JP2023012133A5 - - Google Patents

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Publication number
JP2023012133A5
JP2023012133A5 JP2021115607A JP2021115607A JP2023012133A5 JP 2023012133 A5 JP2023012133 A5 JP 2023012133A5 JP 2021115607 A JP2021115607 A JP 2021115607A JP 2021115607 A JP2021115607 A JP 2021115607A JP 2023012133 A5 JP2023012133 A5 JP 2023012133A5
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JP
Japan
Prior art keywords
conductor pattern
circuit module
module according
semiconductor element
substrate
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JP2021115607A
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English (en)
Japanese (ja)
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JP2023012133A (ja
JP7693428B2 (ja
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Priority to JP2021115607A priority Critical patent/JP7693428B2/ja
Priority claimed from JP2021115607A external-priority patent/JP7693428B2/ja
Publication of JP2023012133A publication Critical patent/JP2023012133A/ja
Publication of JP2023012133A5 publication Critical patent/JP2023012133A5/ja
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Publication of JP7693428B2 publication Critical patent/JP7693428B2/ja
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JP2021115607A 2021-07-13 2021-07-13 回路モジュール及び電子機器 Active JP7693428B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021115607A JP7693428B2 (ja) 2021-07-13 2021-07-13 回路モジュール及び電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021115607A JP7693428B2 (ja) 2021-07-13 2021-07-13 回路モジュール及び電子機器

Publications (3)

Publication Number Publication Date
JP2023012133A JP2023012133A (ja) 2023-01-25
JP2023012133A5 true JP2023012133A5 (cg-RX-API-DMAC7.html) 2024-07-19
JP7693428B2 JP7693428B2 (ja) 2025-06-17

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JP2021115607A Active JP7693428B2 (ja) 2021-07-13 2021-07-13 回路モジュール及び電子機器

Country Status (1)

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JP (1) JP7693428B2 (cg-RX-API-DMAC7.html)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3181036B2 (ja) * 1998-05-29 2001-07-03 京セラ株式会社 高周波用パッケージの実装構造
JP2001230605A (ja) * 2000-02-17 2001-08-24 Toyota Central Res & Dev Lab Inc 高周波伝送線路
JP2006339293A (ja) * 2005-05-31 2006-12-14 Sanyo Electric Co Ltd 回路モジュール
JP2013214578A (ja) * 2012-03-30 2013-10-17 Ibiden Co Ltd 配線板及びその製造方法
JP5939137B2 (ja) * 2012-11-14 2016-06-22 富士ゼロックス株式会社 多層配線基板
JP6449760B2 (ja) * 2015-12-18 2019-01-09 ルネサスエレクトロニクス株式会社 半導体装置
JP6665704B2 (ja) * 2016-06-23 2020-03-13 富士通株式会社 半導体装置及びその製造方法
JP6744202B2 (ja) * 2016-12-06 2020-08-19 ルネサスエレクトロニクス株式会社 半導体装置
JP2018181967A (ja) * 2017-04-07 2018-11-15 キヤノン株式会社 電子機器
JP2019040925A (ja) * 2017-08-22 2019-03-14 キヤノン株式会社 プリント回路板、プリント配線板及び電子機器
KR102580836B1 (ko) * 2018-11-14 2023-09-20 삼성전기주식회사 인터포저와 이를 포함하는 패키지 구조물

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