JP2022500876A5 - - Google Patents
Info
- Publication number
- JP2022500876A5 JP2022500876A5 JP2021514595A JP2021514595A JP2022500876A5 JP 2022500876 A5 JP2022500876 A5 JP 2022500876A5 JP 2021514595 A JP2021514595 A JP 2021514595A JP 2021514595 A JP2021514595 A JP 2021514595A JP 2022500876 A5 JP2022500876 A5 JP 2022500876A5
- Authority
- JP
- Japan
- Prior art keywords
- shroud
- opening
- process chamber
- wall
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862731950P | 2018-09-16 | 2018-09-16 | |
| US62/731,950 | 2018-09-16 | ||
| US16/569,593 | 2019-09-12 | ||
| US16/569,593 US11270898B2 (en) | 2018-09-16 | 2019-09-12 | Apparatus for enhancing flow uniformity in a process chamber |
| PCT/US2019/051304 WO2020056412A1 (en) | 2018-09-16 | 2019-09-16 | Apparatus for enhancing flow uniformity in a process chamber |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022500876A JP2022500876A (ja) | 2022-01-04 |
| JP2022500876A5 true JP2022500876A5 (https=) | 2022-09-27 |
| JP7480127B2 JP7480127B2 (ja) | 2024-05-09 |
Family
ID=69773137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021514595A Active JP7480127B2 (ja) | 2018-09-16 | 2019-09-16 | プロセスチャンバ内の流れの均一性を高めるための装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11270898B2 (https=) |
| JP (1) | JP7480127B2 (https=) |
| KR (1) | KR102555339B1 (https=) |
| CN (1) | CN112805815B (https=) |
| TW (1) | TWI723540B (https=) |
| WO (1) | WO2020056412A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200286757A1 (en) * | 2019-03-08 | 2020-09-10 | Dsgi Technologies, Inc. | Apparatus for annealing semiconductor integrated circuit wafers |
| KR102783596B1 (ko) | 2024-07-15 | 2025-03-19 | 주식회사 캐이트워크 | 조감도에서의 기초 객체 정보 생성 방법 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174377B1 (en) | 1997-03-03 | 2001-01-16 | Genus, Inc. | Processing chamber for atomic layer deposition processes |
| US5855675A (en) | 1997-03-03 | 1999-01-05 | Genus, Inc. | Multipurpose processing chamber for chemical vapor deposition processes |
| US6537011B1 (en) * | 2000-03-10 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for transferring and supporting a substrate |
| US7011039B1 (en) | 2000-07-07 | 2006-03-14 | Applied Materials, Inc. | Multi-purpose processing chamber with removable chamber liner |
| KR20040033831A (ko) * | 2002-10-16 | 2004-04-28 | 삼성전자주식회사 | 반도체 소자 제조 장치 |
| US8118044B2 (en) | 2004-03-12 | 2012-02-21 | Applied Materials, Inc. | Single workpiece processing chamber with tilting load/unload upper rim |
| US8236105B2 (en) | 2004-04-08 | 2012-08-07 | Applied Materials, Inc. | Apparatus for controlling gas flow in a semiconductor substrate processing chamber |
| US20080110567A1 (en) * | 2006-11-15 | 2008-05-15 | Miller Matthew L | Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution |
| US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
| KR100906392B1 (ko) * | 2007-12-13 | 2009-07-07 | (주)트리플코어스코리아 | 반도체 챔버 라이너 |
| US20090188624A1 (en) | 2008-01-25 | 2009-07-30 | Applied Materials, Inc. | Method and apparatus for enhancing flow uniformity in a process chamber |
| US7699935B2 (en) * | 2008-06-19 | 2010-04-20 | Applied Materials, Inc. | Method and system for supplying a cleaning gas into a process chamber |
| WO2010123877A2 (en) * | 2009-04-21 | 2010-10-28 | Applied Materials, Inc. | Cvd apparatus for improved film thickness non-uniformity and particle performance |
| US8360003B2 (en) * | 2009-07-13 | 2013-01-29 | Applied Materials, Inc. | Plasma reactor with uniform process rate distribution by improved RF ground return path |
| US9443753B2 (en) | 2010-07-30 | 2016-09-13 | Applied Materials, Inc. | Apparatus for controlling the flow of a gas in a process chamber |
| US9679751B2 (en) * | 2012-03-15 | 2017-06-13 | Lam Research Corporation | Chamber filler kit for plasma etch chamber useful for fast gas switching |
| US20140083360A1 (en) * | 2012-09-26 | 2014-03-27 | Applied Materials, Inc. | Process chamber having more uniform gas flow |
| WO2014052388A1 (en) * | 2012-09-26 | 2014-04-03 | Applied Materials, Inc. | An apparatus and method for purging gaseous compounds |
| US9761416B2 (en) | 2013-03-15 | 2017-09-12 | Applied Materials, Inc. | Apparatus and methods for reducing particles in semiconductor process chambers |
| KR20140140418A (ko) * | 2013-05-29 | 2014-12-09 | 삼성디스플레이 주식회사 | 유기층 에칭 장치 및 유기층 에칭 방법 |
| US10010912B2 (en) * | 2013-06-14 | 2018-07-03 | Applied Materials, Inc. | Particle reduction via throttle gate valve purge |
| JP6581602B2 (ja) | 2014-02-06 | 2019-09-25 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 改善されたフローコンダクタンス及び均一性のため軸対称性を可能にするインラインｄｐｓチャンバハードウェア設計 |
| CN104947039B (zh) * | 2014-03-24 | 2017-07-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 隔热挡板及反应腔室 |
-
2019
- 2019-09-12 US US16/569,593 patent/US11270898B2/en active Active
- 2019-09-16 JP JP2021514595A patent/JP7480127B2/ja active Active
- 2019-09-16 KR KR1020217011121A patent/KR102555339B1/ko active Active
- 2019-09-16 WO PCT/US2019/051304 patent/WO2020056412A1/en not_active Ceased
- 2019-09-16 TW TW108133207A patent/TWI723540B/zh active
- 2019-09-16 CN CN201980065400.1A patent/CN112805815B/zh active Active
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