JP2022507782A - 位相制御を使用してプラズマ分布を調整するためのデバイス及び方法 - Google Patents
位相制御を使用してプラズマ分布を調整するためのデバイス及び方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title abstract description 17
- 238000009826 distribution Methods 0.000 title description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 92
- 238000010926 purge Methods 0.000 claims description 35
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 abstract description 7
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- 239000000758 substrate Substances 0.000 description 24
- 239000004020 conductor Substances 0.000 description 22
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- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 19
- 229910052786 argon Inorganic materials 0.000 description 18
- 230000003071 parasitic effect Effects 0.000 description 12
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- 229910001026 inconel Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
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- 150000002500 ions Chemical class 0.000 description 3
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- 230000008901 benefit Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
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- 239000000126 substance Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
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- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
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- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
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- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Abstract
Description
本出願は、その全体がここに参照することによって本願に援用される、2018年11月21日出願の米国仮特許出願第62/770,547号の優先権の利益を主張する。
Claims (15)
- 支持面を有する支持ペデスタル、
前記支持ペデスタル内に配置された導電性メッシュ、
前記支持面の反対側に配置された面板、
少なくとも部分的に前記支持ペデスタル及び前記面板によって画定された処理空間、
環状形状を有し、前記処理空間の反対側で前記支持ペデスタルを取り囲む接地ボウルの第1の部分、
前記支持ペデスタルと前記接地ボウルの前記第1の部分の少なくとも一部とを取り囲む環状ライナ、及び
前記面板と前記導電性メッシュとに結合された位相制御回路
を含む、装置。 - 前記位相制御回路が、
位相検出器、
フィードバックコントローラ、及び
位相調整器
を含む、請求項1に記載の装置。 - 位相調整器が、
可変キャパシタ、及び
該可変キャパシタと並列のインダクタ
を含む、請求項2に記載の装置。 - 高周波(RF)ジェネレータ、
前記高周波ジェネレータと前記面板とに結合された第1の増幅器、及び
前記高周波ジェネレータと前記導電性メッシュとに結合された第2の増幅器
をさらに含む、請求項1に記載の装置。 - 前記環状ライナの径方向外側に配置された前記接地ボウルの第2の部分、及び
前記接地ボウルの前記第1の部分と前記接地ボウルの前記第2の部分との間に形成されたパージ間隙であって、該パージ間隙の少なくとも一部が前記環状ライナによって画定されており、該環状ライナが、前記接地ボウルの前記第2の部分の少なくとも一部と前記パージ間隙との間に配置されており、前記パージ間隙の少なくとも一部が前記環状ライナと前記接地ボウルの前記第1の部分との間にある、パージ間隙
をさらに含む、請求項1に記載の装置。 - 前記接地ボウルの前記第1の部分がステンレス鋼含有材料を含み、前記接地ボウルの前記第2の部分がアルミニウム含有材料を含む、請求項5に記載の装置。
- 支持面を有する支持ペデスタル、
前記支持ペデスタル内に配置された導電性メッシュ、
前記支持面の反対側に配置された面板、
少なくとも部分的に前記支持ペデスタル及び前記面板によって画定された処理空間、
環状形状を有し、前記処理空間の反対側で前記支持ペデスタルを取り囲む接地ボウルの第1の部分、
前記支持ペデスタルと前記接地ボウルの前記第1の部分の少なくとも一部とを取り囲む環状ライナ、及び
前記導電性メッシュと前記面板とに結合された可変変圧器
を含む、装置。 - 高周波(RF)ジェネレータ、
前記高周波ジェネレータと前記導電性メッシュとに結合された増幅器、
前記導電性メッシュと前記増幅器との間に配置され、かつ前記導電性メッシュと前記増幅器に結合されたRF整合回路、
前記環状ライナの径方向外側に配置された前記接地ボウルの第2の部分、及び
前記接地ボウルの前記第1の部分と前記接地ボウルの前記第2の部分との間に形成されたパージ間隙であって、該パージ間隙の少なくとも一部が前記接地ボウルの前記第2の部分によって画定されており、前記環状ライナが、前記接地ボウルの前記第2の部分の少なくとも一部と前記パージ間隙との間に配置されており、前記パージ間隙が前記環状ライナと前記接地ボウルの前記第1の部分との間にある、パージ間隙
をさらに含む、請求項7に記載の装置。 - 前記接地ボウルの前記第1の部分がステンレス鋼含有材料を含み、前記接地ボウルの前記第2の部分がアルミニウム含有材料を含む、請求項8に記載の装置。
- 支持面を有する支持ペデスタル、
前記支持ペデスタル内に配置された導電性メッシュ、
前記支持面の反対側に配置された面板、
少なくとも部分的に前記支持ペデスタル及び前記面板によって画定された処理空間、
環状形状を有し、前記処理空間の反対側の前記支持ペデスタルを取り囲む接地ボウルの第1の部分、
前記接地ボウルの前記第1の部分の径方向外側に配置された前記接地ボウルの第2の部分、
前記接地ボウルの前記第2の部分内に形成されたレッジ、
前記支持ペデスタルに隣接して、前記接地ボウルの前記第1の部分と前記接地ボウルの前記第2の部分との間に形成されたパージ間隙、
前記支持ペデスタルと前記接地ボウルの前記第1の部分の少なくとも一部とを取り囲む環状ライナであって、前記レッジ上に配置された環状ライナ、及び
前記面板と前記導電性メッシュとに結合された位相制御回路
を含む、装置。 - 前記位相制御回路が、
位相検出器、
フィードバックコントローラであって、前記面板と前記導電性メッシュとから送信された位相データを使用する、フィードバックコントローラ、及び
位相調整器
を含む、請求項10に記載の装置。 - 前記位相調整器が、
可変キャパシタ、及び
該可変キャパシタと並列のインダクタ
を備えている、請求項11に記載の装置。 - 高周波(RF)ジェネレータ、
前記高周波ジェネレータと前記面板とに結合された第1の増幅器、及び
前記高周波ジェネレータと前記導電性メッシュとに結合された第2の増幅器
をさらに含む、請求項12に記載の装置。 - 前記パージ間隙の少なくとも一部が前記環状ライナと前記接地ボウルの前記第1の部分との間にあり、前記接地ボウルの前記第1の部分がステンレス鋼含有材料を含み、前記接地ボウルの前記第2の部分がアルミニウム含有材料を含む、請求項12に記載の装置。
- 前記環状ライナが酸化アルミニウム含有材料を含む、請求項12に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862770547P | 2018-11-21 | 2018-11-21 | |
US62/770,547 | 2018-11-21 | ||
PCT/US2019/057949 WO2020106408A1 (en) | 2018-11-21 | 2019-10-24 | Device and method for tuning plasma distribution using phase control |
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SG11202103597SA (en) | 2021-06-29 |
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US20200161093A1 (en) | 2020-05-21 |
WO2020106408A1 (en) | 2020-05-28 |
US11908662B2 (en) | 2024-02-20 |
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