JP2022545723A5 - - Google Patents
Info
- Publication number
- JP2022545723A5 JP2022545723A5 JP2022513132A JP2022513132A JP2022545723A5 JP 2022545723 A5 JP2022545723 A5 JP 2022545723A5 JP 2022513132 A JP2022513132 A JP 2022513132A JP 2022513132 A JP2022513132 A JP 2022513132A JP 2022545723 A5 JP2022545723 A5 JP 2022545723A5
- Authority
- JP
- Japan
- Prior art keywords
- heater
- electrostatic chuck
- chuck according
- electrostatic
- diffusion layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/552,790 | 2019-08-27 | ||
| US16/552,790 US11515190B2 (en) | 2019-08-27 | 2019-08-27 | Thermal diffuser for a semiconductor wafer holder |
| PCT/US2020/048159 WO2021041643A1 (en) | 2019-08-27 | 2020-08-27 | Thermal diffuser for a semiconductor wafer holder |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022545723A JP2022545723A (ja) | 2022-10-28 |
| JP2022545723A5 true JP2022545723A5 (https=) | 2023-09-04 |
| JP7673053B2 JP7673053B2 (ja) | 2025-05-08 |
Family
ID=72428372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022513132A Active JP7673053B2 (ja) | 2019-08-27 | 2020-08-27 | 半導体ウェハホルダー用熱拡散板 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US11515190B2 (https=) |
| EP (1) | EP4022672B1 (https=) |
| JP (1) | JP7673053B2 (https=) |
| KR (1) | KR102524609B1 (https=) |
| CN (1) | CN114521288B (https=) |
| MY (1) | MY209515A (https=) |
| TW (1) | TWI830942B (https=) |
| WO (1) | WO2021041643A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11515190B2 (en) * | 2019-08-27 | 2022-11-29 | Watlow Electric Manufacturing Company | Thermal diffuser for a semiconductor wafer holder |
| US11842918B2 (en) * | 2019-10-02 | 2023-12-12 | Canon Kabushiki Kaisha | Wafer chuck, method for producing the same, and exposure apparatus |
| CN115478261B (zh) * | 2021-05-31 | 2025-02-14 | 中微半导体设备(上海)股份有限公司 | 一种气体喷淋头及化学气相沉积设备 |
| JP7848975B2 (ja) * | 2022-06-24 | 2026-04-21 | 新光電気工業株式会社 | 基板固定装置 |
| CN121753540A (zh) * | 2023-08-29 | 2026-03-27 | 日本碍子株式会社 | 晶片载放台及其使用方法 |
| US12583211B2 (en) | 2023-09-22 | 2026-03-24 | Applied Materials, Inc. | Substrate support assembly with multiple discs |
| US12537464B2 (en) | 2023-10-06 | 2026-01-27 | Applied Materials, Inc. | Substrate support assembly with dieletric cooling plate |
| WO2026006191A1 (en) * | 2024-06-24 | 2026-01-02 | Watlow Electric Manufacturing Company | Method for early thermal performance assessment of a heater component |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5155652A (en) * | 1991-05-02 | 1992-10-13 | International Business Machines Corporation | Temperature cycling ceramic electrostatic chuck |
| JP3825277B2 (ja) * | 2001-05-25 | 2006-09-27 | 東京エレクトロン株式会社 | 加熱処理装置 |
| US6535372B2 (en) | 2001-06-20 | 2003-03-18 | Applied Materials, Inc. | Controlled resistivity boron nitride electrostatic chuck apparatus for retaining a semiconductor wafer and method of fabricating the same |
