JP2023134339A - プローブカード装置 - Google Patents
プローブカード装置 Download PDFInfo
- Publication number
- JP2023134339A JP2023134339A JP2022171257A JP2022171257A JP2023134339A JP 2023134339 A JP2023134339 A JP 2023134339A JP 2022171257 A JP2022171257 A JP 2022171257A JP 2022171257 A JP2022171257 A JP 2022171257A JP 2023134339 A JP2023134339 A JP 2023134339A
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- Prior art keywords
- thin film
- substrate
- film substrate
- ceramic substrate
- glass substrate
- Prior art date
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- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 157
- 239000010409 thin film Substances 0.000 claims abstract description 115
- 239000000919 ceramic Substances 0.000 claims abstract description 51
- 239000011521 glass Substances 0.000 claims abstract description 31
- 238000012360 testing method Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 238000002109 crystal growth method Methods 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 235000012431 wafers Nutrition 0.000 description 17
- 239000011295 pitch Substances 0.000 description 12
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
2002 プローブ
202 薄膜基板
204 セラミック基板
206 薄膜基板
2020、2060 第1薄膜接点
2022 第2薄膜接点
2062 第2薄膜接点(電気的接点)
2024、2064 内部金属層
2026、2066 第1表面誘電体層
2028、2068 内部誘電体層
2030、2070 第2表面誘電体層
2032、2072 薄膜本体
2040 本体
2042 垂直ビアホール
2044 導電性物質
2046 電気的接点
A、C、E 第1面
B、D、F 第2面
Claims (5)
- 対向する第1面と第2面とを有する薄膜基板と、
該薄膜基板の該第1面上に設けられ、変形能力を有しておらず、該薄膜基板と一体成形される複数のプローブと、
結晶成長方法で生成されたセラミック基板又はガラス基板であって、対向する第1面と第2面とを有し、該セラミック基板又は該ガラス基板の該第1面と該第2面とを電気的に接続するように、それ自体が導電性物質を充填する垂直ビアホールを有し、該セラミック基板又は該ガラス基板の該第1面が該薄膜基板の該第2面上に設けられて、該薄膜基板に電気的に接続される該セラミック基板又は該ガラス基板と、
他の回路基板に電気的に接続されるための、該セラミック基板又は該ガラス基板の該第2面に設けられる電気的接点又は該第2面に電気的に接続された他の薄膜基板と、を含むプローブカード装置。 - 該セラミック基板又は該ガラス基板の該第1面と該薄膜基板の該第2面との間に隙間はなく、該セラミック基板又は該ガラス基板の該第2面と該他の薄膜基板との間に隙間はない請求項1に記載のプローブカード装置。
- 該薄膜基板と該他の薄膜基板との間の水平引張力の不均一に起因する該セラミック基板又は該ガラス基板の反りや変形を解消するように、該薄膜基板と該他の薄膜基板とは、該セラミック基板又は該ガラス基板に対する水平引張力が略等しい請求項2に記載のプローブカード装置。
- 該セラミック基板の材料は、酸化アルミニウム又は窒化アルミニウムである請求項1に記載のプローブカード装置。
- 該セラミック基板又は該ガラス基板の該電気的接点又は該他の薄膜基板は、ウエハテストのためのテスト信号を生成して受信するテスタに直接電気的に接続されている請求項1に記載のプローブカード装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111109274 | 2022-03-14 | ||
TW111109274A TWI798027B (zh) | 2022-03-14 | 2022-03-14 | 探針卡裝置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023134339A true JP2023134339A (ja) | 2023-09-27 |
Family
ID=86945096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022171257A Pending JP2023134339A (ja) | 2022-03-14 | 2022-10-26 | プローブカード装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230288450A1 (ja) |
JP (1) | JP2023134339A (ja) |
KR (1) | KR20230134420A (ja) |
CN (1) | CN116794362A (ja) |
TW (1) | TWI798027B (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6133534A (en) * | 1991-11-29 | 2000-10-17 | Hitachi Chemical Company, Ltd. | Wiring board for electrical tests with bumps having polymeric coating |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
JP6304263B2 (ja) * | 2014-01-17 | 2018-04-04 | 株式会社村田製作所 | 積層配線基板およびこれを備える検査装置 |
CN104793026B (zh) * | 2014-01-20 | 2018-09-28 | 旺矽科技股份有限公司 | 应用于探针测试装置的支撑结构及其制作方法 |
JP6691762B2 (ja) * | 2015-11-03 | 2020-05-13 | 日本特殊陶業株式会社 | 検査用配線基板 |
WO2017150232A1 (ja) * | 2016-03-03 | 2017-09-08 | 株式会社村田製作所 | プローブカード用積層配線基板およびこれを備えるプローブカード |
TWI663406B (zh) * | 2016-05-31 | 2019-06-21 | 巨擘科技股份有限公司 | 探針卡裝置 |
JP2019049498A (ja) * | 2017-09-12 | 2019-03-28 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板 |
JP6889672B2 (ja) * | 2018-02-19 | 2021-06-18 | 日本特殊陶業株式会社 | 検査装置用配線基板 |
TWI728531B (zh) * | 2019-10-30 | 2021-05-21 | 巨擘科技股份有限公司 | 探針卡裝置 |
KR20210119814A (ko) * | 2020-03-25 | 2021-10-06 | (주)포인트엔지니어링 | 프로브 헤드 및 이를 구비하는 프로브 카드 |
KR20210131691A (ko) * | 2020-04-24 | 2021-11-03 | (주)포인트엔지니어링 | 적층형 양극산화막 구조체 및 이를 이용한 프로브 카드의 가이드 플레이트 및 이를 구비하는 프로브 카드 |
-
2022
- 2022-03-14 TW TW111109274A patent/TWI798027B/zh active
- 2022-06-10 CN CN202210651985.9A patent/CN116794362A/zh active Pending
- 2022-08-09 US US17/883,830 patent/US20230288450A1/en active Pending
- 2022-10-26 JP JP2022171257A patent/JP2023134339A/ja active Pending
-
2023
- 2023-02-06 KR KR1020230015413A patent/KR20230134420A/ko unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230134420A (ko) | 2023-09-21 |
US20230288450A1 (en) | 2023-09-14 |
TW202336444A (zh) | 2023-09-16 |
TWI798027B (zh) | 2023-04-01 |
CN116794362A (zh) | 2023-09-22 |
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