JP2023002753A - 光モジュール - Google Patents
光モジュール Download PDFInfo
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- JP2023002753A JP2023002753A JP2022171363A JP2022171363A JP2023002753A JP 2023002753 A JP2023002753 A JP 2023002753A JP 2022171363 A JP2022171363 A JP 2022171363A JP 2022171363 A JP2022171363 A JP 2022171363A JP 2023002753 A JP2023002753 A JP 2023002753A
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- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
- G02B27/102—Beam splitting or combining systems for splitting or combining different wavelengths for generating a colour image from monochromatic image signal sources
- G02B27/104—Beam splitting or combining systems for splitting or combining different wavelengths for generating a colour image from monochromatic image signal sources for use with scanning systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
- H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3129—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM] scanning a light beam on the display screen
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/315—Modulator illumination systems
- H04N9/3164—Modulator illumination systems using multiple light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Semiconductor Lasers (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
Description
光モジュールにおいては、信頼性が重要である。また、光モジュールは、様々な環境温度のもとで使用される場合がある。そのため、光モジュールにおいては、温度変化に対する動作の安定性が求められている。
本開示の光モジュールによれば、信頼性および温度変化に対する動作の安定性に優れた光モジュールを提供することができる。
最初に本開示の実施態様を列記して説明する。本開示の光モジュールは、光を形成する光形成部と、光形成部を取り囲み、光形成部を封止する保護部材と、を備える。光形成部は、電子温度調整モジュールを含むベース部材と、ベース部材上に配置される複数のレーザダイオードと、ベース部材上に配置され、複数のレーザダイオードからの光を合波するフィルタと、ベース部材上に配置され、フィルタにより合波された光のビーム形状を整形するビーム整形部と、ベース部材上に配置され、ビーム整形部で整形された光を走査する走査ミラーを含むMEMSと、を含む。保護部材は、ベース体と、ベース体に対して溶接された蓋部と、を含む。
次に、本開示にかかる光モジュールの実施の形態を、図面を参照しつつ説明する。以下の図面において同一または相当する部分には同一の参照番号を付しその説明は繰返さない。
まず、図1~図6を参照して実施の形態1について説明する。図1は、実施の形態1における光モジュールの構造を示す概略斜視図である。図2は、図1とは異なる視点から見た光モジュールの構造を示す概略斜視図である。図3は、図1のキャップ40を取り外した状態に対応する斜視図である。図4は、図2のキャップ40を取り外した状態に対応する斜視図である。図5は、キャップ40を断面にて、他の部品を平面視にて示したX-Y平面における概略図である。図6は、キャップ40を断面にて、他の部品を平面視にて示したX-Z平面における概略図である。
次に、図10~図12を参照して、他の実施の形態である実施の形態2について説明する。図10は、キャップを取り外した状態における実施の形態2の光モジュールの構造を示す概略斜視図であって、実施の形態1の図3に対応する。図11は、キャップを取り外した状態における実施の形態2の光モジュールの構造を示す概略斜視図であって、実施の形態1の図4に対応する。図12は、実施の形態2における光モジュールの構造を示す概略図であって、実施の形態1の図5に対応する。
次に、図13~図16を参照して、他の実施の形態である実施の形態3について説明する。図13は、キャップを取り外した状態における実施の形態3の光モジュールの構造を示す概略斜視図であって、実施の形態1の図3に対応する。図14は、キャップを取り外した状態における実施の形態3の光モジュールの構造を示す概略斜視図であって、実施の形態1の図4に対応する。図15は、実施の形態3における光モジュールの構造を示す概略図であって、実施の形態1の図5に対応する。図16は、実施の形態3における光モジュールの構造を示す概略図であって、光モジュール1をX軸方向に沿った方向から見た図に対応する。図16は、キャップ40を断面にて、他の部品を平面視にて示したY-Z平面における概略図である。
Claims (5)
- 光を形成する光形成部と、
前記光形成部を取り囲み、前記光形成部を封止する保護部材と、を備え、
前記光形成部は、
電子温度調整モジュールを含むベース部材と、
前記ベース部材上に配置されるレーザダイオードと、
前記ベース部材上に配置され、前記レーザダイオードからの光をコリメート光に変換するレンズと、
前記ベース部材上に配置され、前記コリメート光を走査する走査ミラーを含むMEMSと、を含み、
前記保護部材は、
ベース体と、
前記ベース体に取り付けられた蓋部と、を含み、
前記電子温度調整モジュールによって、前記MEMSの温度が調整される、光モジュール。 - 前記MEMSは圧電MEMSである、請求項1に記載の光モジュール。
- 前記レーザダイオードはACC駆動により制御される、請求項1または請求項2に記載の光モジュール。
- 前記ベース部材は、ベース板をさらに含み、
前記電子温度調整モジュールは、前記ベース体と前記ベース板との間に配置される、請求項1から請求項3のいずれか1項に記載の光モジュール。 - 前記レーザダイオードは、赤色の光を出射する前記レーザダイオード、緑色の光を出射する前記レーザダイオードおよび青色の光を出射する前記レーザダイオードを含む、請求項1から請求項4のいずれか1項に記載の光モジュール。
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JP2018088876 | 2018-05-02 | ||
JP2018088876 | 2018-05-02 | ||
JP2019538459A JP7173017B2 (ja) | 2018-05-02 | 2019-03-05 | 光モジュール |
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JP2019538459A Division JP7173017B2 (ja) | 2018-05-02 | 2019-03-05 | 光モジュール |
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JP2022171363A Pending JP2023002753A (ja) | 2018-05-02 | 2022-10-26 | 光モジュール |
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US (2) | US11245245B2 (ja) |
JP (2) | JP7173017B2 (ja) |
DE (1) | DE112019002260T5 (ja) |
WO (1) | WO2019211943A1 (ja) |
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JP2021089390A (ja) * | 2019-12-05 | 2021-06-10 | 住友電気工業株式会社 | 描画装置および描画システム |
JP7469592B2 (ja) | 2019-12-05 | 2024-04-17 | 日亜化学工業株式会社 | 発光装置 |
DE102021111902A1 (de) | 2021-05-06 | 2022-11-10 | Infineon Technologies Ag | Spiegel-Systeme |
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JP2006332426A (ja) * | 2005-05-27 | 2006-12-07 | Konica Minolta Medical & Graphic Inc | 光源駆動方法、光源駆動回路及び画像形成装置 |
JP2007027471A (ja) * | 2005-07-19 | 2007-02-01 | Fuji Xerox Co Ltd | 半導体レーザ装置およびこれを用いた光送信装置 |
US7834867B2 (en) | 2006-04-11 | 2010-11-16 | Microvision, Inc. | Integrated photonics module and devices using integrated photonics modules |
JP2008060339A (ja) * | 2006-08-31 | 2008-03-13 | Fuji Xerox Co Ltd | 半導体レーザ装置 |
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JP2014130256A (ja) * | 2012-12-28 | 2014-07-10 | Jvc Kenwood Corp | 画像表示装置、画像表示方法及びプログラム |
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2019
- 2019-03-05 WO PCT/JP2019/008542 patent/WO2019211943A1/ja active Application Filing
- 2019-03-05 JP JP2019538459A patent/JP7173017B2/ja active Active
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DE112019002260T5 (de) | 2021-01-14 |
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US11616337B2 (en) | 2023-03-28 |
JPWO2019211943A1 (ja) | 2021-03-25 |
US11245245B2 (en) | 2022-02-08 |
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