JP2023003133A - Processing device - Google Patents

Abstract

To provide a processing device which enables reduction of consumption of air and efficient removal of water droplets to prevent scattering of water when water droplets adhering to a cleaned workpiece are removed.SOLUTION: A processing device causes a holding surface 211 of a chuck table 2 to communicate with a suction source 222 to turn the holding surface 211 into a dry state, and places water 120, remaining on a lower surface 102 of a workpiece 10 cleaned by a lower surface cleaning mechanism and held by a carry-out mechanism 63, in contact with the holding surface 211. Then, the processing device causes capillary phenomenon to act to absorb the water from the holding surface 211 to a porous plate 21 and thereby removes the water remaining on the lower surface 102.SELECTED DRAWING: Figure 6

Description

The present invention has a function of cleaning a workpiece using a cleaning liquid.

In the grinding apparatus, the upper surface of the workpiece whose lower surface is suction-held by the chuck table is ground by the grinding wheel. After the grinding is finished, the conveying pad holds the upper surface of the workpiece and carries it out, supplies cleaning water to the lower surface of the workpiece, and cleans the workpiece using a brush (see, for example, Patent Document 1). Water droplets adhering to the bottom surface of the workpiece are removed by blowing air toward the bottom surface of the workpiece. After that, the workpiece is transported to the spinner cleaning mechanism, the lower surface of the workpiece is held by suction on the spinner table and rotated, and high-pressure cleaning water is jetted onto the upper surface of the workpiece to clean the upper surface. Reference 2).

JP-A-2003-045841 JP 2010-167519 A

However, blowing air onto the workpiece to remove the water droplets on the bottom surface consumes a large amount of air, and it takes a long time to process it. In addition, the water droplets blown off by the jet of air may adhere to and damage other parts in the apparatus.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce air consumption and efficiently remove water droplets to prevent scattering of water droplets.

The present invention includes a chuck table for sucking and holding the lower surface of a workpiece on the holding surface of the upper surface of a porous plate, a machining mechanism for machining the workpiece sucked and held by the holding surface, and a workpiece from the holding surface. A processing apparatus comprising: a carry-out mechanism for carrying out a workpiece; a lower surface cleaning mechanism for supplying cleaning water to the lower surface of the workpiece held by the carrying-out mechanism to clean the lower surface; and a controller, wherein the controller controls the workpiece. cleaning the lower surface of the workpiece held by the carry-out mechanism by the lower surface cleaning mechanism; connecting the holding surface to a suction source to dry the holding surface; The water remaining on the lower surface of the workpiece held by the carry-out mechanism is brought into contact with the holding surface to cause capillary action to be absorbed by the porous plate from the holding surface, thereby removing the water remaining on the lower surface. Control things and things.
In this processing apparatus, the chuck table may be rotated around the center of the holding surface to dry the holding surface.
This processing apparatus is provided with an upper surface washing mechanism for supplying washing water to the upper surface of the workpiece held on the holding surface of the chuck table to wash the upper surface, and the unloading mechanism is provided with the entire upper surface of the workpiece. a carrying-out pad made of a porous plate having a first suction surface on the bottom surface capable of sucking the material; connecting the first suction surface to a suction source to bring the first suction surface into a dry state; contacting the first suction surface with water remaining on the upper surface of the workpiece washed by the upper surface washing mechanism; A phenomenon may be applied to cause absorption by the porous plate having the first suction surface, and removal of water remaining on the upper surface may be controlled.
This processing apparatus includes an upper surface cleaning mechanism for cleaning the upper surface of the workpiece held on the holding surface of the chuck table, and a second suction surface on the lower surface of the porous plate capable of sucking the entire upper surface of the workpiece. a carrying-in mechanism for carrying a workpiece sucked and held by the carrying-in pad into the holding surface, wherein the control unit moves the upper surface of the workpiece held on the holding surface to the upper surface of the workpiece. cleaning by a cleaning mechanism; connecting the second suction surface to a suction source to dry the second suction surface; and removing water remaining on the upper surface of the workpiece cleaned by the upper surface cleaning mechanism. contacting the second suction surface to cause capillary action to be absorbed by the porous plate having the second suction surface to remove water remaining on the upper surface; may be controlled by sucking and holding the workpiece and separating the workpiece from the holding surface.

