JP2023096615A - 電気的接続装置 - Google Patents
電気的接続装置 Download PDFInfo
- Publication number
- JP2023096615A JP2023096615A JP2021212495A JP2021212495A JP2023096615A JP 2023096615 A JP2023096615 A JP 2023096615A JP 2021212495 A JP2021212495 A JP 2021212495A JP 2021212495 A JP2021212495 A JP 2021212495A JP 2023096615 A JP2023096615 A JP 2023096615A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- main surface
- electrical connection
- connection device
- support substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000012360 testing method Methods 0.000 claims description 30
- 238000007689 inspection Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 239000000523 sample Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021212495A JP2023096615A (ja) | 2021-12-27 | 2021-12-27 | 電気的接続装置 |
| TW111142818A TWI828410B (zh) | 2021-12-27 | 2022-11-09 | 電性連接裝置 |
| CN202211511041.8A CN116359555A (zh) | 2021-12-27 | 2022-11-29 | 电连接装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021212495A JP2023096615A (ja) | 2021-12-27 | 2021-12-27 | 電気的接続装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2023096615A true JP2023096615A (ja) | 2023-07-07 |
Family
ID=86925740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021212495A Pending JP2023096615A (ja) | 2021-12-27 | 2021-12-27 | 電気的接続装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2023096615A (zh) |
| CN (1) | CN116359555A (zh) |
| TW (1) | TWI828410B (zh) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7346026B2 (ja) * | 2018-12-26 | 2023-09-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP7381209B2 (ja) * | 2019-03-06 | 2023-11-15 | 株式会社日本マイクロニクス | 電気的接続装置 |
-
2021
- 2021-12-27 JP JP2021212495A patent/JP2023096615A/ja active Pending
-
2022
- 2022-11-09 TW TW111142818A patent/TWI828410B/zh active
- 2022-11-29 CN CN202211511041.8A patent/CN116359555A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116359555A (zh) | 2023-06-30 |
| TWI828410B (zh) | 2024-01-01 |
| TW202328693A (zh) | 2023-07-16 |
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