JP2023079242A5 - - Google Patents
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- JP2023079242A5 JP2023079242A5 JP2021192604A JP2021192604A JP2023079242A5 JP 2023079242 A5 JP2023079242 A5 JP 2023079242A5 JP 2021192604 A JP2021192604 A JP 2021192604A JP 2021192604 A JP2021192604 A JP 2021192604A JP 2023079242 A5 JP2023079242 A5 JP 2023079242A5
- Authority
- JP
- Japan
- Prior art keywords
- low
- temperature solder
- alloy
- temperature
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910000679 solder Inorganic materials 0.000 claims 30
- 239000000463 material Substances 0.000 claims 24
- 229910045601 alloy Inorganic materials 0.000 claims 14
- 239000000956 alloy Substances 0.000 claims 14
- 229910052738 indium Inorganic materials 0.000 claims 11
- 229910052797 bismuth Inorganic materials 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000002844 melting Methods 0.000 claims 8
- 230000008018 melting Effects 0.000 claims 8
- 229910052698 phosphorus Inorganic materials 0.000 claims 6
- 229910052782 aluminium Inorganic materials 0.000 claims 5
- 238000005275 alloying Methods 0.000 claims 4
- 229910052787 antimony Inorganic materials 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000005476 soldering Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229910052718 tin Inorganic materials 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 238000002156 mixing Methods 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910018978 Sn—In—Bi Inorganic materials 0.000 claims 2
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 claims 2
- 229910052788 barium Inorganic materials 0.000 claims 2
- 229920002678 cellulose Polymers 0.000 claims 2
- 239000001913 cellulose Substances 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 239000011147 inorganic material Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000004973 liquid crystal related substance Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910020830 Sn-Bi Inorganic materials 0.000 claims 1
- 229910018728 Sn—Bi Inorganic materials 0.000 claims 1
- 229910018956 Sn—In Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- -1 or In Inorganic materials 0.000 claims 1
- 239000000123 paper Substances 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021192604A JP2023079242A (ja) | 2021-11-27 | 2021-11-27 | 低温半田、低温半田の製造方法、および低温半田被覆リード線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021192604A JP2023079242A (ja) | 2021-11-27 | 2021-11-27 | 低温半田、低温半田の製造方法、および低温半田被覆リード線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023079242A JP2023079242A (ja) | 2023-06-08 |
| JP2023079242A5 true JP2023079242A5 (enExample) | 2024-11-25 |
Family
ID=86647467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021192604A Pending JP2023079242A (ja) | 2021-11-27 | 2021-11-27 | 低温半田、低温半田の製造方法、および低温半田被覆リード線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2023079242A (enExample) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100743240B1 (ko) * | 2006-03-16 | 2007-07-27 | 희성소재 (주) | 저온 납땜용 무연합금 |
| US20150037087A1 (en) * | 2013-08-05 | 2015-02-05 | Senju Metal Industry Co., Ltd. | Lead-Free Solder Alloy |
| WO2015111587A1 (ja) * | 2014-01-24 | 2015-07-30 | 新日鉄住金マテリアルズ株式会社 | 太陽電池用インターコネクタ及び太陽電池モジュール |
| JP2016026884A (ja) * | 2014-07-02 | 2016-02-18 | 住友金属鉱山株式会社 | 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト |
| JP2016165751A (ja) * | 2015-03-10 | 2016-09-15 | 住友金属鉱山株式会社 | ＰｂフリーＩｎ系はんだ合金 |
| CN106216872B (zh) * | 2016-08-11 | 2019-03-12 | 北京康普锡威科技有限公司 | 一种SnBiSb系低温无铅焊料及其制备方法 |
| EP3292943A1 (en) * | 2016-09-12 | 2018-03-14 | Interflux Electronics N.V. | Lead-free solder alloy comprising sn, bi and at least one of p, mn, cu, zn, sb and its use for soldering an electronic component to a substrate |
| JP2018079480A (ja) * | 2016-11-14 | 2018-05-24 | 住友金属鉱山株式会社 | 低温用のＢｉ−Ｉｎ−Ｓｎ系はんだ合金、それを用いた電子部品実装基板及びその実装基板を搭載した装置 |
| CN108546846A (zh) * | 2018-03-05 | 2018-09-18 | 西安理工大学 | 一种光伏焊带用低熔点无铅钎料合金及其制备方法 |
| JP6477965B1 (ja) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
| TWI817020B (zh) * | 2019-07-12 | 2023-10-01 | 日商亞特比目有限公司 | SnZn焊料及其製造方法 |
-
2021
- 2021-11-27 JP JP2021192604A patent/JP2023079242A/ja active Pending
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