In the present invention, the water remaining on the lower surface of the workpiece is brought into contact with the holding surface of the chuck table, and capillary action is caused to absorb the cleaning water from the holding surface into the porous plate, thereby removing water droplets remaining on the lower surface. As a result, the lower surface of the workpiece does not need to be blown with air, the lower surface of the workpiece can be dried in a short period of time, and water droplets do not scatter.
The suction surface of the carry-out mechanism or the carry-in mechanism is brought into contact with the water remaining on the upper surface of the workpiece, causing capillary action to be absorbed by the porous plate having the suction surface, thereby removing the water remaining on the upper surface of the workpiece. It is possible to dry the upper surface of the object to be processed in a short time without air blowing the upper surface of the object, and the splashing of water droplets can be prevented.

It is a perspective view which shows an example of a processing apparatus. FIG. 4 is a cross-sectional view showing an example of a carry-out mechanism; 4 is a cross-sectional view showing an example of a chuck table; FIG. FIG. 4 is a cross-sectional view showing a state in which the upper surface of the workpiece is washed using the upper surface washing mechanism; FIG. 4 is a cross-sectional view showing a state in which washing water on the upper surface of a workpiece is absorbed using a carry-out mechanism or a carry-in mechanism; FIG. 5 is a cross-sectional view showing a state in which the chuck table is used to absorb cleaning water on the lower surface of the workpiece; FIG. 4 is a cross-sectional view showing a state in which washing water has been removed from the lower surface of the workpiece;

A grinding apparatus 1 shown in FIG. 1 is a type of processing apparatus, and includes a chuck table 2 that holds a workpiece by suction, a processing mechanism 3 that grinds the workpiece held on the chuck table 2, and a processing mechanism 3. A processing feed mechanism 4 for feeding for grinding is provided.

A front portion of the grinding apparatus 1 is provided with a first cassette 51 that stores a workpiece before grinding and a second cassette 52 that stores a workpiece after grinding, arranged side by side in the X-axis direction. In the vicinity of the first cassette 51 and the second cassette 52 , a robot 53 is provided that takes out the workpiece before grinding from the first cassette 51 and stores the ground workpiece in the second cassette 52 . The robot 53 includes an arm portion 54 that can move vertically and horizontally, and a hand 55 attached to the tip of the arm portion 54 .

In the movable range of the hand 55, an alignment unit 61 for aligning the workpiece to a predetermined position and a spinner cleaning mechanism 62 for spinner cleaning the workpiece after grinding are provided.
The positioning unit 61 is composed of a temporary placement table 611 on which the workpiece is temporarily placed, and a plurality of positioning pins 612 for aligning the workpiece placed on the temporary placement table 611 at a predetermined position. ing.
The spinner cleaning mechanism 62 includes a spinner table 621 that holds and rotates a workpiece, and a nozzle 622 that ejects water and air onto the workpiece. The spinner table 621 has a porous plate and can hold the workpiece by suction.

In the vicinity of the spinner cleaning mechanism 62, a carrying-out mechanism 63 for carrying out the workpiece from the chuck table 2 to the spinner table 621 is provided. As shown in FIG. 2, the carry-out mechanism 63 includes a carry-out pad 631 made of a porous plate, the lower surface of which serves as a first suction surface 632 . The first suction surface 632 can suck the entire upper surface of the workpiece. The carry-out pad 631 is connected to a suction source 634 via an open/close valve 633 and connected to an air source 636 via an open/close valve 635 .

In the vicinity of the carry-out mechanism 63, a bottom surface cleaning mechanism 71 is provided for supplying cleaning water to the bottom surface of the workpiece after grinding to clean the bottom surface. The lower surface cleaning mechanism 71 has a brush 711 having a length equal to or longer than the diameter of the workpiece. The brush 711 is driven by a motor 712 and is rotatable.

