and bonding application thereof |
| CN103987790A (zh) * | 2011-12-27 | 2014-08-13 | 松下电器产业株式会社 | 导热性树脂组合物 |
| JP2013144763A (ja) * | 2012-01-16 | 2013-07-25 | Shin-Etsu Chemical Co Ltd | 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置 |
| WO2014092196A1 (ja) * | 2012-12-11 | 2014-06-19 | 東レ・ダウコーニング株式会社 | 透明性に優れた高屈折率熱伝導性組成物、それからなる熱伝導性グリース、熱伝導性硬化物、熱軟化性熱伝導性組成物およびその用途 |
| JP5708666B2 (ja) | 2013-01-08 | 2015-04-30 | 日立化成株式会社 | 液状エポキシ樹脂組成物及び電子部品装置 |
| KR101715207B1 (ko) * | 2013-03-06 | 2017-03-10 | 디아이씨 가부시끼가이샤 | 에폭시 수지 조성물, 경화물, 방열 재료 및 전자 부재 |
| JP2015021118A (ja) * | 2013-07-23 | 2015-02-02 | スリーエム イノベイティブ プロパティズ カンパニー | ２液型ポッティング組成物 |
| CN106471035B (zh) * | 2014-07-02 | 2019-04-16 | Dic株式会社 | 电子材料用环氧树脂组合物、其固化物及电子构件 |
| US20170349795A1 (en) * | 2015-02-11 | 2017-12-07 | Dow Global Technologies Llc | Low temperature curable adhesives and use thereof |
| JP6655359B2 (ja) * | 2015-11-09 | 2020-02-26 | 京セラ株式会社 | 電子・電気部品の製造方法及びエポキシ樹脂組成物 |
| KR102716321B1 (ko) | 2016-05-24 | 2024-10-14 | 주식회사 아모그린텍 | 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛 |
| TWI647995B (zh) * | 2016-05-30 | 2019-01-11 | Industrial Technology Research Institute | 插拔式功率模組及次系統 |
| US10767040B2 (en) * | 2016-06-20 | 2020-09-08 | Sika Technology Ag | Thermosetting epoxy resin compositions useful as structural reinforcement or structural foam |
| GB201613414D0 (en) * | 2016-08-03 | 2016-09-14 | Dow Corning | Elastomeric compositions and their applications |
| JP2018069708A (ja) * | 2016-11-04 | 2018-05-10 | Dic株式会社 | 積層体、電子部材及び熱伝導性部材 |
| CN106519581B (zh) | 2016-11-29 | 2018-11-02 | 华中科技大学 | 一种高导热低粘度环氧树脂复合材料及其制备方法和应用 |
| CN106753143A (zh) * | 2016-12-21 | 2017-05-31 | 南京诺邦新材料有限公司 | 一种具有导热功能的低温固化底部填充胶及其制备方法 |
| CN106753205B (zh) * | 2017-01-11 | 2020-05-22 | 湖南博翔新材料有限公司 | 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用 |
| WO2019070819A1 (en) * | 2017-10-06 | 2019-04-11 | 3M Innovative Properties Company | CURABLE COMPOSITIONS, ARTICLES MADE THEREFROM, AND METHODS OF PREPARATION AND USE |
| CN113242884B (zh) | 2018-10-29 | 2023-12-08 | 汉高股份有限及两合公司 | 导热封装组合物 |
-
2018
- 2018-10-29 CN CN201880099023.9A patent/CN113242884B/zh active Active
- 2018-10-29 CA CA3117241A patent/CA3117241A1/en active Pending
- 2018-10-29 WO PCT/CN2018/112319 patent/WO2020087196A1/en not_active Ceased
- 2018-10-29 ES ES18938949T patent/ES3062588T3/es active Active
- 2018-10-29 JP JP2021547612A patent/JP2022517694A/ja active Pending
- 2018-10-29 EP EP18938949.7A patent/EP3873986B1/en active Active
- 2018-10-29 KR KR1020217012373A patent/KR102644123B1/ko active Active
-
2021
- 2021-04-26 US US17/239,789 patent/US12503586B2/en active Active
-
2023
- 2023-08-24 JP JP2023136348A patent/JP2023159356A/ja active Pending
-
2025
- 2025-05-14 JP JP2025081179A patent/JP2025122035A/ja active Pending
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