JP2022507782A5 - - Google Patents
Info
- Publication number
- JP2022507782A5 JP2022507782A5 JP2021527838A JP2021527838A JP2022507782A5 JP 2022507782 A5 JP2022507782 A5 JP 2022507782A5 JP 2021527838 A JP2021527838 A JP 2021527838A JP 2021527838 A JP2021527838 A JP 2021527838A JP 2022507782 A5 JP2022507782 A5 JP 2022507782A5
- Authority
- JP
- Japan
- Prior art keywords
- grounding
- bowl
- support pedestal
- conductive mesh
- annular liner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862770547P | 2018-11-21 | 2018-11-21 | |
| US62/770,547 | 2018-11-21 | ||
| PCT/US2019/057949 WO2020106408A1 (en) | 2018-11-21 | 2019-10-24 | Device and method for tuning plasma distribution using phase control |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022507782A JP2022507782A (ja) | 2022-01-18 |
| JP2022507782A5 true JP2022507782A5 (https=) | 2022-11-01 |
| JP7465265B2 JP7465265B2 (ja) | 2024-04-10 |
Family
ID=70727094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021527838A Active JP7465265B2 (ja) | 2018-11-21 | 2019-10-24 | 位相制御を使用してプラズマ分布を調整するためのデバイス及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11908662B2 (https=) |
| JP (1) | JP7465265B2 (https=) |
| KR (1) | KR102913190B1 (https=) |
| CN (1) | CN112955997B (https=) |
| SG (1) | SG11202103597SA (https=) |
| TW (1) | TWI835901B (https=) |
| WO (1) | WO2020106408A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023069211A1 (en) * | 2021-10-18 | 2023-04-27 | Lam Research Corporation | Systems and methods for determining a phase difference between rf signals provided to electrodes |
| US12500106B2 (en) * | 2022-05-03 | 2025-12-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing tool and methods of operation |
| US20240331979A1 (en) * | 2023-04-03 | 2024-10-03 | Tokyo Electron Limited | Apparatus and Methods for Plasma Processing |
| US20260011900A1 (en) * | 2024-07-06 | 2026-01-08 | Applied Materials, Inc. | Wideband tem to tm01 mode converter for microwave plasma systems |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4557819A (en) * | 1984-07-20 | 1985-12-10 | Varian Associates, Inc. | System for igniting and controlling a wafer processing plasma |
| JPH0627341B2 (ja) | 1988-02-05 | 1994-04-13 | 株式会社半導体エネルギー研究所 | 薄膜形成方法 |
| JPH0747820B2 (ja) * | 1989-09-22 | 1995-05-24 | 株式会社日立製作所 | 成膜装置 |
| JPH05205898A (ja) | 1991-07-24 | 1993-08-13 | Tokyo Electron Yamanashi Kk | プラズマ処理装置 |
| US5314603A (en) | 1991-07-24 | 1994-05-24 | Tokyo Electron Yamanashi Limited | Plasma processing apparatus capable of detecting and regulating actual RF power at electrode within chamber |
| JPH0613196A (ja) | 1992-06-25 | 1994-01-21 | Matsushita Electric Ind Co Ltd | プラズマ発生方法および発生装置 |
| KR100302167B1 (ko) * | 1993-11-05 | 2001-11-22 | 히가시 데쓰로 | 플라즈마처리장치및플라즈마처리방법 |
| JP3328625B2 (ja) | 1994-04-28 | 2002-09-30 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US5885356A (en) * | 1994-11-30 | 1999-03-23 | Applied Materials, Inc. | Method of reducing residue accumulation in CVD chamber using ceramic lining |
| US5846332A (en) * | 1996-07-12 | 1998-12-08 | Applied Materials, Inc. | Thermally floating pedestal collar in a chemical vapor deposition chamber |
| JPH10237657A (ja) * | 1997-02-26 | 1998-09-08 | Furontetsuku:Kk | プラズマ処理装置 |
| TW507256B (en) | 2000-03-13 | 2002-10-21 | Mitsubishi Heavy Ind Ltd | Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus |
| JP4672169B2 (ja) | 2001-04-05 | 2011-04-20 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
| US7972467B2 (en) * | 2003-04-17 | 2011-07-05 | Applied Materials Inc. | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor |
| JP4773079B2 (ja) | 2004-11-26 | 2011-09-14 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置の制御方法 |
| US7988815B2 (en) * | 2007-07-26 | 2011-08-02 | Applied Materials, Inc. | Plasma reactor with reduced electrical skew using electrical bypass elements |
| US20090236214A1 (en) * | 2008-03-20 | 2009-09-24 | Karthik Janakiraman | Tunable ground planes in plasma chambers |
| JP5396256B2 (ja) | 2009-12-10 | 2014-01-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| TWI572043B (zh) * | 2010-06-10 | 2017-02-21 | 應用材料股份有限公司 | 具增強的游離及ｒｆ功率耦合的低電阻率鎢ｐｖｄ |
| TW201325326A (zh) | 2011-10-05 | 2013-06-16 | 應用材料股份有限公司 | 電漿處理設備及其基板支撐組件 |
| US10224182B2 (en) | 2011-10-17 | 2019-03-05 | Novellus Systems, Inc. | Mechanical suppression of parasitic plasma in substrate processing chamber |
| US20130284369A1 (en) | 2012-04-26 | 2013-10-31 | Applied Materials, Inc. | Two-phase operation of plasma chamber by phase locked loop |
| US9388494B2 (en) | 2012-06-25 | 2016-07-12 | Novellus Systems, Inc. | Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region |
| US9312106B2 (en) * | 2013-03-13 | 2016-04-12 | Applied Materials, Inc. | Digital phase controller for two-phase operation of a plasma reactor |
| US10125422B2 (en) * | 2013-03-27 | 2018-11-13 | Applied Materials, Inc. | High impedance RF filter for heater with impedance tuning device |
| US9543158B2 (en) * | 2014-12-04 | 2017-01-10 | Lam Research Corporation | Technique to deposit sidewall passivation for high aspect ratio cylinder etch |
| JP5800964B1 (ja) * | 2014-07-22 | 2015-10-28 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法および記録媒体 |
| US10395895B2 (en) | 2015-08-27 | 2019-08-27 | Mks Instruments, Inc. | Feedback control by RF waveform tailoring for ion energy distribution |
| KR102158668B1 (ko) * | 2016-04-22 | 2020-09-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 플라즈마 한정 피쳐들을 갖는 기판 지지 페디스털 |
| US10777386B2 (en) * | 2017-10-17 | 2020-09-15 | Lam Research Corporation | Methods for controlling plasma glow discharge in a plasma chamber |
-
2019
- 2019-10-24 KR KR1020217017429A patent/KR102913190B1/ko active Active
- 2019-10-24 CN CN201980071231.2A patent/CN112955997B/zh active Active
- 2019-10-24 US US16/663,215 patent/US11908662B2/en active Active
- 2019-10-24 SG SG11202103597SA patent/SG11202103597SA/en unknown
- 2019-10-24 JP JP2021527838A patent/JP7465265B2/ja active Active
- 2019-10-24 WO PCT/US2019/057949 patent/WO2020106408A1/en not_active Ceased
- 2019-10-25 TW TW108138595A patent/TWI835901B/zh active
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