A carrying-in mechanism 64 for carrying the workpiece from the temporary placement table 611 to the chuck table 2 is arranged near the positioning unit 61 . The carrying-in mechanism 64 has the same structure as the carrying-out mechanism 63, as shown in FIG. be. The carry-in pad 641 is connected to a suction source 644 via an open/close valve 643 and connected to an air source 646 via an open/close valve 645 .

The chuck table 2 is rotatable around a rotating shaft 20 in the Z-axis direction and horizontally movable in the Y-axis direction. The chuck table 2 has a porous plate 21 as shown in FIG. The porous plate 21 is connected to a suction source 222 through an opening/closing valve 221 and to an air source 224 through an opening/closing valve 223 . The upper surface of the porous plate 21 serves as a holding surface 211 for holding the workpiece. The porous plate 21 is supported by a frame 23 .

Above the movement path of the chuck table 2 in the Y-axis direction, an upper surface cleaning mechanism 72 is arranged to supply cleaning water to the upper surface of the workpiece to clean it. The upper surface cleaning mechanism 72 includes a brush 721, a shaft portion 722 connected to the brush 721, and a motor 723 that rotates the shaft portion 722, and is movable up and down. Note that the upper surface cleaning mechanism 72 can also be used to clean the holding surface 211 of the chuck table 2 .

The processing mechanism 3 includes a spindle 31 that rotates around a rotation axis 30 in the Z-axis direction, a housing 32 that rotatably supports the spindle 31, a motor 33 that rotates the spindle 31, and a lower end of the spindle 31. It consists of a mount 34 and a grinding wheel 35 attached to the mount 34 . The grinding wheel 35 is composed of a base 351 mounted on the mount 34 and a plurality of grinding wheels 352 annularly fixed to the lower surface of the base 351 .

The processing feed mechanism 4 includes a ball screw 41 that rotates around a rotation axis 40 in the Z-axis direction, a pair of guide rails 42 that are arranged parallel to the ball screw 41, a motor 43 that rotates the ball screw 41, and the ball screw 41. A lift plate 44 having a threaded nut inside and a side portion of which slides on the guide rail 42 , and a holder 45 connected to the lift plate 44 and supporting the processing mechanism 3 are provided.

The grinding device 1 includes a control unit 8 that controls the operation of each part provided in the grinding device 1 .

In the grinding apparatus 1 shown in FIG. 1 , the robot 53 takes out the workpiece before machining from the first cassette 51 and places it on the temporary placement table 611 . By moving the positioning pin 612 toward the center of the temporary placement table 611, the workpiece is positioned at a fixed position.

Next, the chuck table 2 is positioned on the -Y direction side, and the upper surface of the workpiece is sucked and held by the second suction surface 642 of the loading mechanism 64 shown in FIG. , the lower surface of the workpiece is held by suction on the holding surface 211 of the chuck table 2 .

After that, the chuck table 2 moves in the +Y direction, and the workpiece is positioned below the machining mechanism 3 . Then, the motor 33 rotates the grinding wheel 35, and the processing feed mechanism 4 lowers the processing mechanism 3 to bring the rotating grinding wheel 352 into contact with the upper surface of the workpiece for grinding. Then, when the workpiece is formed to have a predetermined thickness, the grinding is finished.

After finishing the grinding, the chuck table 2 moves in the -Y direction, and the workpiece is positioned below the upper surface cleaning mechanism 72 . 4, the chuck table 2 is rotated, and the motor 723 rotates and lowers the brush 721 to contact the upper surface 101 of the workpiece 10 after grinding under the control of the control unit 8, as shown in FIG. and wash the upper surface 101 .

After the upper surface 101 has been washed, under the control of the control unit 8, the open/close valve 643 of the carry-out mechanism 63 shown in FIG. is closed to cut off the air source 636 and the first suction surface 632, a suction force is applied to the first suction surface 632, and the first suction surface 632 is dried.

