JP2022526748A5 - - Google Patents

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Publication number
JP2022526748A5
JP2022526748A5 JP2021556496A JP2021556496A JP2022526748A5 JP 2022526748 A5 JP2022526748 A5 JP 2022526748A5 JP 2021556496 A JP2021556496 A JP 2021556496A JP 2021556496 A JP2021556496 A JP 2021556496A JP 2022526748 A5 JP2022526748 A5 JP 2022526748A5
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JP
Japan
Prior art keywords
measurement
parameter
positional
positional displacement
displacement measurement
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JP2021556496A
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English (en)
Japanese (ja)
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JP2022526748A (ja
JP7177949B2 (ja
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Priority claimed from PCT/US2019/047797 external-priority patent/WO2020190318A1/en
Publication of JP2022526748A publication Critical patent/JP2022526748A/ja
Publication of JP2022526748A5 publication Critical patent/JP2022526748A5/ja
Application granted granted Critical
Publication of JP7177949B2 publication Critical patent/JP7177949B2/ja
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JP2021556496A 2019-03-21 2019-08-23 半導体デバイスにおけるパラメタ安定位置ずれ計測改善 Active JP7177949B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962821596P 2019-03-21 2019-03-21
US62/821,596 2019-03-21
PCT/US2019/047797 WO2020190318A1 (en) 2019-03-21 2019-08-23 Parameter-stable misregistration measurement amelioration in semiconductor devices

Publications (3)

Publication Number Publication Date
JP2022526748A JP2022526748A (ja) 2022-05-26
JP2022526748A5 true JP2022526748A5 (enExample) 2022-08-25
JP7177949B2 JP7177949B2 (ja) 2022-11-24

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JP2021556496A Active JP7177949B2 (ja) 2019-03-21 2019-08-23 半導体デバイスにおけるパラメタ安定位置ずれ計測改善

Country Status (6)

Country Link
US (1) US11101153B2 (enExample)
JP (1) JP7177949B2 (enExample)
KR (1) KR102509764B1 (enExample)
CN (1) CN113574643B (enExample)
TW (1) TWI845639B (enExample)
WO (1) WO2020190318A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021206670A1 (en) 2020-04-05 2021-10-14 Kla Corporation Systems and methods for correction of impact of wafer tilt on misregistration measurements
US12165930B2 (en) * 2021-06-03 2024-12-10 Kla Corporation Adaptive modeling misregistration measurement system and method
TWI803262B (zh) * 2022-01-04 2023-05-21 南亞科技股份有限公司 疊置測量及疊置誤差的校正標記
US12002765B2 (en) 2022-01-04 2024-06-04 Nanya Technology Corporation Marks for overlay measurement and overlay error correction
US11796924B2 (en) 2022-01-04 2023-10-24 Nanya Technology Corporation Method for overlay error correction and method for manufacturing a semiconductor device structure with overlay marks
US12487533B2 (en) 2024-01-25 2025-12-02 Kla Corporation Amplitude asymmetry measurements in overlay metrology

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US6064486A (en) * 1998-05-21 2000-05-16 Leland Stanford Junior University Systems, methods and computer program products for detecting the position of a new alignment mark on a substrate based on fitting to sample alignment signals
US6281027B1 (en) * 1999-09-15 2001-08-28 Therma-Wave Inc Spatial averaging technique for ellipsometry and reflectometry
US6462818B1 (en) * 2000-06-22 2002-10-08 Kla-Tencor Corporation Overlay alignment mark design
TW569368B (en) 2001-11-14 2004-01-01 Tokyo Electron Ltd Substrate inspecting apparatus, coating and developing apparatus, and substrate inspecting method
WO2003104929A2 (en) 2002-06-05 2003-12-18 Kla-Tencor Technologies Corporation Use of overlay diagnostics for enhanced automatic process control
JP4072465B2 (ja) * 2003-06-19 2008-04-09 キヤノン株式会社 位置検出方法
US7653890B2 (en) * 2004-04-02 2010-01-26 Cadence Design Systems, Inc. Modeling resolution enhancement processes in integrated circuit fabrication
US20070099097A1 (en) * 2005-11-03 2007-05-03 Samsung Electronics Co., Ltd. Multi-purpose measurement marks for semiconductor devices, and methods, systems and computer program products for using same
CN101063661B (zh) * 2006-04-29 2010-05-12 中芯国际集成电路制造(上海)有限公司 利用微影区域迭对测量仪监控硅单晶外延层层错状况的方法
TWI416096B (zh) * 2007-07-11 2013-11-21 Nova Measuring Instr Ltd 用於監控圖案化結構的性質之方法及系統
US7873585B2 (en) 2007-08-31 2011-01-18 Kla-Tencor Technologies Corporation Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
US8214771B2 (en) 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
WO2014129307A1 (ja) * 2013-02-20 2014-08-28 株式会社 日立ハイテクノロジーズ パターン測定装置、及び半導体計測システム
US10296554B2 (en) * 2013-03-01 2019-05-21 Nanometrics Incorporated Correction of angular error of plane-of-incidence azimuth of optical metrology device
CN103398666B (zh) * 2013-05-27 2015-12-23 电子科技大学 一种用于双层周期性微结构的层间错位测试方法
US9383661B2 (en) * 2013-08-10 2016-07-05 Kla-Tencor Corporation Methods and apparatus for determining focus
WO2015031337A1 (en) * 2013-08-27 2015-03-05 Kla-Tencor Corporation Removing process-variation-related inaccuracies from scatterometry measurements
US10152654B2 (en) * 2014-02-20 2018-12-11 Kla-Tencor Corporation Signal response metrology for image based overlay measurements
CN112859540B (zh) * 2015-05-19 2024-10-18 科磊股份有限公司 成像计量目标及方法
US10504759B2 (en) * 2016-04-04 2019-12-10 Kla-Tencor Corporation Semiconductor metrology with information from multiple processing steps

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