JP2023093410A5 - - Google Patents

Info

Publication number
JP2023093410A5
JP2023093410A5 JP2022205081A JP2022205081A JP2023093410A5 JP 2023093410 A5 JP2023093410 A5 JP 2023093410A5 JP 2022205081 A JP2022205081 A JP 2022205081A JP 2022205081 A JP2022205081 A JP 2022205081A JP 2023093410 A5 JP2023093410 A5 JP 2023093410A5
Authority
JP
Japan
Prior art keywords
layer
gallium nitride
iii
integrated circuit
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022205081A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023093410A (ja
Filing date
Publication date
Priority claimed from US17/559,635 external-priority patent/US11888027B2/en
Application filed filed Critical
Publication of JP2023093410A publication Critical patent/JP2023093410A/ja
Publication of JP2023093410A5 publication Critical patent/JP2023093410A5/ja
Pending legal-status Critical Current

Links

JP2022205081A 2021-12-22 2022-12-22 スクリーニングバックゲート効果を有するハイサイド及びローサイドGaN FETのモノリシック集積化 Pending JP2023093410A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/559,635 2021-12-22
US17/559,635 US11888027B2 (en) 2021-12-22 2021-12-22 Monolithic integration of high and low-side GaN FETs with screening back gating effect

Publications (2)

Publication Number Publication Date
JP2023093410A JP2023093410A (ja) 2023-07-04
JP2023093410A5 true JP2023093410A5 (https=) 2026-01-06

Family

ID=84547290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022205081A Pending JP2023093410A (ja) 2021-12-22 2022-12-22 スクリーニングバックゲート効果を有するハイサイド及びローサイドGaN FETのモノリシック集積化

Country Status (4)

Country Link
US (2) US11888027B2 (https=)
EP (1) EP4203034A1 (https=)
JP (1) JP2023093410A (https=)
CN (1) CN116344580A (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6500879B2 (ja) * 2016-08-30 2019-04-17 株式会社三洋物産 遊技機
JP7235153B2 (ja) * 2017-12-29 2023-03-08 株式会社三洋物産 遊技機
JP7235154B2 (ja) * 2018-02-15 2023-03-08 株式会社三洋物産 遊技機
JP7231076B2 (ja) * 2018-03-08 2023-03-01 株式会社三洋物産 遊技機
JP2020130466A (ja) * 2019-02-15 2020-08-31 株式会社三洋物産 遊技機
JP7234741B2 (ja) * 2019-03-28 2023-03-08 株式会社三洋物産 遊技機
JP7234740B2 (ja) * 2019-03-28 2023-03-08 株式会社三洋物産 遊技機
JP7234760B2 (ja) * 2019-04-11 2023-03-08 株式会社三洋物産 遊技機
JP7234761B2 (ja) * 2019-04-11 2023-03-08 株式会社三洋物産 遊技機
JP2023063369A (ja) * 2022-01-07 2023-05-09 株式会社三洋物産 遊技機
JP2023053387A (ja) * 2022-02-04 2023-04-12 株式会社三洋物産 遊技機
JP2023060270A (ja) * 2022-04-01 2023-04-27 株式会社三洋物産 遊技機
JP2023060269A (ja) * 2022-04-01 2023-04-27 株式会社三洋物産 遊技機

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5669119B1 (ja) 2014-04-18 2015-02-12 株式会社パウデック 半導体素子、電気機器、双方向電界効果トランジスタおよび実装構造体
JP2019505459A (ja) * 2015-12-10 2019-02-28 アイキューイー ピーエルシーIQE plc 増加した圧縮応力によってシリコン基板上で成長させたiii族窒化物構造物
US11049960B2 (en) 2019-03-06 2021-06-29 Texas Instruments Incorporated Gallium nitride (GaN) based transistor with multiple p-GaN blocks
US11211481B2 (en) 2020-01-13 2021-12-28 Cambridge Gan Devices Limited III-V semiconductor device
EP3905523B1 (en) 2020-04-30 2024-06-19 Infineon Technologies Austria AG Switching circuit, gate driver and method of operating a transistor device
US11362190B2 (en) * 2020-05-22 2022-06-14 Raytheon Company Depletion mode high electron mobility field effect transistor (HEMT) semiconductor device having beryllium doped Schottky contact layers

Similar Documents

Publication Publication Date Title
JP2023093410A5 (https=)
US11798947B2 (en) Semiconductor device
US9231075B2 (en) Semiconductor device including gate electrode provided over active region in p-type nitride semiconductor layer and method of manufacturing the same, and power supply apparatus
US9064712B2 (en) Monolithic microwave integrated circuit
CN103582951B (zh) 具有连接至源极的背栅的GaN HEMT
US10199260B1 (en) Contact hole structure and method of fabricating the same
CN104319238A (zh) 形成高电子迁移率半导体器件的方法及其结构
US10763170B2 (en) Semiconductor device including buried insulation layer and manufacturing method thereof
TW201637215A (zh) 功率金氧半導體場效電晶體及其製作方法
CN116344450B (zh) 半导体结构及其形成方法
CN104051511B (zh) 半导体器件及其制造方法
WO2014115305A1 (ja) 半導体装置
US10679899B2 (en) Semiconductor device including monolithically integrated PMOS and NMOS transistors
CN1965412B (zh) 互补氮化物晶体管垂直和共用漏极
CN117238958A (zh) 一种基于GaN与碳纳米管的CMOS逻辑电路及其制备方法
US20210273118A1 (en) Semiconductor Device
CN108022926A (zh) 半导体器件及其形成方法
CN113410200B (zh) 一种芯片封装框架和芯片封装结构
TW202541634A (zh) P型氮化鎵半導體裝置及其製作方法
TWI720077B (zh) 半導體元件的布局
CN114641865B (zh) 场效晶体管结构及其制造方法
US11444154B2 (en) Semiconductor device with a protected element
CN118969796A (zh) 半导体器件及其制造方法
TW202517039A (zh) 高電子遷移率電晶體
TW518697B (en) Production-method of field-effect-transistors in integrated semiconductor-circuits and an integrated semiconductor-circuit produced with such a field-effect-transistor