Next, under the control of the control unit 8, as shown in FIG. 5, the first suction surface 632 of the carry-out mechanism 63 is brought closer to the upper surface 101 of the workpiece 10 sucked and held on the chuck table 2, but not Keep in contact. Then, the first suction surface 632 is brought into contact with the water droplets 110 of the washing water adhering to the upper surface 101 of the workpiece 10, and the porous plate of the carry-out pad 631 in a dry state causes a capillary phenomenon to cause the first suction surface to A suction force for sucking the water droplets 110 is applied to the carry-out pad 631 having 632 , and the water droplets 110 remaining on the upper surface 101 are sucked and removed from the upper surface 101 of the workpiece 10 .

It should be noted that the cleaning water droplets 110 adhering to the upper surface 101 can also be removed by suction using the carrying-in mechanism 64 having a porous plate. In this case, similarly, under the control of the control unit 8, the upper surface cleaning mechanism 72 cleans the upper surface 101 of the workpiece 10, the second suction surface 642 of the loading mechanism 64 is dried, and the second suction surface 642 is washed. The cleaning water is removed by suction by bringing it into contact with water droplets 110 to cause capillary action.

After the water droplets on the upper surface 101 of the workpiece 10 are removed by the carry-out mechanism 63 or the carry-in mechanism 64 as described above, the workpiece 10 is removed by the first suction surface 632 of the carry-out mechanism 63 under the control of the control unit 8 . is held by suction, the workpiece 10 is separated from the holding surface 211 of the chuck table 2, and the workpiece 10 is moved above the lower surface cleaning mechanism 71 shown in FIG. While supplying cleaning water to the lower surface 102 of the workpiece 10 , the motor 712 rotates the brush 711 and contacts the lower surface 102 of the workpiece 10 to clean the lower surface 102 .

After the cleaning is completed, the unloading mechanism 63 moves the workpiece 10 above the chuck table 2 under the control of the control unit 8 . Then, as shown in FIG. 6, the opening/closing valve 221 of the chuck table 2 is opened to communicate with the suction source 222, and the opening/closing valve 223 is closed to cut off the air source 224, thereby applying a suction force to the holding surface 211 and applying a suction force to the chuck table. The second porous plate 21 is dried. In this dry state, droplets 120 of cleaning water remaining on the lower surface 102 of the workpiece 10 sucked and held by the carry-out mechanism 63 are brought into contact with the holding surface 211 . Then, the washing water is absorbed by the porous plate 21 through the holding surface 211 due to capillary action, and as shown in FIG. After the water droplets 120 are removed, the chuck table 2 is rotated around the center of the holding surface 211 to dry the holding surface 211 .
The chuck table 2 may be rotated when the holding surface 211 is brought into communication with the suction source 222 to dry the porous plate 2 .
The porous plate 2 may be dried by injecting air onto the holding surface 211 . For example, when a two-fluid nozzle for ejecting two fluids is provided on the holding surface 211 , only air is ejected from the two-fluid nozzle and the holding surface 211 is communicated with the suction source 222 .

When the water droplets 120 on the lower surface 102 are thus removed, the carry-out mechanism 63 conveys the workpiece 10 to the spinner table 621 shown in FIG. As the spinner table 621 holding the workpiece 10 rotates, washing water is ejected from the nozzle 622 to wash the upper surface 101 . Further, the spinner table 621 is rotated and high-pressure air is jetted from the nozzle 622 to dry the upper surface 101 . The dried work piece 10 is accommodated in the second cassette 52 by the robot 53 .

When the spinner table 621 is formed of a porous plate and the workpiece 10 is held on the lower surface 102 of the workpiece 10 on the spinner table 621, if water adheres to the lower surface 102 of the workpiece 10, the porous The plate absorbs the water on the bottom surface 102 of the workpiece 10 , and when the workpiece 10 after washing is separated from the spinner table 621 , the water absorbed by the porous plate is spouted out and the bottom surface of the workpiece 10 is removed. 102 may get wet. When the workpiece 10 in such a wet state is stored in the second cassette 52, the surrounding dust adheres to the workpiece 10 and makes the workpiece 10 dirty. However, by removing the water droplets attached to the upper surface 101 and the lower surface 102 of the workpiece 10, the water droplets are removed from the workpiece stored in the second cassette 52. It is possible to reduce the risk of dust adhering.