| JP3742349B2 (ja) | 2002-02-15 | 2006-02-01 | 株式会社日立製作所 | プラズマ処理装置 |
| JP2003243490A (ja) | 2002-02-18 | 2003-08-29 | Hitachi High-Technologies Corp | ウエハ処理装置とウエハステージ及びウエハ処理方法 |
| US20050042881A1 (en) * | 2003-05-12 | 2005-02-24 | Tokyo Electron Limited | Processing apparatus |
| US20070065678A1 (en) * | 2003-10-09 | 2007-03-22 | Ko Kyung-Hyun | Electro-static chuck with non-sintered aln and a method of preparing the same |
| US7544251B2 (en) * | 2004-10-07 | 2009-06-09 | Applied Materials, Inc. | Method and apparatus for controlling temperature of a substrate |
| KR20090001685A (ko) * | 2007-05-10 | 2009-01-09 | (주) 컴파스 시스템 | 컴퓨터 신호에 따른 화상을 화면에 출력하는 광고장치 및이에 적합한 광고 방법 |
| US7667944B2 (en) * | 2007-06-29 | 2010-02-23 | Praxair Technology, Inc. | Polyceramic e-chuck |
| JP2009291793A (ja) * | 2008-06-02 | 2009-12-17 | Kuroki Kogyosho:Kk | 構造体の製造法 |
| US20100116788A1 (en) | 2008-11-12 | 2010-05-13 | Lam Research Corporation | Substrate temperature control by using liquid controlled multizone substrate support |
| US20120196242A1 (en) | 2011-01-27 | 2012-08-02 | Applied Materials, Inc. | Substrate support with heater and rapid temperature change |
| AU2012301903B2 (en) | 2011-08-30 | 2015-07-09 | Watlow Electric Manufacturing Company | High definition heater system having a fluid medium |
| JP6077301B2 (ja) | 2012-12-28 | 2017-02-08 | 日本特殊陶業株式会社 | 静電チャック |
| US20170051402A1 (en) | 2015-08-17 | 2017-02-23 | Asm Ip Holding B.V. | Susceptor and substrate processing apparatus |
| US10154542B2 (en) | 2015-10-19 | 2018-12-11 | Watlow Electric Manufacturing Company | Composite device with cylindrical anisotropic thermal conductivity |
| JP6608444B2 (ja) * | 2015-12-28 | 2019-11-20 | 日本碍子株式会社 | 円板状ヒータ及びヒータ冷却板アセンブリ |
| JP6597437B2 (ja) | 2016-03-24 | 2019-10-30 | 住友大阪セメント株式会社 | 静電チャック装置 |
| KR102360248B1 (ko) * | 2016-05-10 | 2022-02-07 | 램 리써치 코포레이션 | 상이한 히터 트레이스 재료를 사용한 적층된 히터 |
| KR20180001685A (ko) * | 2016-06-27 | 2018-01-05 | 세메스 주식회사 | 기판 지지체 및 이를 갖는 베이크 유닛 |
| TWI791558B (zh) * | 2017-07-27 | 2023-02-11 | 美商應用材料股份有限公司 | 用於半導體基板處理室的溫度控制的方法、非暫時性機器可讀儲存媒體以及系統 |
| US11515190B2 (en) * | 2019-08-27 | 2022-11-29 | Watlow Electric Manufacturing Company | Thermal diffuser for a semiconductor wafer holder |
-
2019
- 2019-08-27 US US16/552,790 patent/US11515190B2/en active Active
-
2020
- 2020-08-26 TW TW109129211A patent/TWI830942B/zh active
- 2020-08-27 JP JP2022513132A patent/JP7673053B2/ja active Active
- 2020-08-27 EP EP20768465.5A patent/EP4022672B1/en active Active
- 2020-08-27 MY MYPI2022001099A patent/MY209515A/en unknown
- 2020-08-27 KR KR1020227010171A patent/KR102524609B1/ko active Active
- 2020-08-27 CN CN202080067700.6A patent/CN114521288B/zh active Active
- 2020-08-27 WO PCT/US2020/048159 patent/WO2021041643A1/en not_active Ceased
-
2022
- 2022-11-09 US US17/983,643 patent/US12148650B2/en active Active
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