1: Grinding device 2: Chuck table 20: Rotating shaft 21: Porous plate 211: Holding surface 221: Open/close valve 222: Suction source 223: Open/close valve 224: Air source 23: Frame 3: Processing mechanism 30: Rotating shaft 31: Spindle 32: Housing 33: Motor 34: Mount 35: Grinding Wheel 351: Base 352: Grinding Wheel 4: Processing Feed Mechanism 40: Rotary Axis 41: Ball Screw 42: Guide Rail 43: Motor 44: Elevating Plate 45: Holder 51: First cassette 52: Second cassette 53: Robot 54: Arm part 55: Hand 61: Alignment part 611: Temporary placement table 612: Positioning pin 62: Spinner cleaning mechanism 621: Spinner table 622: Nozzle 63: Carry-out mechanism 631: Unloading pad 632: First suction surface 633: Opening/closing valve 634: Suction source 635: Opening/closing valve 636: Air source 64: Loading mechanism 641: Carrying-in pad 642: Second suction surface 643: Opening/closing valve 644: Suction source 645: Opening/closing valve 646: Air source 71: Lower surface cleaning mechanism 711: Brush 712: Motor 72: Upper surface cleaning mechanism 721: Brush 722: Shaft 723: Motor 8: Control unit 10: Work piece 101: Upper surface 102: Lower surface 110, 120: Water droplets

Claims (4)

A chuck table for sucking and holding the lower surface of the workpiece on the holding surface of the upper surface of the porous plate, a processing mechanism for machining the workpiece sucked and held by the holding surface, and a carrying-out mechanism for carrying out the workpiece from the holding surface. a lower surface cleaning mechanism for supplying cleaning water to the lower surface of the workpiece held by the carry-out mechanism to clean the lower surface; and a control unit, wherein
The control unit
cleaning the lower surface of the workpiece held by the carry-out mechanism by the lower surface cleaning mechanism;
Communicating the retaining surface with a source of suction to dry the retaining surface;
The water remaining on the lower surface of the workpiece which has been washed by the lower surface washing mechanism and is held by the carry-out mechanism is brought into contact with the holding surface to cause capillary action to be absorbed by the porous plate from the holding surface. A processing device that controls and removes residual water on the underside. 2. The processing apparatus according to claim 1, wherein the chuck table is rotated around the center of the holding surface to dry the holding surface. an upper surface washing mechanism for supplying washing water to the upper surface of the workpiece held on the holding surface of the chuck table to wash the upper surface;
The carry-out mechanism includes a carry-out pad made of a porous plate having a first suction surface on the lower surface capable of sucking the entire upper surface of the workpiece,
The control unit
cleaning the upper surface of the workpiece held on the holding surface by the upper surface cleaning mechanism;
communicating the first suction surface to a suction source to dry the first suction surface;
The water remaining on the upper surface of the workpiece washed by the upper surface washing mechanism is brought into contact with the first suction surface, causes capillary action, is absorbed by the porous plate having the first suction surface, and remains on the upper surface. 2. The processing apparatus according to claim 1, which controls removing the water. It has an upper surface cleaning mechanism for cleaning the upper surface of the workpiece held on the holding surface of the chuck table, and a loading pad having a second suction surface on the lower surface of the porous plate capable of sucking the entire upper surface of the workpiece. a loading mechanism for loading the workpiece sucked and held by the loading pad into the holding surface;
The control unit
cleaning the upper surface of the workpiece held on the holding surface by the upper surface cleaning mechanism;
connecting the second suction surface to a suction source to dry the second suction surface;
Water remaining on the upper surface of the workpiece cleaned by the upper surface cleaning mechanism is brought into contact with the second suction surface, causes capillary action, is absorbed by the porous plate having the second suction surface, and is absorbed by the upper surface. removing residual water;
2. The processing apparatus according to claim 1, wherein said carry-out mechanism sucks and holds the upper surface of the workpiece and separates the workpiece from the holding surface.

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